公开(公告)号：US12099148B2

公开(公告)日：2024-09-24

申请号：US17280136

申请日：2020-10-07

Applicant: INTRINSIC INNOVATION LLC

Inventor： Achuta Kadambi ,  Kartik Venkataraman ,  Supreeth Krishna Rao ,  Agastya Kalra

IPC: G06T17/00 ,  G01B11/06 ,  G01B11/24 ,  G01S7/499 ,  G01S13/89 ,  G01S17/87 ,  G01S17/89 ,  G06T7/11 ,  G06T7/521 ,  G06T7/593 ,  G06T7/60 ,  H04N13/243 ,  H04N13/257

CPC classification number: G01S7/499 ,  G01B11/0641 ,  G01B11/24 ,  G01S13/89 ,  G01S17/87 ,  G01S17/89 ,  G06T7/11 ,  G06T7/521 ,  G06T7/593 ,  G06T7/60 ,  G06T17/00 ,  H04N13/243 ,  H04N13/257 ,  G06T2200/08 ,  G06T2207/10016 ,  G06T2207/10024 ,  G06T2207/10028 ,  G06T2207/20081 ,  G06T2207/20084

Abstract: A method of performing surface profilometry includes receiving one or more polarization raw frames of a printed layer of a physical object undergoing additive manufacturing, the one or more polarization raw frames being captured at different polarizations by one or more polarization cameras, extracting one or more polarization feature maps in one or more polarization representation spaces from the one or more polarization raw frames, obtaining a coarse layer depth map of the printed layer, generating one or more surface-normal images based on the coarse layer depth map and the one or more polarization feature maps, and generating a 3D reconstruction of the printed layer based on the one or more surface-normal images.

公开(公告)号：US20230184912A1

公开(公告)日：2023-06-15

申请号：US18079477

申请日：2022-12-12

Applicant: Intrinsic Innovation LLC

Inventor： Achuta Kadambi ,  Ramesh Raskar ,  Kartik Venkataraman ,  Supreeth Krishna Rao ,  Agastya Kalra

IPC: G01S7/499 ,  G06T7/521 ,  G06T7/11 ,  G06T7/593 ,  H04N13/257 ,  H04N13/243 ,  G01B11/24 ,  G01S13/89 ,  G01S17/87 ,  G01S17/89 ,  G06T7/60 ,  G06T17/00 ,  G01B11/06

CPC classification number: G01S7/499 ,  G06T7/521 ,  G06T7/11 ,  G06T7/593 ,  H04N13/257 ,  H04N13/243 ,  G01B11/24 ,  G01S13/89 ,  G01S17/87 ,  G01S17/89 ,  G06T7/60 ,  G06T17/00 ,  G01B11/0641 ,  G06T2200/08 ,  G06T2207/10016 ,  G06T2207/10024 ,  G06T2207/10028 ,  G06T2207/20081 ,  G06T2207/20084

Abstract: A multi-modal sensor system includes: an underlying sensor system; a polarization camera system configured to capture polarization raw frames corresponding to a plurality of different polarization states; and a processing system including a processor and memory, the processing system being configured to control the underlying sensor system and the polarization camera system, the memory storing instructions that, when executed by the processor, cause the processor to: control the underlying sensor system to perform sensing on a scene and the polarization camera system to capture a plurality of polarization raw frames of the scene; extract first tensors in polarization representation spaces based on the plurality of polarization raw frames; and compute a characterization output based on an output of the underlying sensor system and the first tensors in polarization representation spaces.

公开(公告)号：US20170314913A1

公开(公告)日：2017-11-02

申请号：US15204938

申请日：2016-07-07

Applicant: KLA-Tencor Corporation

Inventor： Shankar Krishnan

IPC: G01B11/22 ,  G01N15/08 ,  G01B11/06

CPC classification number: G01B11/22 ,  G01B11/0641 ,  G01B2210/56 ,  G01N15/088 ,  G01N21/00

Abstract: Methods and systems for performing optical measurements of geometric structures filled with an adsorbate by a gaseous adsorption process are presented herein. Measurements are performed while the metrology target under measurement is treated with a flow of purge gas that includes a controlled amount of fill material. A portion of the fill material adsorbs onto the structures under measurement and fills openings in the structural features, spaces between structural features, small volumes such as notches, trenches, slits, contact holes, etc. In one aspect, the desired degree of saturation of vaporized material in the gaseous flow is determined based on the maximum feature size to be filled. In one aspect, measurement data is collected when a structure is unfilled and when the structure is filled by gaseous adsorption. The collected data is combined in a multi-target model based measurement to reduce parameter correlations and improve measurement performance.

