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    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME
    2.
    发明申请
    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME 审中-公开
    电子设备及其制造方法

    公开(公告)号：US20110222222A1

    公开(公告)日：2011-09-15

    申请号：US13108573

    申请日：2011-05-16

    申请人： CHARLES DOUGLAS MACPHERSON ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    发明人： CHARLES DOUGLAS MACPHERSON ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    IPC分类号： H05K7/00 ,  B05D5/00 ,  H05K13/00 ,  B05D1/36

    CPC分类号： H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

    摘要： An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

    摘要翻译： 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

    Methods for forming an undercut region and electronic devices incorporating the same
    3.
    发明授权
    Methods for forming an undercut region and electronic devices incorporating the same 失效
    形成底切区域的方法和包含该切削区域的电子装置

    公开(公告)号：US07732810B2

    公开(公告)日：2010-06-08

    申请号：US11840392

    申请日：2007-08-17

    申请人： Nugent Truong ,  Charles Douglas Macpherson

    发明人： Nugent Truong ,  Charles Douglas Macpherson

    IPC分类号： H01L51/50

    CPC分类号： H01L51/0003 ,  H01L27/3246 ,  H01L27/3283

    摘要： An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

    摘要翻译： 提供具有底切区域的基板结构的电子设备，并且还包括用于形成基板结构的底切区域的方法。 该方法包括在第一电极上形成图案化保护层。 该方法还包括在图案化的保护层上形成衬底结构。 衬底结构内的开口覆盖衬底结构的暴露部分。 该方法还包括去除图案化保护层的暴露部分，从而暴露第一电极的一部分并形成衬底结构的底切区域。 该方法还包括在去除图案化保护层的暴露部分之后，在第一电极上沉积液体，并固化液体以形成固体层。

    Processes for printing layers for electronic devices and printing apparatuses for performing the processes
    4.
    发明授权
    Processes for printing layers for electronic devices and printing apparatuses for performing the processes 有权
    印刷用于电子设备和打印设备的层的处理

    公开(公告)号：US07584701B2

    公开(公告)日：2009-09-08

    申请号：US11026265

    申请日：2004-12-30

    申请人： Charles Douglas MacPherson ,  Dennis Damon Walker ,  Matthew Stainer

    发明人： Charles Douglas MacPherson ,  Dennis Damon Walker ,  Matthew Stainer

    IPC分类号： B41L35/14

    CPC分类号： H01L51/0005 ,  H01L51/56

    摘要： An electronic device includes a printed layer. In one embodiment, a process for forming the electronic device includes placing a workpiece over a chuck within a printing apparatus. A temperature difference is established between the workpiece and a liquid composition. The process further includes continuously printing the liquid composition over the workpiece. A viscosity of the liquid composition is allowed to increase at a rate significantly higher than an ambient viscosity increase rate. In another embodiment, the workpiece is allowed to cool to a temperature significantly below an ambient temperature before printing occurs. In still another embodiment, a printing apparatus is used for continuously printing the liquid composition over the workpiece. The printing apparatus includes the chuck, a printing head, a container, a feed line, and a first temperature-adjusting element thermally coupled to the chuck, the printing head, the container the feed line, or a combination thereof.

    摘要翻译： 电子设备包括印刷层。 在一个实施例中，用于形成电子设备的过程包括将工件放置在打印设备内的卡盘上。 在工件和液体组合物之间建立温度差。 该方法还包括将液体组合物连续地印刷在工件上。 允许液体组合物的粘度以显着高于环境粘度增加速率的速率增加。 在另一个实施例中，允许工件在印刷发生之前冷却到明显低于环境温度的温度。 在另一个实施例中，使用印刷设备将液体组合物连续地印刷在工件上。 打印装置包括卡盘，打印头，容器，进料管线和与卡盘热连接的第一温度调节元件，打印头，容器进料管线或其组合。

