Silicide blocking process to form non-silicided regions on MOS devices
    1.
    发明授权
    Silicide blocking process to form non-silicided regions on MOS devices 有权
    在MOS器件上形成非硅化物区域的硅化物阻挡工艺

    公开(公告)号:US6121092A

    公开(公告)日:2000-09-19

    申请号:US243552

    申请日:1999-02-02

    CPC分类号: H01L27/0266

    摘要: A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and silicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.

    摘要翻译: 半导体器件形成在具有ESD区域和内部区域的衬底上。 在ESD区域的一部分上形成保护层以防止硅化物的形成,并且在保护层未保护的内部和ESD区域的部分上形成硅化物。 保护层的一部分被去除,以将保护层的剩余部分形成为与包括在ESD区域中的栅电极相邻的侧壁间隔。

    Silicide blocking process to form non-silicided regions on MOS devices
    2.
    发明授权
    Silicide blocking process to form non-silicided regions on MOS devices 有权
    在MOS器件上形成非硅化物区域的硅化物阻挡工艺

    公开(公告)号:US06259140B1

    公开(公告)日:2001-07-10

    申请号:US09410360

    申请日:1999-09-30

    IPC分类号: H01L2362

    CPC分类号: H01L27/0266

    摘要: A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and suicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.

    摘要翻译: 半导体器件形成在具有ESD区域和内部区域的衬底上。 在ESD区域的一部分上形成保护层以防止硅化物的形成,并且在保护层未保护的内部和ESD区域的部分上形成硅化物。 保护层的一部分被去除,以将保护层的剩余部分形成为与包括在ESD区域中的栅电极相邻的侧壁间隔。