公开(公告)号：US09785047B2

公开(公告)日：2017-10-10

申请号：US14754759

申请日：2015-06-30

Applicant: Huazhong University of Science and Technology

Inventor： Shiyuan Liu ,  Weichao Du ,  Chuanwei Zhang ,  Yinyin Tan

IPC: G03F7/00 ,  G01B11/06 ,  G01B11/24 ,  G01N21/21

CPC classification number: G03F7/00 ,  G01B11/0641 ,  G01B11/24 ,  G01B2210/56 ,  G01N2021/214 ,  G03F7/70625

Abstract: A device for measuring a large-area and massive scattered field in nanoscale. The device includes a polarization state generator disposed on an output optical path of a laser source, a polarization state analyzer operating to demodulate a polarized light beam emitted thereon, a first objective lens and a first lens disposed on an optical path of a sample stage, and a scanning mirror disposed on an optical path in front of or at the rear of the polarization state generator.

公开(公告)号：US20160069673A1

公开(公告)日：2016-03-10

申请号：US14847208

申请日：2015-09-08

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Jun TAKAYANAGI ,  Hideyuki OHTAKE ,  Hideyuki AIKYO ,  Yasunari FUJISAWA ,  Atsuo NABESHIMA

IPC: G01B15/02 ,  G01N21/55

CPC classification number: G01B11/0641

Abstract: A film thickness measuring device including: a terahertz wave generator; a prism that has an entrance surface, an abutment surface capable of abutting a surface of a sample including a first film on a side where the first film is formed, and an emission surface; a terahertz wave detector that detects an S-polarization component and a P-polarization component of a reflected wave from the sample, emitted from the emission surface of the prism; and a control section configured to determine a thickness of the first film formed in the sample, based on a difference between a time waveform of the S-polarization component of the reflected wave and a time waveform of the P-polarization component of the reflected wave.

Abstract translation: 一种膜厚测量装置，包括：太赫兹波发生器; 具有入射面的棱镜，能够抵接形成有第一膜的一侧的包含第一膜的样品的表面的抵接面和发射面; 太赫兹波检测器，其从所述棱镜的发射表面检测来自所述样品的反射波的S偏振分量和P偏振分量; 以及控制部，被配置为基于所述反射波的S偏振分量的时间波形与所述反射波的P偏振分量的时间波形之间的差异来确定所述样品中形成的所述第一胶片的厚度 。

公开(公告)号：US20150142395A1

公开(公告)日：2015-05-21

申请号：US14542546

申请日：2014-11-15

Applicant: Meng Cao ,  Leonid Poslavsky ,  Inkyo Kim ,  Lie-Quan Lee

Inventor： Meng Cao ,  Leonid Poslavsky ,  Inkyo Kim ,  Lie-Quan Lee

IPC: G06F17/50

CPC classification number: G03F7/70625 ,  G01B11/02 ,  G01B11/0625 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/211 ,  G01N2021/213

Abstract: Embodiments include automatic selection of sample values for optical metrology. An embodiment of a method includes providing a library parameter space for modeling of a diffracting structure using an optical metrology system; automatically determining by a processing unit a reduced sampling set from the library parameter space, wherein the reduced space is based on one or both of the following recommending a sampling shape based on an expected sample space usage, or recommending a sampling filter based on correlation between two or more parameters of the library parameter space; and generating a library for the optical metrology system using the reduced sampling set.

Abstract translation: 实施例包括自动选择用于光学测量的样本值。 一种方法的实施例包括使用光学测量系统提供用于对衍射结构进行建模的库参数空间; 由处理单元自动确定来自库参数空间的减少的采样集合，其中减少的空间基于以下中的一个或两个基于预期采样空间使用推荐采样形状，或者基于相关性推荐采样滤波器 库参数空间的两个或多个参数; 并使用减少的采样集生成用于光学测量系统的库。

公开(公告)号：US20150036142A1

公开(公告)日：2015-02-05

申请号：US14516540

申请日：2014-10-16

Applicant: KLA-Tencor Corporation

Inventor： Daniel Kandel ,  Vladimir Levinski ,  Alexander Svizher ,  Joel Seligson ,  Andrew Hill ,  Ohad Bachar ,  Amnon Manassen ,  Yung-Ho Alex Chuang ,  Ilan Sela ,  Moshe Markowitz ,  Daria Negri ,  Efraim Rotem

IPC: G01N21/47 ,  G01N21/956 ,  G01N21/95 ,  G01B11/02

CPC classification number: G01N21/47 ,  G01B11/02 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/211 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4792 ,  G01N2201/06113 ,  G01N2201/105 ,  G03F7/70625 ,  G03F7/70633

Abstract: Various metrology systems and methods are provided. One metrology system includes a light source configured to produce a diffraction-limited light beam, an apodizer configured to shape the light beam in the entrance pupil of illumination optics, and optical elements configured to direct the diffraction-limited light beam from the apodizer to an illumination spot on a grating target on a wafer and to collect scattered light from the grating target. The metrology system further includes a field stop and a detector configured to detect the scattered light that passes through the field stop. In addition, the metrology system includes a computer system configured to determine a characteristic of the grating target using output of the detector.

