METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD AND RELATED ASSEMBLING SYSTEM
    1.
    发明申请
    METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD AND RELATED ASSEMBLING SYSTEM 有权
    用于组装电路板上的部件和相关装配系统的方法

    公开(公告)号:US20110016708A1

    公开(公告)日:2011-01-27

    申请号:US12694293

    申请日:2010-01-27

    IPC分类号: H05K3/30 B23P19/00

    摘要: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

    摘要翻译: 一种用于在电路板上组装部件的方法,包括在电路板沿第一方向移动之后将电路板驱动到组装位置,然后通过定位杆在定位点处被阻挡,将第一组件组装在第一区域 当电路板位于组装位置时,折叠定位杆,在第一组件组装在电路板的第一区域上之后将电路板驱动回定位点,驱动电路板 在第一方向上,直到定位杆移动到电路板上的槽的端部,再次将电路板驱动到组装位置,并且当电路板定位时组装安装在电路板的第二区域上的第二组件 在组装位置。

    Metal shielding can and assembly of the metal shielding can and a circuit board
    2.
    发明授权
    Metal shielding can and assembly of the metal shielding can and a circuit board 有权
    金属屏蔽罐和组件的金属屏蔽罐和电路板

    公开(公告)号:US08462520B2

    公开(公告)日:2013-06-11

    申请号:US12816618

    申请日:2010-06-16

    IPC分类号: H05K9/00

    CPC分类号: H05K9/0028

    摘要: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

    摘要翻译: 金属屏蔽可包括顶壁和周围壁。 周围壁从顶壁的周边向下延伸,并且包括底表面和形成在底表面中的用于接收锡焊料元件的凹槽。 因此可以提高将锡金属屏蔽体与电路板接合的锡焊料的强度,从而能够将金属屏蔽体牢固地固定在电路基板上。 此外,锡焊料元件可以相对于电路板的焊盘准确地定位,使得焊接后的精度易于控制,并且对安装在电路板上的电子部件没有焊料溢出或不利影响。 因此,返工产量可以大大提高以降低制造成本。

    Heat dissipation module and portable device having the heat dissipation module
    3.
    发明申请
    Heat dissipation module and portable device having the heat dissipation module 审中-公开
    散热模块和具有散热模块的便携式设备

    公开(公告)号:US20110155361A1

    公开(公告)日:2011-06-30

    申请号:US12926605

    申请日:2010-11-30

    IPC分类号: F28F7/00

    摘要: A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element.

    摘要翻译: 公开了一种用于降低加热元件的温度的散热模块。 散热模块包括散热模块体,容器和液体元件。 散热模块主体由导热材料制成; 容器安装在散热模块体内; 并且液体元件设置在容器中。 因此,当散热模块与加热元件接触时,由加热元件产生的热量被散热模块体和液体元件吸收。

    AUXILIARY MECHANISM
    5.
    发明申请
    AUXILIARY MECHANISM 有权
    辅助机制

    公开(公告)号:US20080122937A1

    公开(公告)日:2008-05-29

    申请号:US11942451

    申请日:2007-11-19

    IPC分类号: H04N9/04 H04N5/225

    摘要: An auxiliary mechanism to be attached to a portable electronic device when capturing image data of an image medium, the portable electronic device includes an image capture element, the auxiliary mechanism comprises a body, a fixer and a connecting element. The fixer is connected to the body, wherein the image medium is placed on the fixer. The connecting element is connected to the body and detachably connected to the portable electronic device, wherein the image capture element corresponds to the image medium and captures the image data thereof.

    摘要翻译: 当拍摄图像介质的图像数据时,附接到便携式电子设备的辅助机构,便携式电子设备包括图像捕获元件,辅助机构包括主体,定影器和连接元件。 定影器连接到身体,其中图像介质被放置在定影器上。 连接元件连接到主体并且可拆卸地连接到便携式电子设备,其中图像捕获元件对应于图像介质并且捕捉其图像数据。

    External antenna device and electronic device using the same
    6.
    发明申请
    External antenna device and electronic device using the same 审中-公开
    外部天线装置和使用其的电子装置

    公开(公告)号:US20060197707A1

    公开(公告)日:2006-09-07

    申请号:US11190446

    申请日:2005-07-27

    IPC分类号: H01Q1/24

    CPC分类号: H01Q1/22 H01Q9/30

    摘要: An external antenna device comprises an antenna, a low noise amplifier device, a first connection part and a second connection part. The antenna is operable for receiving radio signals. The low noise amplifier device electrically connected to the antenna is operable for receiving the radio signals and outputting first signals. The first connection part electrically connected to the low noise amplifier device and an electronic device is operable for transmitting power provided by the electronic device to the low noise amplifier device. The second connection part electrically connected to the low noise amplifier device and the electronic device is operable for transmitting the first signal to the electronic device.