    Methods for forming an undercut region and electronic devices incorporating the same
    5.
    发明授权
    Methods for forming an undercut region and electronic devices incorporating the same 有权
    形成底切区域的方法和包含该切削区域的电子装置

    公开(公告)号：US07276453B2

    公开(公告)日：2007-10-02

    申请号：US10915578

    申请日：2004-08-10

    申请人： Nugent Truong ,  Charles Douglas MacPherson

    发明人： Nugent Truong ,  Charles Douglas MacPherson

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： H01L51/0003 ,  H01L27/3246 ,  H01L27/3283

    摘要： An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

    摘要翻译： 提供具有底切区域的基板结构的电子设备，并且还包括用于形成基板结构的底切区域的方法。 该方法包括在第一电极上形成图案化保护层。 该方法还包括在图案化的保护层上形成衬底结构。 衬底结构内的开口覆盖衬底结构的暴露部分。 该方法还包括去除图案化保护层的暴露部分，从而暴露第一电极的一部分并形成衬底结构的底切区域。 该方法还包括在去除图案化保护层的暴露部分之后，在第一电极上沉积液体，并固化液体以形成固体层。

    PROCESSES FOR FORMING ELECTRONIC DEVICES INCLUDING SPACED-APART RADIATION REGIONS
    8.
    发明申请
    PROCESSES FOR FORMING ELECTRONIC DEVICES INCLUDING SPACED-APART RADIATION REGIONS 有权
    用于形成包括间隔辐射区域的电子设备的方法

    公开(公告)号：US20100291721A1

    公开(公告)日：2010-11-18

    申请号：US12846979

    申请日：2010-07-30

    申请人： CHARLES DOUGLAS MACPHERSON ,  Gordana Srdanov ,  Gang Yu

    发明人： CHARLES DOUGLAS MACPHERSON ,  Gordana Srdanov ,  Gang Yu

    IPC分类号： H01L33/08

    CPC分类号： H01L51/56 ,  H01L27/3246 ,  H01L27/3283 ,  H01L51/0004 ,  H01L51/52

    摘要： Processes for forming an electronic device include forming a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. A process for forming the electronic device can include patterning an insulating layer.

    摘要翻译： 用于形成电子器件的工艺包括形成第一辐射区域，与第一辐射区域间隔开的第二辐射区域和绝缘区域。 绝缘区域可以具有与第一侧相对的第一侧和第二侧。 第一辐射区域可以紧邻第一侧面，并且第二辐射区域可以紧邻第二侧面。 在绝缘区域内，在第一和第二辐射区域之间不会有其他辐射区域，并且绝缘区域可以包括包括多个开口的绝缘层。 形成电子器件的方法可以包括图案化绝缘层。

    METHODS FOR FORMING AN UNDERCUT REGION AND ELECTRONIC DEVICES INCORPORATING THE SAME
    9.
    发明申请
    METHODS FOR FORMING AN UNDERCUT REGION AND ELECTRONIC DEVICES INCORPORATING THE SAME 失效
    形成下属区域的方法和包含该方法的电子设备

    公开(公告)号：US20080210931A1

    公开(公告)日：2008-09-04

    申请号：US11840392

    申请日：2007-08-17

    申请人： Nugent Truong ,  Charles Douglas Macpherson

    发明人： Nugent Truong ,  Charles Douglas Macpherson

    IPC分类号： H01L51/50

    CPC分类号： H01L51/0003 ,  H01L27/3246 ,  H01L27/3283

    摘要： An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

    摘要翻译： 提供具有底切区域的基板结构的电子设备，并且还包括用于形成基板结构的底切区域的方法。 该方法包括在第一电极上形成图案化保护层。 该方法还包括在图案化的保护层上形成衬底结构。 衬底结构内的开口覆盖衬底结构的暴露部分。 该方法还包括去除图案化保护层的暴露部分，从而暴露第一电极的一部分并形成衬底结构的底切区域。 该方法还包括在去除图案化保护层的暴露部分之后，在第一电极上沉积液体，并固化液体以形成固体层。