公开(公告)号：US08049650B2

公开(公告)日：2011-11-01

申请号：US12727522

申请日：2010-03-19

Applicant: Chun-Wei Lin ,  Cheng-En Ho

Inventor： Chun-Wei Lin ,  Cheng-En Ho

IPC: H03M1/10

CPC classification number: H03M1/109 ,  H03M1/66

Abstract: A method for testing a digital to analog converter, which operates in an undersampling environment, wherein signals of a tested DAC and a signal generator are modulated by a PWM device and then processed by a digital processing circuit to generate a digital signal, whereby is formed a low-speed equivalent ADC. The signal generator is provided by uniform-distribution random test patterns, and the signal generator generates an uniform-distribution random analog signal to the equivalent ADC. Thereby, the test error caused by the non-ideality of the signal generator is corrected, and the tested circuit can work in a full speed.

Abstract translation: 一种用于测试在欠采样环境中操作的数模转换器的方法，其中测试DAC和信号发生器的信号由PWM装置调制，然后由数字处理电路处理以产生数字信号，由此形成 低速等效ADC。 信号发生器由均匀分布随机测试模式提供，信号发生器产生均匀分布随机模拟信号到等效ADC。 因此，由信号发生器的非理想性引起的测试误差被校正，并且被测电路可以全速工作。

公开(公告)号：US06602777B1

公开(公告)日：2003-08-05

申请号：US10104085

申请日：2002-03-20

Applicant: Cheng-Heng Kao ,  Cheng-En Ho

Inventor： Cheng-Heng Kao ,  Cheng-En Ho

IPC: H01L2144

CPC classification number: H05K3/3463 ,  B23K35/262 ,  H01L2924/00013 ,  H05K3/244 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2224/13099

Abstract: The present invention relates to a method for controlling the formation of the intermetallic compounds in solder joints, The types of the intermetallic compounds between the SnAgCu solders and the Ni-bearing substrate can be controlled by adjusting the copper concentration in the SnAgCu solders. If the SnAgCu solder has a copper concentration higher than or equivalent to 0.6 wt. %, the soldering intermetallic compound includes a continuous (Cu1−xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is lower than or equivalent to 0.4 wt. %, the soldering intermetallic compound includes a continuous (Ni1−yCuy)3Sn4 layer and a non-continuous (Cu1−xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is between 0.4 wt. % to 0.6 wt. %, the soldering intermetallic compound includes the continuous (Cu1−xNix)6Sn5.

Abstract translation: 本发明涉及一种用于控制焊点中金属间化合物形成的方法。SnAgCu焊料和含Ni基材之间的金属间化合物的类型可以通过调节SnAgCu焊料中的铜浓度来控制。 如果SnAgCu焊料的铜浓度高于或等于0.6wt。 ％，焊接金属间化合物包括连续（Cu1-xNix）6Sn5层。 如果SnAgCu焊料的铜浓度低于或等于0.4wt。 ％，焊接金属间化合物包括连续（Ni1-yCuy）3Sn4层和非连续（Cu1-xNix）6Sn5层。 如果SnAgCu焊料的铜浓度在0.4wt。 ％至0.6wt。 ％，焊接金属间化合物包括连续（Cu1-xNix）6Sn5。

公开(公告)号：US08702878B2

公开(公告)日：2014-04-22

申请号：US13182432

申请日：2011-07-13

Applicant: Cheng-En Ho ,  Bo-Zong Chen ,  Chih-Nan Chen

Inventor： Cheng-En Ho ,  Bo-Zong Chen ,  Chih-Nan Chen

IPC: B23K35/28

CPC classification number: B23K1/0016

Abstract: A method for controlling the beta-tin crystal orientation in solder joints is provided. The method is suitable for joining metallization pads using a solder containing tin and silver. By adjusting the silver content in the solder within a specific range of equal to or more than 2.5 wt. % and less than 3.2 wt. %, the [001] axes of beta-tin crystals in the solder is aligned to be in the direction parallel with a solder/metallization pad interface substantially. Electromigration-induced solder deformations and metallization pad consumption can be significantly reduced when solder joints have such a microstructure. Additionally, the undesired Ag3Sn plates in the solder matrix can be avoided accordingly.

Abstract translation: 提供了一种用于控制焊点中β-tin晶体取向的方法。 该方法适用于使用含锡和银的焊料连接金属化焊盘。 通过调整焊料中的银含量等于或大于2.5重量％的特定范围。 ％且小于3.2wt。 ％，焊料中β-tin晶体的[001]轴基本上与焊料/金属化焊盘界面平行的方向排列。 当焊点具有这样的微观结构时，电迁移诱导的焊料变形和金属化焊盘消耗可以显着降低。 另外，可以相应地避免焊料基质中不期望的Ag 3 Sn板。

