公开(公告)号：US20230082177A1

公开(公告)日：2023-03-16

申请号：US17900803

申请日：2022-08-31

申请人： Atlas Magnetics

发明人： John Othniel McDonald ,  Daniel Smallwood ,  Zach Zimits

IPC分类号： C25D3/12 ,  C25D7/00 ,  H01F3/00 ,  C25D3/20 ,  C25D3/44

摘要： An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

公开(公告)号：US20230057305A1

公开(公告)日：2023-02-23

申请号：US17893108

申请日：2022-08-22

申请人： Atlas Magnetics

发明人： John Othniel McDonald ,  Osman Ersed Akcasu

IPC分类号： H01F27/24 ,  H01F1/147 ,  H01F41/02

摘要： A complex-shaped air gap for electrical components utilizing magnetically permeable material. The air is enabled to thermally distribute heat through a magnetic core and thus reduce issues relating to heat localization. The air gap shape is maximized for length, and in the preferred embodiment is a spiral shape. The preferred embodiment is built by a lithography process, without cutting, to enable the thin spiraling shape.