摘要:
Disclosed is a fullerene derivative having a formula of F-Cy, wherein F is an open-cage fullerene, and Cy is a chalcogenyl group. The fullerene derivative can be applied to hydrogen storage material and an optoelectronic device such as an organic light emitting diode (OLED), a solar cell, or an organic thin film transistor (TFT).
摘要:
The present invention discloses a method for fabricating polymeric wavelength filter based on an asymmetric Bragg coupler with single-grating waveguide. The asymmetric waveguide coupler is formed firstly on a negative photo-resist mold. PDMS film is injected into the narrow waveguide of the coupler to act as a protection layer. The gratings pattern is exposed on the alternative waveguide and subsequently transferred to PDMS stamp mold. The PDMS stamp mold is used as a stamp to transfer the gratings pattern of the ABC wavelength filter onto UV cured polymer to form the final ABC filter. Whereby, the fabrication process is reliable and accurate, and can offer great potential for mass production of the ABC filter with single-grating waveguide.
摘要:
The present invention discloses a method for fabricating polymeric wavelength filter based on an asymmetric Bragg coupler with single-grating waveguide. The asymmetric waveguide coupler is formed firstly on a negative photo-resist mold. PDMS film is injected into the narrow waveguide of the coupler to act as a protection layer. The gratings pattern is exposed on the alternative waveguide and subsequently transferred to PDMS stamp mold. The PDMS stamp mold is used as a stamp to transfer the gratings pattern of the ABC wavelength filter onto UV cured polymer to form the final ABC filter. Whereby, the fabrication process is reliable and accurate, and can offer great potential for mass production of the ABC filter with single-grating waveguide.
摘要:
A method of manufacturing an LED illuminator is provided. At least one flat heat pipe (FHP) is provided, on which a flat surface is formed. A treating tool is provided to fix the FHP. A printed circuit layer is formed on the flat surface, which includes an insulated layer, a conductive layer and a solder mask layer spread on the flat heat pipe in order, to form solder portions. After that, solder paste is applied on the solder portions, and LED elements are disposed on the solder portions correspondingly. Finally, the FHP and the LED elements are passed through a reflow oven, to accomplish an LED illuminator. The FHP further has locating holes, which are used for orientating the FHP and connecting a heat-dissipating module by a concise assembling element.
摘要:
A heat dissipation module includes a housing, and a fan including an outer frame, a first rotor, a base, a second rotor and a driving device. The first rotor includes a shaft, a first hub and a plurality of first rotor blades disposed around the first hub. The base is disposed in the outer frame. The second rotor includes a plurality of second rotor blades, and is coupled to the shaft of the first rotor and disposed next to the first rotor. The driving device is supported by the base for driving the first rotor and the second rotor simultaneously.
摘要:
A heat dissipating device includes an outer frame, a first rotor, a base, a second rotor and a driving device. The first rotor comprises a shaft, a first hub and a plurality of first rotor blades disposed around the first hub. The base is disposed in the outer frame. The second rotor comprises a plurality of second rotor blades, coupled to the shaft of the first rotor and disposed next to the first rotor. The driving device is supported by the base for driving the first rotor and the second rotor.
摘要:
A heat dissipating device includes an outer frame, a first rotor, a base, a second rotor and a driving device. The first rotor comprises a shaft, a first hub and a plurality of first rotor blades disposed around the first hub. The base is disposed in the outer frame. The second rotor comprises a plurality of second rotor blades, coupled to the shaft of the first rotor and disposed next to the first rotor. The driving device is supported by the base for driving the first rotor and the second rotor.
摘要:
A heat dissipation module includes a housing, and a fan including an outer frame, a first rotor, a base, a second rotor and a driving device. The first rotor includes a shaft, a first hub and a plurality of first rotor blades disposed around the first hub. The base is disposed in the outer frame. The second rotor includes a plurality of second rotor blades, and is coupled to the shaft of the first rotor and disposed next to the first rotor. The driving device is supported by the base for driving the first rotor and the second rotor simultaneously.
摘要:
A heat dissipating fan includes a frame, a first rotor having a shaft and a hub, a base disposed in the frame, a second rotor disposed at one side of the first rotor and coupled to the first rotor, and a driving element supported by the base for driving the first and second rotors to rotate. The hubs of the first and second rotors include a plurality of heat dissipating holes formed on the surface thereof. Airflow passes through the plurality of heat dissipating holes to generate a forced convection effect on the driving element.