公开(公告)号：US20130008288A1

公开(公告)日：2013-01-10

申请号：US13182432

申请日：2011-07-13

Applicant: Cheng-En Ho ,  Bo-Zong Chen ,  Chih-Nan Chen

Inventor： Cheng-En Ho ,  Bo-Zong Chen ,  Chih-Nan Chen

IPC: B23K31/00

CPC classification number: B23K1/0016

Abstract: A method for controlling the beta-tin crystal orientation in solder joints is provided. The method is suitable for joining metallization pads using a solder containing tin and silver. By adjusting the silver content in the solder within a specific range of equal to or more than 2.5 wt. % and less than 3.2 wt. %, the [001] axes of beta-tin crystals in the solder is aligned to be in the direction parallel with a solder/metallization pad interface substantially. Electromigration-induced solder deformations and metallization pad consumption can be significantly reduced when solder joints have such a microstructure. Additionally, the undesired Ag3Sn plates in the solder matrix can be avoided accordingly.

Abstract translation: 提供了一种用于控制焊点中β-tin晶体取向的方法。 该方法适用于使用含锡和银的焊料连接金属化焊盘。 通过调整焊料中的银含量等于或大于2.5重量％的特定范围。 ％且小于3.2wt。 ％，焊料中β-tin晶体的[001]轴基本上与焊料/金属化焊盘界面平行的方向排列。 当焊点具有这样的微观结构时，电迁移诱导的焊料变形和金属化焊盘消耗可以显着降低。 另外，可以相应地避免焊料基质中不期望的Ag 3 Sn板。

公开(公告)号：US08092621B2

公开(公告)日：2012-01-10

申请号：US12776607

申请日：2010-05-10

Applicant: Cheng-En Ho ,  Chi-Ming Lin

Inventor： Cheng-En Ho ,  Chi-Ming Lin

IPC: B23K38/28 ,  B23K31/02

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/14 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract translation: 焊接接头的（Cu，Ni）6Sn5 /镍界面处的镍 - 铜 - 锡 - 金属间化合物（即（Ni，Cu）3Sn4）层的生长抑制方法如下所述。 提供Cu含量为0.5〜1重量％（重量％）的Sn-Ag-Cu焊料合金。 焊料合金设置在具有镍基金属化层的焊盘的表面光洁度上。 焊料合金的材料还包括钯。 焊料合金与表面光洁度相结合，以形成含钯的焊点，其能够抑制（Cu，Ni）6 Sn 5和镍之间不期望的（Ni，Cu）3 Sn 4层在随后的使用中的生长 温度范围从100°C到180°C

公开(公告)号：US20130153646A1

公开(公告)日：2013-06-20

申请号：US13442865

申请日：2012-04-10

Applicant: Cheng-En Ho

Inventor： Cheng-En Ho

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/203 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/302 ,  B23K35/34 ,  B23K2101/42

Abstract: The embodiment of the present invention relates to a method for suppressing Kirkendall voids formation in a solder joint. A solder alloy doped with 0.1˜0.7 weight percent (wt. %) of palladium (Pd) is utilized. Before soldering, the solder alloy is disposed on a copper (Cu) pad, possibly treated with a surface finish. Subsequently, the solder alloy is joined with the Cu pad, so as to form the solder joint with a Cu/Cu3Sn/(Cu,Pd)6Sn5/solder structure. The formation of Kirkendall voids at the Cu/Cu3Sn interface is greatly suppressed in the presence of Pd in the solder. As the amount of Pd doped is minimal, the properties and the processing conditions for soldering are not changed to a large extent, and the mechanical reliability of the solder joint is significantly improved. Therefore, the present invention is suitable for the microelectronic packaging applications.

Abstract translation: 本发明的实施例涉及一种用于抑制焊点中Kirkendall空隙形成的方法。 使用掺杂有0.1〜0.7重量百分比（重量％）钯（Pd）的焊料合金。 在焊接之前，焊料合金设置在铜（Cu）焊盘上，可能用表面光洁度处理。 随后，焊料合金与Cu焊盘接合，以形成具有Cu / Cu 3 Sn /（Cu，Pd）6 Sn 5 /焊料结构的焊点。 在焊料中存在Pd时，Cu / Cu 3 Sn界面处的Kirkendall孔隙的形成受到极大的抑制。 随着Pd掺杂量的降低，钎焊的性能和加工条件并没有大的变化，焊点的机械可靠性明显提高。 因此，本发明适用于微电子封装应用。

公开(公告)号：US20110227769A1

公开(公告)日：2011-09-22

申请号：US12727522

申请日：2010-03-19

Applicant: Chun-Wei Lin ,  Cheng-En Ho

Inventor： Chun-Wei Lin ,  Cheng-En Ho

IPC: H03M1/10

CPC classification number: H03M1/109 ,  H03M1/66

Abstract: A method for testing a digital to analog converter, which operates in an undersampling environment, wherein signals of a tested DAC and a signal generator are modulated by a PWM device and then processed by a digital processing circuit to generate a digital signal, whereby is formed a low-speed equivalent ADC. The signal generator is provided by uniform-distribution random test patterns, and the signal generator generates an uniform-distribution random analog signal to the equivalent ADC. Thereby, the test error caused by the non-ideality of the signal generator is corrected, and the tested circuit can work in a full speed.

