公开(公告)号：US07009299B2

公开(公告)日：2006-03-07

申请号：US10021174

申请日：2001-10-29

申请人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

发明人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/32 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00014

摘要： An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture. The melting temperature of the liquid mixture increases with time as the composition changes until the melting temperature of the liquid mixture is about equal to the bonding temperature thereby soldifying the liquid mixture into a bond. The parts are then held at a holding temperature which is higher than the storage temperature to maintain diffusion of the other one of the first and second chemical element layers into the bond. This forms a quantity of the intermetallic compound in the bond which is sufficient to raise the melting temperature of the bond to a desired usage temperature that is substantially above the first melting temperature. The intermetallic compound is typically composed of a ternary solder composition.

摘要翻译： 用于动力学受控部件粘合的改进的方法和焊料组成。 所述方法包括将金属间化合物的至少第一化学元素层施加到第一部分，并将至少第二化学元素层施加到金属间化合物到第二部分。 将第一和第二部分放置在一起，使得化学元件层彼此接触。 将部件从储存温度加热到稍高于将第一和第二部分之一的化学元素层熔化成液体混合物的第一熔融温度的接合温度。 液体混合物的组成随加热过程中的时间而变化，因为其中的金属间化合物的形成通过将第一和第二化学元素层中的另一个逐渐掺入混合物中而变化。 随着组合物变化，液体混合物的熔融温度随着时间的推移而增加，直到液体混合物的熔融温度大约等于粘结温度，从而将液体混合物装入粘合剂中。 然后将部件保持在高于储存温度的保持温度，以保持第一和第二化学元件层中的另一个的扩散进入粘合。 这形成了一定量的粘结中的金属间化合物，其足以使粘结的熔融温度升高到基本上高于第一熔融温度的所需使用温度。 金属间化合物通常由三元焊料组合物组成。

公开(公告)号：US06342442B1

公开(公告)日：2002-01-29

申请号：US09197074

申请日：1998-11-20

申请人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

发明人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00014

摘要： An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture. The melting temperature of the liquid mixture increases with time as the composition changes until the melting temperature of the liquid mixture is about equal to the bonding temperature thereby soldifying the liquid mixture into a bond. The parts are then held at a holding temperature which is higher than the storage temperature to maintain diffusion of the other one of the first and second chemical element layers into the bond. This forms a quantity of the intermetallic compound in the bond which is sufficient to raise the melting temperature of the bond to a desired usage temperature that is substantially above the first melting temperature. The intermetallic compound is typically composed of a ternary solder composition.

摘要翻译： 用于动力学受控部件粘合的改进的方法和焊料组成。 所述方法包括将金属间化合物的至少第一化学元素层施加到第一部分，并将至少第二化学元素层施加到金属间化合物到第二部分。 将第一和第二部分放置在一起，使得化学元件层彼此接触。 将部件从储存温度加热到稍高于将第一和第二部分之一的化学元素层熔化成液体混合物的第一熔融温度的接合温度。 液体混合物的组成随加热过程中的时间而变化，因为其中的金属间化合物的形成通过将第一和第二化学元素层中的另一个逐渐掺入混合物中而变化。 随着组合物变化，液体混合物的熔融温度随着时间的推移而增加，直到液体混合物的熔融温度大约等于粘结温度，从而将液体混合物装入粘合剂中。 然后将部件保持在高于储存温度的保持温度，以保持第一和第二化学元件层中的另一个的扩散进入粘合。 这形成了一定量的粘结中的金属间化合物，其足以将粘结的熔融温度升高到基本上高于第一熔融温度的所需使用温度。 金属间化合物通常由三元焊料组合物组成。