摘要:
A metallic solder rod is provided. The solder rod includes a stop-off at the end so that the solder cannot drip from an opening. The solder rod includes an inner region and an outer region which at least partially surrounds the inner region wherein the inner region includes a different alloy than the outer region. A process for applying solder to a hole in a substrate is also provided.
摘要:
A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 μs and 20 μs and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used.
摘要:
A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 μs and 20 μs and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used.