公开(公告)号：US06437429B1

公开(公告)日：2002-08-20

申请号：US09852641

申请日：2001-05-11

申请人： Chun-Jen Su ,  Chien-Hung Lai ,  Chien-Tsun Lin ,  Chao-Chia Chang ,  Yu-Hsien Su ,  Ming-Hui Tseng

发明人： Chun-Jen Su ,  Chien-Hung Lai ,  Chien-Tsun Lin ,  Chao-Chia Chang ,  Yu-Hsien Su ,  Ming-Hui Tseng

IPC分类号： H01L23495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.

摘要翻译： 公开了一种半导体封装，例如QFN，SON。 半导体封装包括管芯，用于保护管芯的封装体和多个引线。 由每个引线的一些部分下表面形成的金属焊盘位于封装体的下表面上，具有共面性。 每个引线具有暴露在封装体的相应侧表面上的切割表面。 通过选择性地自动蚀刻引线或冲压以使引线弯曲，切割表面具有与形成金属焊盘的平面的间隔，以避免在切割之后在金属焊盘的边缘中形成切割尖锐边缘。