公开(公告)号：US06882437B2

公开(公告)日：2005-04-19

申请号：US10208379

申请日：2002-07-29

申请人： Alireza Shahdoost Moghaddam ,  Hung Phi Nguyen

发明人： Alireza Shahdoost Moghaddam ,  Hung Phi Nguyen

IPC分类号： G01B11/06 ,  G01B11/28

CPC分类号： G01B11/0641

摘要： The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.

摘要翻译： 通过阴影技术测量晶片，衬底或磁盘的厚度。 光源被定位成在晶片，衬底或磁盘的两侧上通过光束强度的一部分。 检测器测量光束通过晶片，衬底或磁盘后的光束强度。

公开(公告)号：US20220187218A1

公开(公告)日：2022-06-16

申请号：US17685679

申请日：2022-03-03

申请人： Steven W. Meeks ,  Hung Phi Nguyen ,  Alireza Shahdoost Moghaddam

发明人： Steven W. Meeks ,  Hung Phi Nguyen ,  Alireza Shahdoost Moghaddam

IPC分类号： G01N21/958 ,  G01N21/84 ,  G01N21/88 ,  G02B26/10

摘要： An angle independent optical surface inspector capable of generating a light beam, directing the light beam to a sample, and de-scanning a reflected light beam that is reflected from the sample, thereby generating a first de-scanned light beam. The de-scanning is performed at approximately one focal length of a de-scanning lens from an irradiation location where the light beam irradiates the sample. The optical inspector also capable of focusing the first de-scanned light beam, thereby generating a focused light beam, and measuring the location of the focused light beam. The measuring of the location is performed at approximately one focal length of a focusing lens from the focusing lens. The incident angle of the light beam is within ten degrees of Brewster's angle. The focusing is performed by an achromatic lens.