公开(公告)号：US20100127047A1

公开(公告)日：2010-05-27

申请号：US12352979

申请日：2009-01-13

Applicant: Cheng-En Ho ,  Wei-Hsiang Wu ,  Cheng-Shiuan Lin

Inventor： Cheng-En Ho ,  Wei-Hsiang Wu ,  Cheng-Shiuan Lin

IPC: B23K31/02

CPC classification number: B23K1/20 ,  B23K35/262 ,  B23K35/268 ,  B23K35/40 ,  H05K3/244 ,  H05K3/3463

Abstract: A method of inhibiting a formation of palladium-nickel-tin (Pd—Ni—Sn) intermetallic in solder joints is described as follows. Firstly, a solder alloy is provided. Then, at least one of a trace of copper and a trace of zinc is doped into the solder alloy. Afterward, the solder alloy is disposed on the Pd-bearing surface finish, such as a Pd/Ni bi-layer or a Au/Pd/Ni tri-layer. Next, the solder alloy is soldered with the surface finish as solder joints. During the soldering, the Cu and Zn will incorporate into the soldering reaction, forming copper-palladium-nickel-tin intermetallic and zinc-palladium-nickel-tin intermetallic, replacing the Pd—Ni—Sn respectively. Consequently, the addition of Cu and/or Zn into solders will inhibit the undesirable Pd—Ni—Sn intermetallic to form in the solder joints.

Abstract translation: 描述了在焊接接头中抑制钯 - 镍 - 锡（Pd-Ni-Sn）金属间化合物形成的方法。 首先，提供焊料合金。 然后，将铜和痕量锌中的至少一种掺杂到焊料合金中。 之后，将焊料合金设置在Pd载体表面光洁度上，例如Pd / Ni双层或Au / Pd / Ni三层。 接下来，焊接合金以表面光洁度焊接作为焊点。 在焊接过程中，Cu和Zn将引入焊接反应，形成铜 - 钯 - 镍 - 锡金属间化合物和锌 - 钯 - 镍 - 锡金属间化合物，分别代替Pd-Ni-Sn。 因此，将Cu和/或Zn添加到焊料中将抑制在焊点中形成不期望的Pd-Ni-Sn金属间化合物。