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1.发明授权Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers 失效由用于晶片化学/机械平面化的造纸纤维制成的梯度抛光垫公开(公告)号：US07025668B2
公开(公告)日：2006-04-11
申请号：US10464821
申请日：2003-06-18
Applicant: Angela Petroski , Richard D. Cooper , Paul Fathauer , David Perry
Inventor： Angela Petroski , Richard D. Cooper , Paul Fathauer , David Perry
IPC: B24B1/00
Abstract: A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.
Abstract translation: 一种用于化学机械平面化（CMP）工艺的复合抛光垫，本发明的抛光垫由造纸工艺制成，制成与树脂材料结合的造纸纤维的纤维基质，并由顶部 部分具有一个或多个下部，其中每个层具有独特的材料性质。 通过修改每个层的各个特征，可以显着提高抛光性能。 通常，顶层或工作表面将具有比下层更高的材料模量。 因此，子层可以由较低密度区域或改性表面结构（例如开槽）组成，以有效地改变体积弹性模量。
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2.发明授权Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same 失效用于半导体晶片的化学机械平面化的抛光垫及其制造方法公开(公告)号：US06852020B2
公开(公告)日：2005-02-08
申请号：US10349201
申请日：2003-01-22
Applicant: Angela Petroski , Richard D. Cooper , Paul Fathauer , Marc Andrew Yesnik
Inventor： Angela Petroski , Richard D. Cooper , Paul Fathauer , Marc Andrew Yesnik
Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
Abstract translation: 一种抛光垫，用于对由多孔结构制成的基材进行化学机械抛光的抛光垫，该抛光垫包括由诸如酚醛树脂的热固性树脂结合的纤维等纤维构成的基质。 抛光垫表面具有在衬底的化学机械抛光期间抛光浆料流动的空隙，并且其中在衬底的化学机械抛光期间形成的碎屑被暂时储存以供随后的漂洗。 研磨垫的抛光表面以形成有助于浆料输送和抛光的凹凸，以及打开垫的多孔结构。 多孔垫包含纳米尺寸的填料颗粒，其加强了结构，与现有技术的垫相比，增加了耐磨性。 还公开了制造抛光垫的方法。
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公开(公告)号：US20070049169A1
公开(公告)日：2007-03-01
申请号：US11497086
申请日：2006-08-01
Applicant: Neha Vaidya , Angela Petroski , James Macey
Inventor： Neha Vaidya , Angela Petroski , James Macey
IPC: B24B49/00
CPC classification number: B24B37/205 , B24B37/24 , B24D18/00
Abstract: A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.
Abstract translation: 抛光制品及其用作各种基材的抛光制品，特别是用于抛光半导体晶片。 该制品由可分离的混合纤维网和将纤维保持在网中的粘合剂材料组成。 纤维和粘合剂材料为抛光垫提供吸收性能，其将浆料化学和颗粒保持在表面附近以进行有效的抛光。
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Patent Agency Ranking
4.发明申请POLISHING PAD FOR USE IN CHEMICAL/MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS HAVING A TRANSPARENT WINDOW FOR END-POINT DETERMINATION AND METHOD OF MAKING 失效用于具有用于端点测定的透明窗口的半导体波导的化学/机械平面化的抛光垫及其制造方法公开(公告)号：US20050191945A1
公开(公告)日：2005-09-01
申请号：US11091965
申请日：2005-03-28
Applicant: Angela Petroski , Richard Copper , Paul Fathauer , David Perry
Inventor： Angela Petroski , Richard Copper , Paul Fathauer , David Perry
CPC classification number: B24B37/205 , B24B37/24 , B24B37/26 , B24D3/32
Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
Abstract translation: 用于半导体晶片的化学/机械平面化的多孔抛光垫具有通过将聚合物材料直接注入到垫的修改部分中而形成在多孔抛光垫的一部分中的透明部分。 修改的部分可以是低密度区域，或者可以通过去除衬垫的完整垂直部分来创建。 注入的聚合物通过在垫/窗口界面处流入垫的矩阵而与垫形成整体窗口。 不需要额外的钢筋来固定窗户; 然而，粘合剂和/或另一不透水层可以附着在窗户的后面用于额外的支撑。 在替代实施例中，将单独和不同的窗口插入衬垫的切口部分中，并且通过衬垫的背面非工作表面上的一个或多个粘合膜层粘合到衬垫。
