公开(公告)号：US20180247836A1

公开(公告)日：2018-08-30

申请号：US15859480

申请日：2017-12-30

Applicant: Samsung Electronics Co., Ltd. ,  CYMECHS Inc.

Inventor： Heokjae LEE ,  Hahn PARK ,  Jae Boo KIM ,  Dongil YOON ,  MinYoung HWANG ,  Se Un PARK ,  Kang-Min PARK ,  Yongjoon HONG ,  Sung Baek KIM ,  Woo Jin PARK

IPC: H01L21/67 ,  B08B7/00

CPC classification number: H01L21/67034 ,  B08B7/0071 ,  H01L21/67017 ,  H01L21/67115 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67748 ,  H01L21/67778

Abstract: A removal apparatus for removing residual gases and a substrate treating facility for removing residual gases is disclosed. The residual gas removal apparatus includes a housing, a gas supply for providing a non-reactive gas into the housing, a supporting member provided to support a substrate and positioned in the housing, a heat radiating member spaced apart from the supporting member and positioned in the housing, and a heating unit for providing heat toward the supporting member and positioned between the heat radiating member and the supporting member.

公开(公告)号：US10892171B2

公开(公告)日：2021-01-12

申请号：US15859480

申请日：2017-12-30

Applicant: Samsung Electronics Co., Ltd. ,  CYMECHS Inc.

Inventor： Heokjae Lee ,  Hahn Park ,  Jae Boo Kim ,  Dongil Yoon ,  MinYoung Hwang ,  Se Un Park ,  Kang-Min Park ,  Yongjoon Hong ,  Sung Baek Kim ,  Woo Jin Park

IPC: B08B7/00 ,  H01L21/67 ,  H01L21/677

Abstract: A removal apparatus for removing residual gases and a substrate treating facility for removing residual gases is disclosed. The residual gas removal apparatus includes a housing, a gas supply for providing a non-reactive gas into the housing, a supporting member provided to support a substrate and positioned in the housing, a heat radiating member spaced apart from the supporting member and positioned in the housing, and a heating unit for providing heat toward the supporting member and positioned between the heat radiating member and the supporting member.