公开(公告)号：US06888261B2

公开(公告)日：2005-05-03

申请号：US10690105

申请日：2003-10-21

Applicant: Won Song ,  Seong-Il Kim ,  Sang-Il Han ,  Chang-Hoon Lee ,  Choung-Hee Kim

Inventor： Won Song ,  Seong-Il Kim ,  Sang-Il Han ,  Chang-Hoon Lee ,  Choung-Hee Kim

IPC: G03F9/00 ,  H01L21/027 ,  H01L23/544 ,  H01L21/76

CPC classification number: H01L23/544 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

Abstract: An alignment mark and an exposure alignment system and method using the alignment mark for aligning wafers are described. The alignment mark is formed of a plurality of mesa or trench type unit marks that are aligned in an inline pattern within an underlying layer under a layer to which a chemical mechanical polishing process is applied to form an alignment signal during an alignment process, thereby preventing a dishing phenomenon caused by the chemical mechanical process.

Abstract translation: 描述了对准标记和使用对准标记对准晶片的曝光对准系统和方法。 对准标记由多个台面或沟槽型单位标记形成，该多个台面或沟槽型单位标记在下面的层内以下列方式对准，在层之下，在对准过程期间施加化学机械抛光工艺以形成对准信号，从而防止 由化学机械过程引起的凹陷现象。

公开(公告)号：US06667253B2

公开(公告)日：2003-12-23

申请号：US09906306

申请日：2001-07-16

Applicant: Won Song ,  Seong-II Kim ,  Sang-II Han ,  Chang-Hoon Lee ,  Choung-Hee Kim

Inventor： Won Song ,  Seong-II Kim ,  Sang-II Han ,  Chang-Hoon Lee ,  Choung-Hee Kim

IPC: H01L2176

CPC classification number: H01L23/544 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

Abstract: An alignment mark and an exposure alignment system and method using the alignment mark for aligning wafers are described. The alignment mark is formed of a plurality of mesa or trench type unit marks that are aligned in an inline pattern within an underlying layer under a layer to which a chemical mechanical polishing process is applied to form an alignment signal during an alignment process, thereby preventing a dishing phenomenon caused by the chemical mechanical process.

公开(公告)号：US5733690A

公开(公告)日：1998-03-31

申请号：US633904

申请日：1996-04-17

Applicant: Seong-kil Jeong ,  Moon-koog Song ,  Jeong-yeal Kim ,  Choung-hee Kim

Inventor： Seong-kil Jeong ,  Moon-koog Song ,  Jeong-yeal Kim ,  Choung-hee Kim

IPC: G03F9/00 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70633 ,  G03F1/44

Abstract: A reticle for fabricating a semiconductor device, wherein alignment-marks useful to examine a pattern mistake are formed upon a scribe line, the alignment-marks having pairs of adjoining primary and secondary measurement patterns. Each primary measurement pattern includes a rectangular pattern provided on a rectangular plate, and a rod-shaped pattern separately formed along the sides of the rectangular pattern. Each secondary measure pattern is fitted into the rectangular pattern of the respective primary measure pattern in case that the secondary measure pattern is overlapped with the primary measure pattern, to thereby permit the examination of position of the secondary measurement pattern relative to the primary measurement pattern.

Abstract translation: 用于制造半导体器件的掩模版，其中用于检查图案错误的对准标记形成在划线上，对准标记具有邻接的一次和二次测量图案对。 每个主要测量图案包括设置在矩形板上的矩形图案和沿着矩形图案的侧面分开形成的杆状图案。 在二次测量图案与主要测量图案重叠的情况下，每个次级测量图案被装配到相应主要测量图案的矩形图案中，从而允许检查辅助测量图案相对于主要测量图案的位置。

公开(公告)号：US5729856A

公开(公告)日：1998-03-24

申请号：US773339

申请日：1996-12-26

Applicant: Dong-Heui Jang ,  Dong-Hyun Kim ,  Choung-Hee Kim ,  Se-Yeon Jang

Inventor： Dong-Heui Jang ,  Dong-Hyun Kim ,  Choung-Hee Kim ,  Se-Yeon Jang

IPC: H01L21/027 ,  A46B9/02 ,  H01L21/304 ,  A46B11/06

CPC classification number: A46B9/02

Abstract: A semiconductor wafer cleaning apparatus having an edge rinse member adapted for rinsing edges of a semiconductor wafer and having a moving member adapted to permit horizontally movement of the edge rinse member, wherein the apparatus is adapted to minimize or prevent an upper surface of the wafer from being stained with pollutants during rinsing. The wafer cleaning apparatus minimizes or prevents rebounding of a rinse solution containing particles from the inside wall of a bowl during rinsing of the edges of a semiconductor wafer.

Abstract translation: 一种半导体晶片清洁设备，其具有适于冲洗半导体晶片的边缘并具有适于允许边缘漂洗构件水平移动的移动构件的边缘冲洗构件，其中该装置适于最小化或防止晶片的上表面 在漂洗期间被污染物污染。 在冲洗半导体晶片的边缘期间，晶片清洁装置使包含颗粒的漂洗溶液在碗的内壁中的反冲最小化或防止。