公开(公告)号：US20070278486A1

公开(公告)日：2007-12-06

申请号：US10582661

申请日：2004-07-29

申请人： Peter Speckbacher ,  Josef Weidmann ,  Christopher Eisele ,  Elmar Mayer ,  Reiner Burgschat

发明人： Peter Speckbacher ,  Josef Weidmann ,  Christopher Eisele ,  Elmar Mayer ,  Reiner Burgschat

IPC分类号： H01L31/105

CPC分类号： G01D5/34707 ,  H01L31/1055

摘要： A scanning head for an optical position-measuring system includes a receiver grating, formed of photosensitive areas, for the scanning of locally intensity-modulated light of differing wavelengths. The receiver grating is formed from a semiconductor layer stack of a doped p-layer, an intrinsic i-layer and a doped n-layer. The individual photosensitive areas have a first doped layer and at least a part of the intrinsic layer in common and are electrically separated from one another by interruptions in the second doped layer.

摘要翻译： 用于光学位置测量系统的扫描头包括由感光区域形成的用于扫描不同波长的局部强度调制光的接收器光栅。 接收器光栅由掺杂p层，本征i层和掺杂n层的半导体层堆叠形成。 各个感光区域具有共同的第一掺杂层和本征层的至少一部分，并且通过第二掺杂层中的中断彼此电分离。

公开(公告)号：US07719075B2

公开(公告)日：2010-05-18

申请号：US10582661

申请日：2004-07-29

申请人： Peter Speckbacher ,  Josef Weidmann ,  Christopher Eisele ,  Elmar Mayer ,  Reiner Burgschat

发明人： Peter Speckbacher ,  Josef Weidmann ,  Christopher Eisele ,  Elmar Mayer ,  Reiner Burgschat

IPC分类号： H01L31/105 ,  G01D5/34

CPC分类号： G01D5/34707 ,  H01L31/1055

摘要： A scanning head for an optical position-measuring system includes a receiver grating, formed of photosensitive areas, for the scanning of locally intensity-modulated light of differing wavelengths. The receiver grating is formed from a semiconductor layer stack of a doped p-layer, an intrinsic i-layer and a doped n-layer. The individual photosensitive areas have a first doped layer and at least a part of the intrinsic layer in common and are electrically separated from one another by interruptions in the second doped layer.

摘要翻译： 用于光学位置测量系统的扫描头包括由感光区域形成的用于扫描不同波长的局部强度调制光的接收器光栅。 接收器光栅由掺杂p层，本征i层和掺杂n层的半导体层堆叠形成。 各个感光区域具有共同的第一掺杂层和本征层的至少一部分，并且通过第二掺杂层中的中断彼此电分离。

公开(公告)号：US20100117199A1

公开(公告)日：2010-05-13

申请号：US12596149

申请日：2008-10-15

申请人： Christopher Eisele

发明人： Christopher Eisele

IPC分类号： H01L29/02 ,  B26D7/06

CPC分类号： B28D5/0082 ,  B23K26/0624 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/04 ,  Y10T83/0448 ,  Y10T83/202

摘要： The invention relates to a method and an apparatus for the production of thin disks or films (3) from semiconductor bodies (1). Advantageously, a laser is used as a cutting tool (2). The beam of the laser is focused using suitable optical means, for example a cylindrical lens, in such a way that a linear intensity profile is created rather than a point-shaped one in order to cut the semiconductor film (3). Furthermore, it is meaningful to place several linear intensity profiles in a row in such a way that a parting line is created across the entire width of the semiconductor body (1), such that the entire cutting line can be removed quasi continuously, at the repetition rate of the laser. Ideally, the peripheral beams of the focused laser beam, which face the semiconductor body (1), should extend parallel to the edge of the semiconductor body (1). Near the tip (9) of the cutting tool (2), on the side facing the semiconductor film (3), the peripheral beams follow the bending radius of the semiconductor film (3), and an increasing gap is created as the distance from the focus (the tip of the cutting tool 2) increases.

摘要翻译： 本发明涉及从半导体本体（1）制造薄片或薄膜（3）的方法和设备。 有利地，激光被用作切削工具（2）。 为了切割半导体膜（3），使用合适的光学装置（例如圆柱形透镜）聚焦激光束，使得产生线性强度分布而不是点状分布。 此外，将多个线性强度分布放置在一行中是有意义的，使得在半导体本体（1）的整个宽度上形成分型线，使得整个切割线可以在 激光的重复率。 理想地，面对半导体主体（1）的聚焦激光束的外围光束应平行于半导体本体（1）的边缘延伸。 在切割工具（2）的尖端（9）附近，在面向半导体膜（3）的一侧上，周边光束遵循半导体膜（3）的弯曲半径，并且随着距离 焦点（切削工具2的尖端）增加。