公开(公告)号：US08124174B2

公开(公告)日：2012-02-28

申请号：US12102536

申请日：2008-04-14

申请人： Seigo Kurosaka ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

发明人： Seigo Kurosaka ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

IPC分类号： C23C18/16 ,  C23C18/34 ,  C23C18/44 ,  B05D1/36

CPC分类号： H05K3/244 ,  C23C18/31 ,  C23C18/44 ,  H01L2924/0002 ,  H05K2203/072 ,  H01L2924/00

摘要： Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a complexing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath.

摘要翻译： 通过使用包含水溶性的无电镀金浴的无电镀金，形成包括化学镀镍膜，无电镀钯膜和无电镀金膜的镀膜层压体的无电镀金膜的部分或全部 金化合物，络合剂，甲醛和/或甲醛 - 亚硫酸氢盐加合物，以及由以下通式表示的胺化合物：R1-NH-C2H4-NH-R2或R3-（CH2-NH-C2H4-NH-CH2） n-R4。 本发明的方法不需要两种类型的浴，闪镀金浴和用于增稠的厚镀金浴。 可以使用仅一种类型的镀金浴形成适用于焊接或引线接合的不同厚度的镀金膜。

公开(公告)号：US20080277140A1

公开(公告)日：2008-11-13

申请号：US12102536

申请日：2008-04-14

申请人： Seigo KUROSAKA ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

发明人： Seigo KUROSAKA ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

IPC分类号： B05D1/18 ,  H01B5/00

CPC分类号： H05K3/244 ,  C23C18/31 ,  C23C18/44 ,  H01L2924/0002 ,  H05K2203/072 ,  H01L2924/00

摘要： Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath. Especially, an electroless gold plating film having a thickness of not smaller than 0.15 μm can be efficiently, effectively formed by use of one plating bath in one step, thereby enabling the process to be simplified along with an attendant advantage in cost.

摘要翻译： 通过使用包含水溶性的无电镀金浴的无电镀金，形成包括化学镀镍膜，无电镀钯膜和无电镀金膜的镀膜层压体的无电镀金膜的部分或全部 金化合物，完成剂，甲醛和/或甲醛 - 亚硫酸氢盐加合物，以及由以下通式表示的胺化合物：R 1 -NH-C 2 H < （3）-NH-R 2或R 3 - （CH 2 -NH-C 2） 其中R 1，R 2，R 3，R 3，R 3和R 4独立地是氢。 本发明的方法不需要两种类型的浴，闪镀金浴和用于增稠的厚镀金浴。 可以使用仅一种类型的镀金浴形成适用于焊接或引线接合的不同厚度的镀金膜。 特别地，通过一步使用一个电镀浴可以有效地形成厚度不小于0.15μm的无电镀金膜，从而使得该工艺可以简化，并伴随着成本的优势。