公开(公告)号：US08124174B2

公开(公告)日：2012-02-28

申请号：US12102536

申请日：2008-04-14

申请人： Seigo Kurosaka ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

发明人： Seigo Kurosaka ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

IPC分类号： C23C18/16 ,  C23C18/34 ,  C23C18/44 ,  B05D1/36

CPC分类号： H05K3/244 ,  C23C18/31 ,  C23C18/44 ,  H01L2924/0002 ,  H05K2203/072 ,  H01L2924/00

摘要： Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a complexing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath.

摘要翻译： 通过使用包含水溶性的无电镀金浴的无电镀金，形成包括化学镀镍膜，无电镀钯膜和无电镀金膜的镀膜层压体的无电镀金膜的部分或全部 金化合物，络合剂，甲醛和/或甲醛 - 亚硫酸氢盐加合物，以及由以下通式表示的胺化合物：R1-NH-C2H4-NH-R2或R3-（CH2-NH-C2H4-NH-CH2） n-R4。 本发明的方法不需要两种类型的浴，闪镀金浴和用于增稠的厚镀金浴。 可以使用仅一种类型的镀金浴形成适用于焊接或引线接合的不同厚度的镀金膜。

公开(公告)号：US07678183B2

公开(公告)日：2010-03-16

申请号：US12067662

申请日：2006-09-22

申请人： Akihiko Murasumi ,  Seigo Kurosaka ,  Hiromu Inagawa ,  Yukinori Oda

发明人： Akihiko Murasumi ,  Seigo Kurosaka ,  Hiromu Inagawa ,  Yukinori Oda

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  C23C18/1651 ,  C23C18/54 ,  H01L24/43 ,  H01L24/745 ,  H01L2224/45664

摘要： Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

摘要翻译： 公开了含有钯化合物，至少一种选自氨和胺化合物的络合剂，至少一种选自次膦酸和次膦酸盐的还原剂和至少一种选自不饱和羧酸的不饱和羧酸化合物的化学镀钯浴， 不饱和羧酸酐，不饱和羧酸酯和不饱和羧酸衍生物。 这种无电镀钯浴具有高的浴稳定性，并且几乎不发生浴的分解。 因此，本发明的无电镀钯浴比常规化学镀钯浴具有更长的浴寿命。 此外，该无电镀钯浴能够获得优异的焊接特性和引线接合特性，因为即使长时间使用也不影响电镀膜特性。

公开(公告)号：US20090133603A1

公开(公告)日：2009-05-28

申请号：US12067662

申请日：2006-09-22

申请人： Akihiko Murasumi ,  Seigo Kurosaka ,  Hiromu Inagawa ,  Yukinori Oda

发明人： Akihiko Murasumi ,  Seigo Kurosaka ,  Hiromu Inagawa ,  Yukinori Oda

IPC分类号： C23C22/48

CPC分类号： C23C18/44 ,  C23C18/1651 ,  C23C18/54 ,  H01L24/43 ,  H01L24/745 ,  H01L2224/45664

摘要： Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

摘要翻译： 公开了含有钯化合物，至少一种选自氨和胺化合物的络合剂，至少一种选自次膦酸和次膦酸盐的还原剂和至少一种选自不饱和羧酸的不饱和羧酸化合物的化学镀钯浴， 不饱和羧酸酐，不饱和羧酸酯和不饱和羧酸衍生物。 这种无电镀钯浴具有高的浴稳定性，并且几乎不发生浴的分解。 因此，本发明的无电镀钯浴比常规化学镀钯浴具有更长的浴寿命。 此外，该无电镀钯浴能够获得优异的焊接特性和引线接合特性，因为即使长时间使用也不影响电镀膜特性。

公开(公告)号：US20080277140A1

公开(公告)日：2008-11-13

申请号：US12102536

申请日：2008-04-14

申请人： Seigo KUROSAKA ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

发明人： Seigo KUROSAKA ,  Yukinori Oda ,  Akira Okada ,  Ayumi Okubo ,  Masayuki Kiso

IPC分类号： B05D1/18 ,  H01B5/00

CPC分类号： H05K3/244 ,  C23C18/31 ,  C23C18/44 ,  H01L2924/0002 ,  H05K2203/072 ,  H01L2924/00

摘要： Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath. Especially, an electroless gold plating film having a thickness of not smaller than 0.15 μm can be efficiently, effectively formed by use of one plating bath in one step, thereby enabling the process to be simplified along with an attendant advantage in cost.