Abstract translation: 一种用于测试在欠采样环境中操作的数模转换器的方法，其中测试DAC和信号发生器的信号由PWM装置调制，然后由数字处理电路处理以产生数字信号，由此形成 低速等效ADC。 信号发生器由均匀分布随机测试模式提供，信号发生器产生均匀分布随机模拟信号到等效ADC。 因此，由信号发生器的非理想性引起的测试误差被校正，并且被测电路可以全速工作。

公开(公告)号：US07950565B2

公开(公告)日：2011-05-31

申请号：US12555192

申请日：2009-09-08

Applicant: Cheng-En Ho ,  Han-Lin Chung

Inventor： Cheng-En Ho ,  Han-Lin Chung

IPC: B23K1/18 ,  G01N3/08

CPC classification number: B23K31/12 ,  B23K3/08

Abstract: A high speed ball shear machine is adapted for removing a metal bump fixed on a substrate. The high speed ball shear machine includes a fixing base, a shear tool, and a metal bump catcher. The substrate is fixed on the top surface of the fixing base. The shear tool is disposed above the top surface. The fixing base is adapted for being translated along a translation path relative to the shear tool, wherein the translation path is a straight path. When the fixing base translates along the path, the metal bump is driven to strike the shear tool so as to separate itself from the substrate. The metal bump catcher, which is adapted for catching the drop bump after the striking, is disposed on the side wall of the fixing base. The bump catcher has a fillister with a configuration depicted in the figures of this invention.

Abstract translation: 高速球剪切机适用于去除固定在基板上的金属凸块。 高速球剪切机包括固定底座，剪切工具和金属凸块捕获器。 基板固定在固定基座的顶面上。 剪切工具设置在顶部表面上方。 固定基座适于沿着相对于剪切工具的平移路径平移，其中平移路径是直线路径。 当固定底座沿着路径平移时，金属凸块被驱动以撞击剪切工具，以便将其自身与基板分开。 金属凸块捕获器，其被设置在固定基座的侧壁上，其适于在撞击之后捕获液滴。 凸块捕获器具有在本发明的附图中描绘的配置的填充物。

公开(公告)号：US20100301100A1

公开(公告)日：2010-12-02

申请号：US12555192

申请日：2009-09-08

Applicant: Cheng-En Ho ,  Han-Lin Chung

Inventor： Cheng-En Ho ,  Han-Lin Chung

IPC: B23K37/00 ,  B23K3/08

CPC classification number: B23K31/12 ,  B23K3/08

Abstract: A high speed ball shear machine is adapted for removing a metal bump fixed on a substrate. The high speed ball shear machine includes a fixing base, a shear tool, and a metal bump catcher. The substrate is fixed on the top surface of the fixing base. The shear tool is disposed above the top surface. The fixing base is adapted for being translated along a translation path relative to the shear tool, wherein the translation path is a straight path. When the fixing base translates along the path, the metal bump is driven to strike the shear tool so as to separate itself from the substrate. The metal bump catcher, which is adapted for catching the drop bump after the striking, is disposed on the side wall of the fixing base. The bump catcher has a fillister with a configuration depicted in the figures of this invention.

Abstract translation: 高速球剪切机适用于去除固定在基板上的金属凸块。 高速球剪切机包括固定底座，剪切工具和金属凸块捕获器。 基板固定在固定基座的顶面上。 剪切工具设置在顶部表面上方。 固定基座适于沿着相对于剪切工具的平移路径平移，其中平移路径是直线路径。 当固定底座沿着路径平移时，金属凸块被驱动以撞击剪切工具，以便将其自身与基板分开。 金属凸块捕获器，其被设置在固定基座的侧壁上，其适于在撞击之后捕获液滴。 凸块捕获器具有在本发明的附图中描绘的配置的填充物。

公开(公告)号：US08207469B2

公开(公告)日：2012-06-26

申请号：US12156560

申请日：2008-06-02

Applicant: Cheng-En Ho ,  Wei-Hsiang Wu

Inventor： Cheng-En Ho ,  Wei-Hsiang Wu

IPC: B23K11/00

CPC classification number: B23K1/0016 ,  H05K3/3436 ,  H05K2201/0769 ,  H05K2203/105 ,  H05K2203/1492 ,  Y02P70/613

Abstract: A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.

Abstract translation: 下面描述一种用于抑制适用于芯片封装中使用的焊点配置的电迁移诱导相分离的方法。 首先，提供包括布线板，芯片和焊点数量的芯片封装，其中芯片设置在布线板上，并且焊点设置在芯片和布线板之间，以将芯片电连接到 接线板 接下来，第一电流和第二电流交替地施加到焊点的一侧，其中第一电流和第二电流的流动方向相反。 第一电流的电流密度为103〜105A / cm 2，第二电流的电流密度为103〜105A / cm 2。