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1.发明申请公开(公告)号：US20100133691A1
公开(公告)日：2010-06-03
申请号：US12698189
申请日：2010-02-02
IPC分类号： H01L23/50
CPC分类号： H01L21/76895 , H01L23/34 , H01L23/522 , H01L23/576 , H01L2924/0002 , Y10S438/917 , H01L2924/00
摘要： An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires.
摘要翻译： 互连和互连方法。 该方法包括在基底上形成电介质层，介电层具有顶表面和底表面; 在所述电介质层中形成第一线和第二线，所述第一线与所述第二线分离，通过所述介电层的区域; 并且在第一和第二布线之间的电介质层的顶表面中或上方形成金属纳米颗粒，仅在将纳米颗粒加热到大于室温的温度时能够电连接第一布线和第二布线的金属纳米颗粒， 在第一和第二导线之间施加电压。
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2.发明申请公开(公告)号：US20090212431A1
公开(公告)日：2009-08-27
申请号：US12035448
申请日：2008-02-22
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76895 , H01L23/34 , H01L23/522 , H01L23/576 , H01L2924/0002 , Y10S438/917 , H01L2924/00
摘要： An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires.
摘要翻译： 互连和互连方法。 该方法包括在基底上形成电介质层，介电层具有顶表面和底表面; 在所述电介质层中形成第一线和第二线，所述第一线与所述第二线分离，通过所述介电层的区域; 并且在第一和第二布线之间的电介质层的顶表面中或上方形成金属纳米颗粒，仅在将纳米颗粒加热到大于室温的温度时能够电连接第一布线和第二布线的金属纳米颗粒， 在第一和第二导线之间施加电压。
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3.发明授权Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature 有权其中互连仅在室温以上被加热时才进行热可编程的反向逆向工程互连公开(公告)号：US07843062B2
公开(公告)日：2010-11-30
申请号：US12698189
申请日：2010-02-02
IPC分类号： H01L23/485 , H01L23/532 , H01L21/477 , H01L21/4763 , H01L21/469 , H01L21/768
CPC分类号： H01L21/76895 , H01L23/34 , H01L23/522 , H01L23/576 , H01L2924/0002 , Y10S438/917 , H01L2924/00
摘要： An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires.
摘要翻译： 互连和互连方法。 该方法包括在基底上形成电介质层，介电层具有顶表面和底表面; 在所述电介质层中形成第一线和第二线，所述第一线与所述第二线分离，通过所述介电层的区域; 并且在第一和第二布线之间的电介质层的顶表面中或上方形成金属纳米颗粒，仅在将纳米颗粒加热到大于室温的温度时能够电连接第一布线和第二布线的金属纳米颗粒， 在第一和第二导线之间施加电压。
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4.发明授权Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature 失效制造热可编程抗反向工程互连的方法，其中互连仅在室温以上被加热时才导通公开(公告)号：US07709401B2
公开(公告)日：2010-05-04
申请号：US12035448
申请日：2008-02-22
IPC分类号： H01L21/477 , H01L21/4763 , H01L21/469 , H01L21/768 , H01L23/485 , H01L23/532
CPC分类号： H01L21/76895 , H01L23/34 , H01L23/522 , H01L23/576 , H01L2924/0002 , Y10S438/917 , H01L2924/00
摘要： An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires.
摘要翻译： 互连和互连方法。 该方法包括在基底上形成电介质层，介电层具有顶表面和底表面; 在所述电介质层中形成第一线和第二线，所述第一线与所述第二线分离，通过所述介电层的区域; 并且在第一和第二布线之间的电介质层的顶表面中或上方形成金属纳米颗粒，仅在将纳米颗粒加热到大于室温的温度时能够电连接第一布线和第二布线的金属纳米颗粒， 在第一和第二导线之间施加电压。
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