Abstract translation: 提供了各种计量系统和方法。 一个计量系统包括被配置为产生衍射受限光束的光源，被配置为使照明光学器件的入射光瞳中的光束成形的变迹器，以及被配置为将来自变迹器的衍射受限光束引导到 在晶片上的光栅目标上的照明点并且收集来自光栅目标的散射光。 测量系统还包括场停止器和检测器，其被配置为检测通过场停止器的散射光。 此外，计量系统包括被配置为使用检测器的输出来确定光栅目标的特性的计算机系统。

公开(公告)号：US20150016071A1

公开(公告)日：2015-01-15

申请号：US14325490

申请日：2014-07-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinao NISHIOKA ,  Masayoshi HARUKI

IPC: G01B11/06 ,  H05K1/18

CPC classification number: G01B11/06 ,  G01B11/0641 ,  H05K1/185

Abstract: An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same position in the first image data and the second image data is smallest, and forming third image data including a first reference line and the extracted second reference line, and calculating a thickness of the electronic component from a distance between the first reference line and the second reference line in the third image data.

Abstract translation: 一种电子部件厚度测量方法，包括从第二图像数据中的第一图像数据和多个第二参考线中的多个第二参考线中提取第二参考线，在第二参考线处，将第二参考线之间的强度峰值的差在 在第一图像数据和第二图像数据中的相同位置最小，并且形成包括第一参考线和所提取的第二参考线的第三图像数据，并且从第一参考线和第二图像数据之间的距离计算电子部件的厚度 第三个图像数据中的第二个参考线。

公开(公告)号：US08879073B2

公开(公告)日：2014-11-04

申请号：US13770202

申请日：2013-02-19

Applicant: KLA-Tencor Corporation

Inventor： Jonathan M. Madsen ,  Andrei V. Shchegrov ,  Michael Bakeman ,  Thaddeus Gerard Dziura ,  Alexander Kuznetsov ,  Bin-Ming (Benjamin) Tsai

IPC: G01B11/14 ,  G01B11/06 ,  G01N21/956

CPC classification number: G01N21/956 ,  G01B11/0625 ,  G01B11/0641 ,  G01B2210/56 ,  G03F7/70683 ,  H01L22/30

Abstract: Methods and systems for enhancing metrology sensitivity to particular parameters of interest are presented. Field enhancement elements (FEEs) are constructed as part of a specimen to enhance the measurement sensitivity of structures of interest present on the specimen. The design of the FEEs takes into account measurement goals and manufacturing design rules to make target fabrication compatible with the overall device fabrication process. Measurement of opaque materials, high-aspect ratio structures, structures with low-sensitivity, or mutually correlated parameters is enhanced by the addition of FEEs. Exemplary measurements include critical dimension, film thickness, film composition, and optical scatterometry overlay. In some examples, a target element includes different FEEs to improve the measurement of different structures of interest. In other examples, different target elements include different FEEs. In some other examples, field enhancement elements are shaped to concentrate an electric field in a thin film deposited over the FEE.

Abstract translation: 提出了用于增强对感兴趣的特定参数的度量敏感性的方法和系统。 场增强元件（FEE）被构造为样本的一部分，以增强样品上存在的感兴趣结构的测量灵敏度。 FEE的设计考虑了测量目标和制造设计规则，使目标制造与整个设备制造过程相兼容。 通过添加FEE，增强不透明材料，高纵横比结构，低灵敏度结构或相互关联的参数的测量。 示例性测量包括临界尺寸，膜厚度，膜组成和光学散射测量覆盖。 在一些示例中，目标元素包括不同的FEE以改善感兴趣的不同结构的测量。 在其他示例中，不同的目标元素包括不同的FEE。 在一些其他示例中，场增强元件被成形为将电场集中在沉积在FEE上的薄膜中。

公开(公告)号：US08830486B2

公开(公告)日：2014-09-09

申请号：US13536410

申请日：2012-06-28

Applicant: Hidong Kwak ,  Ward Dixon ,  Torsten Kaack ,  Ning-Yi Neil Wang ,  Jagjit Sandhu

Inventor： Hidong Kwak ,  Ward Dixon ,  Torsten Kaack ,  Ning-Yi Neil Wang ,  Jagjit Sandhu

IPC: G01B11/28 ,  G01N21/55 ,  G01B11/06 ,  B08B5/02 ,  H01L21/67 ,  H01L21/66

CPC classification number: G01N21/55 ,  B08B5/02 ,  G01B11/06 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/21 ,  H01L21/67017 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.

Abstract translation: 公开了一种用清洗气体清洗晶片表面的一部分的局部清洗工具。 清洗工具包括净化室，其构造成在清洗室的空腔内容纳清洗气体，清洗室的表面的可渗透部分构造成将清洗气体从腔的腔扩散到晶片表面的一部分 以及被配置为将从照明源接收的照明传送到晶片表面的该部分的测量位置并且还被配置为将从测量位置反射的照射传输到检测器的孔。