    摘要翻译: 外部天线装置包括天线,低噪声放大器装置,第一连接部分和第二连接部分。 天线可操作用于接收无线电信号。 电连接到天线的低噪声放大器装置可操作用于接收无线电信号并输出​​第一信号。 电连接到低噪声放大器装置的第一连接部分和电子装置可操作以将由电子装置提供的电力发射到低噪声放大装置。 电连接到低噪声放大器装置和电子装置的第二连接部分可操作以将第一信号发送到电子装置。

    Headlight assembly structure for a motorcycle
    7.
    发明申请
    Headlight assembly structure for a motorcycle 有权
    一辆摩托车的大灯总成结构

    公开(公告)号:US20060062003A1

    公开(公告)日:2006-03-23

    申请号:US11166720

    申请日:2005-06-24

    申请人: Chia-Hsien Lee

    发明人: Chia-Hsien Lee

    IPC分类号: B62J6/00 F21S8/10

    摘要: A motorcycle headlight assembly that has simplified structure that cost less to manufacture and assemble than a conventional headlight. The headlight assembly may enhance the rigidity of the headlight assembly and decrease the number of components. The headlight assembly can include a headlight, a right indicator, left indicator and a bodywork cover. The bodywork cover is connected to the headlight cap and configured to overlay the front part of the vehicle.

    摘要翻译: 摩托车前灯组件具有简化的结构,比传统的头灯低成本制造和组装。 头灯组件可以增强头灯组件的刚性并减少部件数量。 头灯组件可以包括头灯,右指示器,左指示器和车身盖。 车身盖连接到前灯罩,并配置为覆盖车辆的前部。

    Auxiliary mechanism
    8.
    发明授权
    Auxiliary mechanism 失效
    辅助机制

    公开(公告)号:US08416560B2

    公开(公告)日:2013-04-09

    申请号:US13117091

    申请日:2011-05-26

    IPC分类号: H05K5/00 H05K7/00

    摘要: An auxiliary mechanism to be attached to a portable electronic device when capturing image data of an image medium, the portable electronic device includes an image capture element, the auxiliary mechanism comprises a body, a fixer and a connecting element. The fixer is connected to the body, wherein the image medium is placed on the fixer. The connecting element is connected to the body and detachably connected to the portable electronic device, wherein the image capture element corresponds to the image medium and captures the image data thereof.

    摘要翻译: 当拍摄图像介质的图像数据时,附接到便携式电子设备的辅助机构,便携式电子设备包括图像捕获元件,辅助机构包括主体,定影器和连接元件。 定影器连接到身体,其中图像介质被放置在定影器上。 连接元件连接到主体并且可拆卸地连接到便携式电子设备,其中图像捕获元件对应于图像介质并且捕捉其图像数据。

    System for assembling components on a circuit board
    9.
    发明授权
    System for assembling components on a circuit board 有权
    电路板组件组装系统

    公开(公告)号:US08387233B2

    公开(公告)日:2013-03-05

    申请号:US12694293

    申请日:2010-01-27

    IPC分类号: B23P19/00 H05K13/04

    摘要: A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.

    摘要翻译: 电路板组装系统包括形成槽的电路板。 电路板包括第一区域和第二区域。 电路板组装系统还包括一个组件放置机,一个定位杆,其中未调节的定位杆​​的第一宽度大于所述槽的宽度,使得未调整的定位杆不能穿过所述槽,用于 将电路板沿第一方向驱动到定位点,并将电路板沿第二方向驱动到组装位置,以及控制单元,用于控制输送装置将电路板沿第二方向驱动到组装位置并控制 组件贴装机分别组装第一组件和第二组件,分别设置在第一区域和第二区域上。

    PRINTED CIRCUIT BOARD, A SUPPORTING JIG AND A POSITIONING METHOD
    10.
    发明申请
    PRINTED CIRCUIT BOARD, A SUPPORTING JIG AND A POSITIONING METHOD 审中-公开
    印刷电路板,支撑插头和定位方法

    公开(公告)号:US20120261870A1

    公开(公告)日:2012-10-18

    申请号:US13444046

    申请日:2012-04-11

    IPC分类号: B25B11/00 B23P11/00

    摘要: A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet.

    摘要翻译: 公开了一种印刷电路板,支撑夹具和定位方法,其中支撑夹具用于定位印刷电路板以便于表面贴装技术(SMT)工艺。 印刷电路板包括电路板定位孔和第一磁体,其中第一磁体容纳在电路板定位孔中。 支撑夹具具有夹具定位孔和第二磁体。 夹具定位孔位于电路板定位孔的下方。 第二磁体容纳在夹具定位孔中,使得印刷电路板可以通过第一磁体和第二磁体之间的磁吸引力固定在支撑夹具上。