摘要:
A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and silicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.
摘要:
A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and suicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.
摘要:
An ESD protection structure for protecting an internal circuit comprising a primary protection device, a secondary protection device, and a substrate pickup is presented. The primary protection device and secondary protection device share a common source, and this common source implementation lowers the trigger voltage of the primary protection device to be about the same as the trigger voltage of the secondary protection device, thereby eliminating the need to use an isolation resistor between the primary and secondary protection devices.
摘要:
A self-protected output driver for an integrated circuit utilizing cascode configured MOSFET transistors is formed in a single active region, allowing a smaller layout area without sacrificing performance. Furthermore, the driver is laid out according to a standard cell layout and is adaptable for a variety of output driving specifications according to the need of a particular implementation. A doped region having a first conductivity type is formed in the substrate. A plurality of sets of cascode connected transistors having channels in the doped region is included. Sets of cascode connected transistors in the plurality include a first diffusion region, a second diffusion region on a first side of and separated from the first diffusion region by a channel of a first transistor, a third diffusion region on a second side of and separated from the first diffusion region by a channel of the second transistor, a fourth diffusion region on a first side of and separated from the second diffusion region by a channel of a third transistor, a fifth diffusion region on a second side of and separated from the third diffusion region by a channel of a fourth transistor. Gate structures are formed over the channels of the first, second, third and fourth transistors. An interconnect structure couples the first diffusion region to the contact pad, the fourth and fifth diffusion regions to the second supply terminal, the gate structures of the first and second transistors to a first supply terminal, the gate structure of the third transistor to a selected one of the second supply terminal and a signal source, and the gate structure of the fourth transistor to a selected one of the signal source and the second supply terminal. The structure acts typically as a pull-down stage for an output driver on an integrated circuit. A pull-up transistor is included in the complete circuit. The diffusion regions between the first and third transistor and between the second and fourth transistor are formed without silicide.
摘要:
A memory cell having an asymmetric source and drain connection to buried bit-lines providing a Fowler-Nordheim tunneling region and a non-tunneling region defined by a bird's beak encroachment on each of the cells. A nonvolatile semiconductor memory device comprising row and column arrangement of the cells in which adjacent columns of cells share a single bit-line. The method for manufacturing a memory cell having asymmetric source and drain regions and comprising the steps of: (1) forming a dielectric covering a semiconductor substrate of a first conductivity type; (2) forming a column of floating gates on the dielectric; (3) forming an inhibit mask adjacent a first side of the column of floating gates; (4) implanting a dopant adjacent the first side and a second side of the column of floating gates, the first dopant having a second conductivity type opposite the first conductivity type; (5) forming a thermal oxide adjacent the first and second side of the column of floating gates such that the dopant adjacent the first side of the column is separated from the floating gates by the dielectric and the dopant adjacent the second side of the column is separated from the floating gates by a bird's beak encroachment of the thermal oxide formation; and (6) completing formation of control gate dielectric and control gates.
摘要:
Mask ROMS with fixed code implantation and associated integrated circuits are described. An integrated circuit has a Mask ROM including: an array of memory cells including a first bank of memory cells and a second bank of memory cells, and the first bank of memory cells separated from the second bank of memory cell by a set of select lines, and the first bank of memory cells and the second bank of memory cells includes at least one fixed code implanted memory cell column. The use of fixed code implantation results in a single current path during the reading of a given memory cell and permits the size of the corresponding device to be reduced and have better topography. The Mask ROM provides additional advantages because the use of the same select transistors for two banks reduces the overhead of select transistors for a given size of array, the use of only one sense amplifier per block reduces the overhead of sense amplifiers for a given size of array, and the use of odd and even word line decoders divides the memory cell array into a number of banks.
摘要:
A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a substrate, a gate structure, a first doped region, a second doped region and a pair of isolation structures. The gate structure is disposed on the substrate. The gate structure includes a charge storage structure, a gate and spacers. The charge storage structure is disposed on the substrate. The gate is disposed on the charge storage structure. The spacers are disposed on the sidewalls of the gate and the charge storage structure. The first doped region and the second doped region are respectively disposed in the substrate at two sides of the charge storage structure and at least located under the spacers. The isolation structures are respectively disposed in the substrate at two sides of the gate structure.
摘要:
An electrostatic discharge (ESD) protection device electronically connected to a pad is provided. The ESD protection device includes K PNP transistors and a protection circuit, wherein K is a positive integer. An emitter of the 1st PNP transistor is electronically connected to the pad, a base of the ith PNP transistor is electronically connected to an emitter of the (i+1)th PNP transistor, and collectors of the K PNP transistors are electronically connected to a ground, wherein i is an integer and 1≦i≦(K−1). The protection circuit is electronically connected between a base of the Kth PNP transistor and the ground and provides a discharge path. An electrostatic signal from the pad is conducted to the ground through the discharge path and the K PNP transistors.
摘要:
An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting a main voltage distribution group and a plurality of secondary voltage distribution groups, wherein each of the main voltage distribution group and the secondary voltage distribution groups includes N threshold-voltage distribution curves, and N is an integer greater than 2; selecting a first operation level and a second operation level according to a programming command; programming the first storage position according to the threshold-voltage distribution curve corresponding to the first operation level in the main voltage distribution group; selecting one of the secondary voltage distribution groups according to the first operation level and programming the second storage position according to the threshold-voltage distribution curve corresponding to the second operation level in the selected secondary voltage distribution group.
摘要:
An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting N threshold-voltage distribution curves, wherein the N threshold-voltage distribution curves correspond to N levels and N is an integer greater than 2; programming the first and the second storage positions to the 1st level and an auxiliary level respectively according to the 1st threshold-voltage distribution curve and a threshold-voltage auxiliary curve when the first and the second storage positions are programmed to the 1st and Nth levels; and programming the first and the second storage positions to the ith level according to the ith threshold-voltage distribution curve when the first and the second storage positions are not to be programmed to the 1st and Nth levels, wherein i is an integer and 1≦i≦N.