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    POLISHING APPARATUS AND POLISHING METHOD
    1.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开

    公开(公告)号：US20170165804A1

    公开(公告)日：2017-06-15

    申请号：US15118184

    申请日：2015-02-12

    申请人： Ebara Corporation

    发明人： Masaya SEKI ,  Manao HOSHINA

    IPC分类号： B24B9/06 ,  B24B37/04 ,  B24B21/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B37/04 ,  H01L21/02021

    摘要： The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

    POLISHING APPARATUS AND POLISHING METHOD
    3.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开
    抛光装置和抛光方法

    公开(公告)号：US20150104620A1

    公开(公告)日：2015-04-16

    申请号：US14577101

    申请日：2014-12-19

    申请人： EBARA CORPORATION

    发明人： Tamami TAKAHASHI ,  Masaya SEKI ,  Hiroaki KUSA ,  Kenji YAMAGUCHI ,  Masayuki NAKANISHI

    IPC分类号： B24B21/00 ,  B24B9/06

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

    摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

    摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

    Polishing apparatus and polishing method
    4.
    发明授权
    Polishing apparatus and polishing method 有权
    抛光设备和抛光方法

    公开(公告)号：US08979615B2

    公开(公告)日：2015-03-17

    申请号：US13308857

    申请日：2011-12-01

    申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

    发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

    IPC分类号： B24B21/04 ,  B24B9/06 ,  B24B21/00

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

    摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

    摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

    WAFER POLISHING APPARATUS AND METHOD
    5.
    发明申请
    WAFER POLISHING APPARATUS AND METHOD 有权
    抛光抛光装置和方法

    公开(公告)号：US20140213155A1

    公开(公告)日：2014-07-31

    申请号：US14167898

    申请日：2014-01-29

    申请人： EBARA CORPORATION

    发明人： Tetsuji TOGAWA ,  Atsushi YOSHIDA ,  Toshifumi WATANABE

    IPC分类号： B24B9/06 ,  B24B21/00 ,  H01L21/463

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B21/06 ,  B24B27/0076 ,  H01L21/02035 ,  H01L21/463

    摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

    摘要翻译： 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

    Grinding machine
    6.
    发明授权
    Grinding machine 失效
    磨床

    公开(公告)号：US07044841B1

    公开(公告)日：2006-05-16

    申请号：US11208322

    申请日：2005-08-19

    申请人： Juei-Seng Liao

    发明人： Juei-Seng Liao

    IPC分类号： B24B7/00 ,  B24B21/00

    CPC分类号： B24B21/008 ,  B24B55/08

    摘要： A grinding machine includes a driving unit, a grinding wheel unit, an abrasive belt unit and a dust-collecting device. The dust-collecting device includes a dust-discharging unit and a dust-guiding unit. The dust-discharging unit includes a dust-collecting seat disposed fixedly on a side cover of the grinding wheel unit, and a suction fan assembly disposed within the dust-collecting seat. The dust-guiding unit includes a conduit communicated with a dust-receiving chamber in the grinding wheel unit and an accommodating chamber in the abrasive belt unit. The grinding wheel unit, the abrasive belt unit and the suction fan assembly are driven by the driving unit. Dust is induced by the suction fan assembly to move from the dust-receiving chamber and the accommodating chamber into the dust-collecting seat.

    摘要翻译： 研磨机包括驱动单元，砂轮单元，砂带单元和集尘装置。 集尘装置包括排尘单元和除尘引导单元。 排尘单元包括固定地设置在砂轮单元的侧盖上的集尘座和设置在集尘座内的吸风扇组件。 除尘引导单元包括与研磨轮单元中的灰尘接收室连通的导管和砂带单元中的容纳室。 砂轮单元，砂带单元和吸风扇组件由驱动单元驱动。 由吸风机组件引起的灰尘从吸尘室和容纳室移动到集尘座中。

    Chemical mechanical polishing with a moving polishing sheet
    7.
    发明授权
    Chemical mechanical polishing with a moving polishing sheet 失效
    用移动的抛光片进行化学机械抛光

    公开(公告)号：US06475070B1

    公开(公告)日：2002-11-05

    申请号：US09302570

    申请日：1999-04-30

    申请人： John M. White

    发明人： John M. White

    IPC分类号： B24B100

    CPC分类号： B24B21/004 ,  B24B21/008 ,  B24B21/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/16 ,  B24B37/24 ,  B24B37/245 ,  B24B53/017 ,  B24D7/12 ,  H01L21/30625

    摘要： A chemical mechanical polishing apparatus has a platen, a polishing sheet that is wider than the substrate extending between the a first reel and a second reel, and a motor to drive at least one of the first and second reels to move the polishing sheet in a linear direction across the top surface of the platen during polishing. The polishing sheet is driven alternately in opposing directions to switch between transferring the polishing sheet from the first reel to the second reel, and from the second reel to the first reel.

    摘要翻译： 化学机械抛光装置具有压板，比在第一卷轴和第二卷轴之间延伸的基板宽的抛光片，以及驱动第一和第二卷轴中的至少一个的马达，以将抛光片移动到 在抛光过程中穿过压板顶表面的线性方向。 抛光片在相反的方向交替地驱动，以在将抛光片从第一卷轴转移到第二卷轴之间切换，并且从第二卷轴转移到第一卷轴。

    Segmented platen with diaphragm cylinder control
    8.
    发明授权
    Segmented platen with diaphragm cylinder control 失效
    带隔膜圆筒控制的分段压板

    公开(公告)号：US4621459A

    公开(公告)日：1986-11-11

    申请号：US749867

    申请日：1985-06-28

    申请人： Lee E. Stump ,  Eugene C. David ,  Dale Boehne

    发明人： Lee E. Stump ,  Eugene C. David ,  Dale Boehne

    IPC分类号： B23Q15/02 ,  B24B21/00 ,  B24B21/08

    CPC分类号： B24B21/08 ,  B23Q15/02 ,  B24B21/008

    摘要： A sanding and polishing machine for individual workpieces having an infeed conveyor for carrying workpieces along a predetermined path through one or more tandemly arranged working stations for exposure to a series of endless abrasive belts. The abrasive belt contacts the workpiece under the influence of a multi-segmented platen, with each platen segment being arranged for adjustable positioning relative to the plane of the surface of the workpiece. Positioning of each individual platen segment is accomplished by virtue of the combination of a workpiece sensor together with an adjustable selected input supplementing the workpiece sensor so that one or more platen segments disposed adjacent to those segments actuated by the workpiece sensing units are also actuated, thus increasing the number of segments responding to the presence of workpieces in the working station and either symmetrically or asymmetrically enhancing the sensed width of the workpiece.

    摘要翻译： 一种用于单个工件的砂磨和抛光机，具有用于沿着预定路径运送工件的进料输送机，通过一个或多个串列布置的工作站，用于暴露于一系列环形砂带。 研磨带在多段压板的影响下接触工件，每个压板段被布置成相对于工件表面的平面可调节的定位。 通过将工件传感器与补充工件传感器的可调选择输入的组合来实现每个单独的压板段的定位，使得与由工件感测单元致动的那些段相邻设置的一个或多个压板段也被致动，从而 增加响应工件中工件的存在的段的数量，以及对称地或不对称地增强工件的感测宽度。