公开(公告)号：US09067281B2

公开(公告)日：2015-06-30

申请号：US13063267

申请日：2009-09-09

申请人： Beat Beutler

发明人： Beat Beutler

IPC分类号： B23K26/38 ,  B23K26/08 ,  B23K26/14 ,  G05B19/416

CPC分类号： B23K26/38 ,  B23K26/0876 ,  B23K26/0884 ,  B23K26/14 ,  G05B19/4163 ,  G05B2219/35398 ,  G05B2219/36283 ,  G05B2219/45041

摘要： The laser cutting system for cutting a workpiece with a laser beam along a cutting line at a variable cutting speed includes a movable machining head for placing the laser beam on the respective workpiece, a user interface for specifying the respective cutting line and for specifying a minimum path accuracy of the laser beam, and a control device for controlling a movement of the machining head along the cutting line relative to the respective workpiece and for controlling a plurality of process variables of a cutting process. A second subset of the process variables comprises exclusively one or more process variables which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset can be controlled by way of the control device as a function of at least one variable control parameter.

摘要翻译： 用于以可变切割速度沿着切割线用激光束切割工件的激光切割系统包括用于将激光束放置在相应工件上的可移动加工头，用于指定相应切割线并用于指定最小值的用户界面 激光束的路径精度以及用于控制加工头沿着切割线相对于相应工件移动并用于控制切割过程的多个过程变量的控制装置。 过程变量的第二个子集仅包含一个或多个不影响可用于切割的激光束的功率的过程变量。 可以通过作为至少一个可变控制参数的函数的控制装置来控制第二子集的至少一个过程变量。

公开(公告)号：US06189566B1

公开(公告)日：2001-02-20

申请号：US09416127

申请日：1999-10-12

申请人： Beat Beutler

发明人： Beat Beutler

IPC分类号： F16L1500

CPC分类号： B01D53/185 ,  B01D3/008 ,  Y10T137/598 ,  Y10T137/85938

摘要： A liquid distributor for column packings is provided for the supplying of a liquid medium which includes a material or a material mixture and which tends to the development of inhomogeneities, for example, as a result of a segregation or of a polymerization. The distributor comprises at least one submember with a row of output points for the liquid medium, with at least one of the output points assuming a last output position in the submember with respect to the flow direction of the medium. In the last output point or output points, a flow director is arranged in or at the submember through which a through-flow of the medium can be effected in regions at which a stagnation of the flow would be present without the flow director.

摘要翻译： 提供用于柱填料的液体分配器用于供应包括材料或材料混合物的液体介质，并且倾向于产生不均匀性，例如由于分离或聚合的结果。 分配器包括至少一个具有用于液体介质的一排输出点的子构件，其中输出点中的至少一个相对于介质的流动方向假设子构件中的最后输出位置。 在最后的输出点或输出点中，流动导向器布置在子元件中或子元件中，通过该导流器可以在不存在导流器的情况下存在流动停滞的区域中进行介质的通流。

公开(公告)号：US20110220623A1

公开(公告)日：2011-09-15

申请号：US13063267

申请日：2009-09-09

申请人： Beat Beutler

发明人： Beat Beutler

IPC分类号： B23K26/14

CPC分类号： B23K26/38 ,  B23K26/0876 ,  B23K26/0884 ,  B23K26/14 ,  G05B19/4163 ,  G05B2219/35398 ,  G05B2219/36283 ,  G05B2219/45041

摘要： The laser cutting system (1) for cutting a workpiece (3) with a laser beam (5) along a cutting line (L1, L2) at a variable cutting speed (v) comprises a movable machining head (10) for placing the laser beam (5) on the respective workpiece (3), a user interface (45) for specifying the respective cutting line (L1, L2) and for specifying a minimum path accuracy (ΔB) of the laser beam (5), and a control device (20) for controlling a movement of the machining head (10) along the cutting line (L1, L2) relative to the respective workpiece and for controlling a plurality of process variables (LL, Tp, ΔT, DF, D0, ModL, δB, DS, DD, AG, PG) of a cutting process, wherein said movement during the cutting process can produce a cutting path (B1, B2) of the laser beam along the cutting line (L1, L2). A first subset (G1) of the process variables comprises exclusively one or more process variables (LL, Tp, ΔT) which influence the power of the laser beam available for cutting, and wherein a second subset (G2) of the process variables comprises exclusively one or more process variables (DF, DO, ModL, δB, DS, DD, AG, PG) which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset (DF, DO, ModL, δB, DS, DD, AG, PG) can be controlled by way of the control device (20) as a function of at least one variable control parameter (S20, S21, S22, S23, S24, S25, S26, S27), the respective value of which can be determined by the control device based on rules implemented in the control device as a function of at least one of the respectively registered values (vg1, vg2) of the speed of the machining head.

摘要翻译： 用于以切割线（L1，L2）以可变切割速度（v）用激光束（5）切割工件（3）的激光切割系统（1）包括用于放置激光器的可移动加工头（10） （5），用于指定相应切割线（L1，L2）并用于指定激光束（5）的最小路径精度（＆Dgr; B）的用户界面（45），以及 控制装置（20），用于控制加工头（10）相对于相应工件沿着切割线（L1，L2）的移动，并用于控制多个过程变量（LL，Tp，＆Dgr; T，DF， D0，ModL，δB，DS，DD，AG，PG），其中所述切割过程中的所述移动可以沿切割线（L1，L2）产生激光束的切割路径（B1，B2）。 过程变量的第一子集（G1）仅包含影响可用于切割的激光束的功率的一个或多个过程变量（LL，Tp，＆Dgr; T），并且其中过程变量的第二子集（G2） 仅包含一个或多个对可切割激光束的功率没有影响的过程变量（DF，DO，ModL，δB，DS，DD，AG，PG）。 可以通过作为至少一个可变控制参数的函数的控制装置（20）来控制第二子集（DF，DO，ModL，δB，DS，DD，AG，PG）的至少一个过程变量（S20 ，S21，S22，S23，S24，S25，S26，S27），其各自的值可以由控制装置基于在控制装置中实现的规则作为分别登记值中的至少一个（vg1 ，vg2）加工头的速度。