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公开(公告)号：US09010190B2
公开(公告)日：2015-04-21
申请号：US13451790
申请日：2012-04-20
CPC分类号： B81B7/0048 , H01L2224/48147 , H01L2224/48472
摘要： A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.
摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分和基座部分的背衬基板。 可以制造隔膜基板以包括基座部分和隔膜，该隔膜部分和隔膜安装到背衬基板的隔膜背衬部分上以形成应力隔离的MEMS管芯。 背衬和隔膜基板的基座部分形成应力隔离的MEMS管芯的基座。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。
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公开(公告)号：US20130276544A1
公开(公告)日：2013-10-24
申请号：US13451790
申请日：2012-04-20
CPC分类号： B81B7/0048 , H01L2224/48147 , H01L2224/48472
摘要： A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.
摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分和基座部分的背衬基板。 可以制造隔膜基板以包括基座部分和隔膜，该隔膜部分和隔膜安装到背衬基板的隔膜背衬部分上以形成应力隔离的MEMS管芯。 背衬和隔膜基板的基座部分形成应力隔离的MEMS管芯的基座。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。
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公开(公告)号：US20120096943A1
公开(公告)日：2012-04-26
申请号：US12911504
申请日：2010-10-25
IPC分类号： G01C19/56
CPC分类号： G01C19/56 , G01C19/5712
摘要： Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.
摘要翻译： 公开了包括弹簧几何形状的有利组合的弹簧组合。 具有弯曲和直线部分的弹簧元件，相对于公共半径的弹簧元件锚定点的取向，弹簧元件段相对于特定轴线的取向，弹簧元件围绕公共半径的平衡以及关于公共半径的质量平衡 公共半径可用于减少不需要的平面外运动。 弹簧组提供平面运动，同时减少不期望的平面外运动，使得MEMS器件对于弹簧元件的工艺感应蚀刻角度变化基本上不敏感。 弹簧组可以用在MEMS陀螺仪装置中，即使在制造过程中的变化导致不希望的蚀刻角度的情况下，MEMS陀螺仪也保持期望的谐振模式和始终如一的低正交误差。
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公开(公告)号：US20130298699A1
公开(公告)日：2013-11-14
申请号：US13468860
申请日：2012-05-10
申请人： David P. Potasek
发明人： David P. Potasek
CPC分类号： G01L9/0048 , G01L9/0072 , G01L27/007
摘要： A capacitor for use in sensors includes opposed first and second capacitor plates, wherein the second capacitor plate is mounted to the first capacitor plate by a flexible attachment. The flexible attachment is configured and adapted so that flexure of the attachment causes a change in the spacing between the first and second capacitor plates to cause a change in the capacitance thereacross.
摘要翻译： 用于传感器的电容器包括相对的第一和第二电容器板，其中第二电容器板通过柔性附件安装到第一电容器板。 柔性附件被构造和适配，使得附件的挠曲引起第一和第二电容器板之间的间隔的变化，从而导致其间的电容变化。
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公开(公告)号：US07952154B2
公开(公告)日：2011-05-31
申请号：US12579123
申请日：2009-10-14
IPC分类号： H01L29/84
CPC分类号： G01L9/0042 , C23C14/021 , C23C14/022 , C23C14/025 , C23C14/0682 , C23C14/5806 , C23C14/5846 , C23C14/5873 , G01L9/0054 , G01L9/008 , G01L19/0061 , G01L19/0069 , G01L19/0076 , G01L19/0084 , G01L19/0609 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/05553 , H01L2224/45169 , H01L2224/48472 , H01L2224/81805 , H01L2224/83805 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/3025 , H01L2924/00
摘要： A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.
摘要翻译： 一种恶劣环境换能器，包括具有第一表面和第二表面的基底，其中第二表面与环境连通。 换能器包括位于基板上的用于测量与环境有关的参数的装置层传感器装置。 传感器装置包括厚度小于约0.5微米的单晶半导体材料。 换能器还包括位于基板上并与传感器装置电连通的输出触点。 换能器包括具有内部封装空间和用于与环境通信的端口的封装。 该封装在内部封装空间中接收衬底，使得衬底的第一表面基本上与环境隔离，并且衬底的第二表面基本上通过端口暴露于环境。 传感器还包括耦合到封装件的连接部件和将连接部件和输出触头电连接的导线，使得传感器装置的输出可以被传送。 导线的外表面基本上是铂，并且输出触点和连接部件中的至少一个的外表面基本上是铂。
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公开(公告)号：US08984950B2
公开(公告)日：2015-03-24
申请号：US13468860
申请日：2012-05-10
申请人： David P. Potasek
发明人： David P. Potasek
CPC分类号： G01L9/0048 , G01L9/0072 , G01L27/007
摘要： A capacitor for use in sensors includes opposed first and second capacitor plates, wherein the second capacitor plate is mounted to the first capacitor plate by a flexible attachment. The flexible attachment is configured and adapted so that flexure of the attachment causes a change in the spacing between the first and second capacitor plates to cause a change in the capacitance thereacross.
摘要翻译： 用于传感器的电容器包括相对的第一和第二电容器板，其中第二电容器板通过柔性附件安装到第一电容器板。 柔性附件被构造和适配，使得附件的挠曲引起第一和第二电容器板之间的间隔的变化，从而导致其间的电容变化。
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公开(公告)号：US20100155866A1
公开(公告)日：2010-06-24
申请号：US12579123
申请日：2009-10-14
CPC分类号： G01L9/0042 , C23C14/021 , C23C14/022 , C23C14/025 , C23C14/0682 , C23C14/5806 , C23C14/5846 , C23C14/5873 , G01L9/0054 , G01L9/008 , G01L19/0061 , G01L19/0069 , G01L19/0076 , G01L19/0084 , G01L19/0609 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/05553 , H01L2224/45169 , H01L2224/48472 , H01L2224/81805 , H01L2224/83805 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/3025 , H01L2924/00
摘要： A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.
摘要翻译： 一种恶劣环境换能器，包括具有第一表面和第二表面的基底，其中第二表面与环境连通。 换能器包括位于基板上的用于测量与环境有关的参数的装置层传感器装置。 传感器装置包括厚度小于约0.5微米的单晶半导体材料。 换能器还包括位于基板上并与传感器装置电连通的输出触点。 换能器包括具有内部封装空间和用于与环境通信的端口的封装。 该封装在内部封装空间中接收衬底，使得衬底的第一表面基本上与环境隔离，并且衬底的第二表面基本上通过端口暴露于环境。 传感器还包括耦合到封装件的连接部件和将连接部件和输出触头电连接的导线，使得传感器装置的输出可以被传送。 导线的外表面基本上是铂，并且输出触点和连接部件中的至少一个的外表面基本上是铂。
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