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公开(公告)号：US09010190B2
公开(公告)日：2015-04-21
申请号：US13451790
申请日：2012-04-20
CPC分类号： B81B7/0048 , H01L2224/48147 , H01L2224/48472
摘要： A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.
摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分和基座部分的背衬基板。 可以制造隔膜基板以包括基座部分和隔膜，该隔膜部分和隔膜安装到背衬基板的隔膜背衬部分上以形成应力隔离的MEMS管芯。 背衬和隔膜基板的基座部分形成应力隔离的MEMS管芯的基座。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。
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公开(公告)号：US20130276544A1
公开(公告)日：2013-10-24
申请号：US13451790
申请日：2012-04-20
CPC分类号： B81B7/0048 , H01L2224/48147 , H01L2224/48472
摘要： A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.
摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分和基座部分的背衬基板。 可以制造隔膜基板以包括基座部分和隔膜，该隔膜部分和隔膜安装到背衬基板的隔膜背衬部分上以形成应力隔离的MEMS管芯。 背衬和隔膜基板的基座部分形成应力隔离的MEMS管芯的基座。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。
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