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公开(公告)号：US20140144571A1
公开(公告)日：2014-05-29
申请号：US13685149
申请日：2012-11-26
申请人： William Peter Addiego , Michael John Bennett , Michael Patrick Carson , Jeffrey Scott Davis , Martin Herbert Goller , Benjamin Zain Hanson , Tracey Lynn Timmons
发明人： William Peter Addiego , Michael John Bennett , Michael Patrick Carson , Jeffrey Scott Davis , Martin Herbert Goller , Benjamin Zain Hanson , Tracey Lynn Timmons
IPC分类号： C04B37/00
CPC分类号： C04B37/001 , C04B35/645 , C04B2235/6567 , C04B2235/96 , C04B2235/963 , C04B2237/343 , C04B2237/348 , C04B2237/52 , C04B2237/78 , C04B2237/80
摘要： Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (Ra) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein
摘要翻译： 本文公开了不使用粘合剂来粘合诸如锆石基材的耐火基材的方法。 示例性方法包括（a）提供多个难熔组分，每个组分具有至少一个待结合的表面，（b）将待接合的每个表面抛光至200nm的表面粗糙度（Ra）或更细，（c） 要结合的表面以形成未结合的耐火基材，（d）烧结未结合的耐火基材，和（e）在烧制期间使表面被接合到压缩力。 本文还公开了制备耐火成型体的方法
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公开(公告)号：US20090324830A1
公开(公告)日：2009-12-31
申请号：US12553469
申请日：2009-09-03
IPC分类号： C23C16/22
CPC分类号： H01L51/5253 , C23C14/06 , H01L31/048 , Y02E10/50
摘要： A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.
摘要翻译： 公开了一种用于抑制装置的氧气和水分渗透的方法，包括以下步骤：在所述装置的至少一部分上沉积磷酸铁低液相线温度（LLT）无机材料以产生沉积的磷酸锡LLT材料，并热处理 沉积的LLT材料在基本上无氧和无水的环境中以形成气密密封; 其中沉积LLT材料的步骤包括使用包含钨的电阻加热元件。 还公开了一种有机电子器件，其包括基板，至少一个电子或光电子层和磷酸锡LLT阻挡层，其中电子或光电子层气密地密封在磷酸锡LLT阻挡层和基板之间。 还公开了一种装置，其至少一部分用磷酸铁LLT阻挡层密封。
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公开(公告)号：US08956484B2
公开(公告)日：2015-02-17
申请号：US13685149
申请日：2012-11-26
申请人： William Peter Addiego , Michael John Bennett , Michael Patrick Carson , Jeffrey Scott Davis , Martin Herbert Goller , Benjamin Zain Hanson , Tracey Lynn Timmons
发明人： William Peter Addiego , Michael John Bennett , Michael Patrick Carson , Jeffrey Scott Davis , Martin Herbert Goller , Benjamin Zain Hanson , Tracey Lynn Timmons
CPC分类号： C04B37/001 , C04B35/645 , C04B2235/6567 , C04B2235/96 , C04B2235/963 , C04B2237/343 , C04B2237/348 , C04B2237/52 , C04B2237/78 , C04B2237/80
摘要： Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (Ra) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein.
摘要翻译： 本文公开了不使用粘合剂来粘合诸如锆石基材的耐火基材的方法。 示例性方法包括（a）提供多个难熔组分，每个组分具有至少一个待结合的表面，（b）将待接合的每个表面抛光至200nm的表面粗糙度（Ra）或更细，（c） 要结合的表面以形成未结合的耐火基材，（d）烧结未结合的耐火基材，和（e）在烧制期间使表面被接合到压缩力。 本文还公开了制备耐火成型体的方法。
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公开(公告)号：US08802581B2
公开(公告)日：2014-08-12
申请号：US12856840
申请日：2010-08-16
CPC分类号： C03C3/083 , C03B17/064 , C03C3/085 , C03C3/087 , C03C3/091 , C03C3/093 , C03C4/18 , C03C21/00 , C03C21/002 , C03C2204/00 , Y10T428/315
摘要： A glass that is down-drawable and ion exchangeable. The glass has a temperature T35kp at which the viscosity is 35 kilopoise. T35kp is less than the breakdown temperature Tbreakdown of zircon.
摘要翻译： 一种可下拉和可离子交换的玻璃。 玻璃的温度T35kp，粘度为35千泊。 T35kp小于锆石的击穿温度。
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公开(公告)号：US20080048178A1
公开(公告)日：2008-02-28
申请号：US11509445
申请日：2006-08-24
IPC分类号： H01L51/00 , H01L21/469
CPC分类号： H01L51/5253 , C23C14/06 , H01L31/048 , Y02E10/50
摘要： A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.
摘要翻译： 公开了一种用于抑制装置的氧气和水分渗透的方法，包括以下步骤：在所述装置的至少一部分上沉积磷酸铁低液相线温度（LLT）无机材料以产生沉积的磷酸锡LLT材料，并热处理 沉积的LLT材料在基本上无氧和无水的环境中以形成气密密封; 其中沉积LLT材料的步骤包括使用包含钨的电阻加热元件。 还公开了一种有机电子器件，其包括基板，至少一个电子或光电子层和磷酸锡LLT阻挡层，其中电子或光电子层气密地密封在磷酸铁LLT阻挡层和基板之间。 还公开了一种装置，其至少一部分用磷酸铁LLT阻挡层密封。
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公开(公告)号：US20110045961A1
公开(公告)日：2011-02-24
申请号：US12856840
申请日：2010-08-16
CPC分类号： C03C3/083 , C03B17/064 , C03C3/085 , C03C3/087 , C03C3/091 , C03C3/093 , C03C4/18 , C03C21/00 , C03C21/002 , C03C2204/00 , Y10T428/315
摘要： A glass that is down-drawable and ion exchangeable. The glass has a temperature T35kp which the viscosity is 35 kilopoise. T35kp less than the breakdown temperature Tbreakdown of zircon.
摘要翻译： 一种可下拉和可离子交换的玻璃。 玻璃的温度T35kp，粘度为35千泊。 T35kp小于击穿温度下的锆石。
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公开(公告)号：US07749811B2
公开(公告)日：2010-07-06
申请号：US12553469
申请日：2009-09-03
IPC分类号： H01L21/00
CPC分类号： H01L51/5253 , C23C14/06 , H01L31/048 , Y02E10/50
摘要： A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.
摘要翻译： 公开了一种用于抑制装置的氧气和水分渗透的方法，包括以下步骤：在所述装置的至少一部分上沉积磷酸铁低液相线温度（LLT）无机材料以产生沉积的磷酸锡LLT材料，并热处理 沉积的LLT材料在基本上无氧和无水的环境中以形成气密密封; 其中沉积LLT材料的步骤包括使用包含钨的电阻加热元件。 还公开了一种有机电子器件，其包括基板，至少一个电子或光电子层和磷酸锡LLT阻挡层，其中电子或光电子层气密地密封在磷酸铁LLT阻挡层和基板之间。 还公开了一种装置，其至少一部分用磷酸铁LLT阻挡层密封。
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