摘要翻译： 通过使用包含水溶性的无电镀金浴的无电镀金，形成包括化学镀镍膜，无电镀钯膜和无电镀金膜的镀膜层压体的无电镀金膜的部分或全部 金化合物，完成剂，甲醛和/或甲醛 - 亚硫酸氢盐加合物，以及由以下通式表示的胺化合物：R 1 -NH-C 2 H < （3）-NH-R 2或R 3 - （CH 2 -NH-C 2） 其中R 1，R 2，R 3，R 3，R 3和R 4独立地是氢。 本发明的方法不需要两种类型的浴，闪镀金浴和用于增稠的厚镀金浴。 可以使用仅一种类型的镀金浴形成适用于焊接或引线接合的不同厚度的镀金膜。 特别地，通过一步使用一个电镀浴可以有效地形成厚度不小于0.15μm的无电镀金膜，从而使得该工艺可以简化，并伴随着成本的优势。

公开(公告)号：US07985285B2

公开(公告)日：2011-07-26

申请号：US11987880

申请日：2007-12-05

申请人： Masayuki Kiso ,  Yukinori Oda ,  Seigo Kurosaka ,  Tohru Kamitamari ,  Yoshikazu Saijo ,  Katsuhisa Tanabe

发明人： Masayuki Kiso ,  Yukinori Oda ,  Seigo Kurosaka ,  Tohru Kamitamari ,  Yoshikazu Saijo ,  Katsuhisa Tanabe

IPC分类号： C23C18/44 ,  B05D1/18

CPC分类号： C23C18/44 ,  C23C18/54

摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.

摘要翻译： 化学镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R1-NH-C2H4-NH-R2或（CH2-NH-C2H4-NH-CH2）n表示的胺化合物 -R4（其中R1至R4表示-OH，-CH3，-CH2OH，-C2H4OH，-CH2N（CH3）2，-CH2NH（CH2OH），-CH2NH（C2H4OH），-C2H4NH（CH2OH），-C2H4NH（C2H4OH） ，-CH 2 N（CH 2 OH）2，-CH 2 N（C 2 H 4 OH）2，-C 2 H 4 N（CH 2 OH）2或-C 2 H 4 N（C 2 H 4 OH）2，n为1〜4的整数）。 可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。

公开(公告)号：US20080138506A1

公开(公告)日：2008-06-12

申请号：US11987880

申请日：2007-12-05

申请人： Masayuki Kiso ,  Yukinori Oda ,  Seigo Kurosaka ,  Tohru Kamitamari ,  Yoshikazu Saijo ,  Katsuhisa Tanabe

发明人： Masayuki Kiso ,  Yukinori Oda ,  Seigo Kurosaka ,  Tohru Kamitamari ,  Yoshikazu Saijo ,  Katsuhisa Tanabe

IPC分类号： C23C18/32 ,  C23C18/42 ,  C23C18/54

CPC分类号： C23C18/44 ,  C23C18/54

摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4).A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.

摘要翻译： 无电镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R 1 -NH-C 2 H表示的胺化合物 4-NH-R 2或（CH 2 -NH-C 2 H 4） （其中R 1至R 4）其中R 1至R 4（其中R 1至R 4） -CH 3，-OH，-CH 2，-SO 2 H，CH 2 CH 2， OH，-CH 2 N（CH 3）2 - ， - CH 2 NH（CH 2） OH），-CH 2 NH（C 2 H 4 OH），-C 2 - H 2 NH（CH 2 OH），-C 2 H 4 NH（C 2 H 2） H 2 OH，-CH 2 N（CH 2 OH）2，-CH 2， N 2 C 2 H 2 H 2，H 2 H 2， N 2（CH 2 OH）2或-C 2 H 4 H（N） C 2 H 4 OH）2，n为1〜4的整数。 可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。