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5.发明授权Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same 失效用于半导体晶片的化学机械平面化的抛光垫及其制造方法公开(公告)号：US07037184B2
公开(公告)日：2006-05-02
申请号：US10349200
申请日：2003-01-22
Applicant: Angela Petroski , Richard D. Cooper , Paul Fathauer , Marc Andrew Yesnik
Inventor： Angela Petroski , Richard D. Cooper , Paul Fathauer , Marc Andrew Yesnik
IPC: B24D11/00
Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
Abstract translation: 一种抛光垫，用于对由多孔结构制成的基材进行化学机械抛光的抛光垫，该抛光垫包括由诸如酚醛树脂的热固性树脂结合的纤维等纤维构成的基质。 抛光垫表面具有在衬底的化学机械抛光期间抛光浆料流动的空隙，并且其中在衬底的化学机械抛光期间形成的碎屑被暂时储存以供随后的漂洗。 研磨垫的抛光表面以形成有助于浆料输送和抛光的凹凸，以及打开垫的多孔结构。 多孔垫包含纳米尺寸的填料颗粒，其加强了结构，与现有技术的垫相比，增加了耐磨性。 还公开了制造抛光垫的方法。
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6.发明授权Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers 失效用于将抛光垫固定到用于晶片的化学机械抛光的压板上的方法公开(公告)号：US06964601B2
公开(公告)日：2005-11-15
申请号：US10616514
申请日：2003-07-09
Applicant: Angela Petroski , Richard D. Cooper , Paul Fathauer , David Perry , James Macey
Inventor： Angela Petroski , Richard D. Cooper , Paul Fathauer , David Perry , James Macey
CPC classification number: B24B37/20
Abstract: The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.
Abstract translation: 本发明涉及将抛光垫固定到用于化学机械抛光的台板上的方法。 具体地说，抛光垫使用可重新闭合的钩和紧固件附着在压盘上，由此可以重新使用压板附接紧固件。 公开了用于附接多孔和无孔抛光垫的独立实施例。
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7.发明授权Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making 失效用于具有用于终点确定的透明窗口和制造方法的半导体晶片的化学/机械平面化的抛光垫公开(公告)号：US06945846B1
公开(公告)日：2005-09-20
申请号：US11091965
申请日：2005-03-28
Applicant: Angela Petroski , Richard D. Copper , Paul Fathauer , David Perry
Inventor： Angela Petroski , Richard D. Copper , Paul Fathauer , David Perry
CPC classification number: B24B37/205 , B24B37/24 , B24B37/26 , B24D3/32
Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
Abstract translation: 用于半导体晶片的化学/机械平面化的多孔抛光垫具有通过将聚合物材料直接注入到垫的修改部分中而形成在多孔抛光垫的一部分中的透明部分。 修改的部分可以是低密度区域，或者可以通过去除衬垫的完整垂直部分来创建。 注入的聚合物通过在垫/窗口界面处流入垫的矩阵而与垫形成整体窗口。 不需要额外的钢筋来固定窗户; 然而，粘合剂和/或另一不透水层可以附着在窗户的后面用于额外的支撑。 在替代实施例中，将单独和不同的窗口插入到垫的切口部分中，并且通过衬垫的背面非工作表面上的一个或多个粘合膜层粘合到垫上。
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公开(公告)号：US06875077B2
公开(公告)日：2005-04-05
申请号：US10390555
申请日：2003-03-17
Applicant: Angela Petroski , Richard D. Copper , Paul Fathauer , David Perry
Inventor： Angela Petroski , Richard D. Copper , Paul Fathauer , David Perry
CPC classification number: B24B37/205 , B24B37/24 , B24B37/26 , B24D3/32
Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
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