公开(公告)号：US20230280814A1

公开(公告)日：2023-09-07

申请号：US17683435

申请日：2022-03-01

申请人： Sameer Shekhar ,  Amit K. Jain ,  Chin Lee Kuan

发明人： Sameer Shekhar ,  Amit K. Jain ,  Chin Lee Kuan

IPC分类号： G06F1/3234 ,  G05F1/575 ,  H02M3/07

CPC分类号： G06F1/3234 ,  G05F1/575 ,  H02M3/07

摘要： An apparatus, system, and method for improved thermal design power (TDP) range are provided. A device includes a first voltage regulator configured to provide first voltage of a first voltage value, a second voltage regulator configured to provide a second voltage of a second, different voltage value, a first capacitor electrically coupled between a first output of the first voltage regulator and a ground, a second capacitor electrically coupled between a second output of the second voltage regulator and the ground, a first switch electrically coupled between the first output and the second output, a second switch situated in parallel with the first switch, the second switch electrically coupled between the first output and the second output, and a controller configured to provide control signals that control the first voltage regulator, the second voltage regulator, the first switch, and the second switch.

公开(公告)号：US20190312513A1

公开(公告)日：2019-10-10

申请号：US16452322

申请日：2019-06-25

申请人： Amit Kumar Jain ,  Chin Lee Kuan ,  Sameer Shekhar

发明人： Amit Kumar Jain ,  Chin Lee Kuan ,  Sameer Shekhar

IPC分类号： H02M3/158 ,  H01F27/28 ,  H01F27/40 ,  G06F1/26 ,  G01R19/165

摘要： Various embodiments provide a magnetic sensing scheme for a voltage regulator circuit. The voltage regulator circuit may include a first inductor (also referred to as an output inductor) coupled between a drive circuit and an output node. The voltage regulator circuit may further include a second inductor (also referred to as a sense inductor) having a first terminal coupled to the first inductor at a tap point between terminals of the first inductor. The second inductor may provide a sense voltage at a second terminal of the second inductor. A control circuit may control a state of the voltage regulator circuit based on the sense voltage to provide a regulated output voltage at the output node. Other embodiments may be described and claimed.

公开(公告)号：US20190006333A1

公开(公告)日：2019-01-03

申请号：US16017719

申请日：2018-06-25

申请人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

发明人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L21/48

摘要： A stiffener on a semiconductor package substrate includes a plurality of parts that are electrically coupled to the semiconductor package substrate on a die side. Both stiffener parts are electrically contacted through a passive device that is soldered between the two stiffener parts and by an electrically conductive adhesive that bonds a given stiffener part to the semiconductor package substrate. The passive device is embedded between two stiffener parts to create a smaller X-Y footprint as well as a lower Z-direction profile.