公开(公告)号：US20080287044A1

公开(公告)日：2008-11-20

申请号：US11748477

申请日：2007-05-14

申请人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

发明人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

IPC分类号： B24B7/04

CPC分类号： B24B37/345

摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

摘要翻译： 公开了一种转印晶片的方法。 该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触 流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。 由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。

公开(公告)号：US07909677B2

公开(公告)日：2011-03-22

申请号：US11748477

申请日：2007-05-14

申请人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

发明人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

IPC分类号： B24B1/00

CPC分类号： B24B37/345

摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

公开(公告)号：US08142258B2

公开(公告)日：2012-03-27

申请号：US12964716

申请日：2010-12-09

申请人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

发明人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

IPC分类号： B24B1/00

CPC分类号： B24B37/345

摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

摘要翻译： 公开了一种转印晶片的方法。 该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触 流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。 由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。

公开(公告)号：US20110076129A1

公开(公告)日：2011-03-31

申请号：US12964716

申请日：2010-12-09

申请人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

发明人： Kuo-Wei Yang ,  Hui-Shen Shih ,  Chih-Jen Mao ,  Cho-Long Lin

IPC分类号： B65G47/22

CPC分类号： B24B37/345

摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

摘要翻译： 公开了一种转印晶片的方法。 该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触 流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。 由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。