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公开(公告)号：USD748952S1
公开(公告)日：2016-02-09
申请号：US29491412
申请日：2014-05-21
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公开(公告)号：USD757436S1
公开(公告)日：2016-05-31
申请号：US29491369
申请日：2014-05-20
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公开(公告)号：USD726414S1
公开(公告)日：2015-04-14
申请号：US29491374
申请日：2014-05-20
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公开(公告)号：US06869637B2
公开(公告)日：2005-03-22
申请号：US10362087
申请日：2001-09-21
摘要： Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.
摘要翻译： 改善印刷电路板上铜表面的可焊性的已知方法存在这样的缺点，即在金属表面形成不规则厚度的外层，这些层非常昂贵，或者用于制造它们的组分对环境有害。 此外，金属表面也适合于形成接合连接以及电接点。 为了克服这些问题，公开了一种浴和一种通过电荷交换反应在金属表面上进行化学镀银的方法，所述金属的表面比银，更特别地在铜上，比含有至少一个卤化银配合物的不贵， 任何Ag +离子还原剂。
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