Electronic system with non-parallel arrays of circuit card assemblies
    1.
    发明授权
    Electronic system with non-parallel arrays of circuit card assemblies 失效
    具有电路卡组件非平行阵列的电子系统

    公开(公告)号:US07978476B2

    公开(公告)日:2011-07-12

    申请号:US10954865

    申请日:2004-09-30

    IPC分类号: H05K5/00

    CPC分类号: H05K7/1408 H05K7/1409

    摘要: An electronic assembly for housing circuit cards of different types, which communicate with one another at high speed. Circuit cards of a first type plug into a backplane side-by-side. Circuit cards of a second type are arranged perpendicularly to the circuit cards of the first type. The arrangement allows cards of the first type to communicate with cards of the second type over short distances, thus improving system throughput. It also allows cards of different types to be cooled differently, thus promoting efficient cooling.

    摘要翻译: 一种用于容纳不同类型的电路卡的电子组件,其以高速彼此通信。 第一类电路卡并排插入背板。 第二类型的电路卡垂直于第一类电路卡布置。 该布置允许第一类型的卡在短距离上与第二类型的卡通信,从而提高系统吞吐量。 它还允许不同类型的卡被不同地冷却,从而促进有效的冷却。

    Air cooling architecture for orthogonal board architectures
    2.
    发明授权
    Air cooling architecture for orthogonal board architectures 有权
    正交板结构的空气冷却架构

    公开(公告)号:US07280356B2

    公开(公告)日:2007-10-09

    申请号:US11011838

    申请日:2004-12-14

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20563

    摘要: An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

    摘要翻译: 公开了一种使用空气冷却并联电路板的第一和第二正交取向阵列的电子系统。 空气被吸入系统的前部,沿着第一阵列中的电路板通过,转动90度,继续在第二阵列中的电路板上,另外90度转动通过后面的 系统。 第一阵列中的电路板通过独立的气流路径被冷却,该气流路径优选地也前后运行。

    Electronic system with non-parallel arrays of circuit card assemblies
    3.
    发明申请
    Electronic system with non-parallel arrays of circuit card assemblies 失效
    具有电路卡组件非平行阵列的电子系统

    公开(公告)号:US20060067069A1

    公开(公告)日:2006-03-30

    申请号:US10954865

    申请日:2004-09-30

    IPC分类号: H05K7/14 H05K7/20

    CPC分类号: H05K7/1408 H05K7/1409

    摘要: An electronic assembly for housing circuit cards of different types, which communicate with one another at high speed. Circuit cards of a first type plug into a backplane side-by-side. Circuit cards of a second type are arranged perpendicularly to the circuit cards of the first type. The arrangement allows cards of the first type to communicate with cards of the second type over short distances, thus improving system throughput. It also allows cards of different types to be cooled differently, thus promoting efficient cooling.

    摘要翻译: 一种用于容纳不同类型的电路卡的电子组件,其以高速彼此通信。 第一类电路卡并排插入背板。 第二类型的电路卡垂直于第一类电路卡布置。 该布置允许第一类型的卡在短距离上与第二类型的卡通信,从而提高系统吞吐量。 它还允许不同类型的卡被不同地冷却,从而促进有效的冷却。

    Air cooling architecture for orthogonal board architectures
    4.
    发明申请
    Air cooling architecture for orthogonal board architectures 有权
    正交板结构的空气冷却架构

    公开(公告)号:US20060126292A1

    公开(公告)日:2006-06-15

    申请号:US11011838

    申请日:2004-12-14

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20563

    摘要: An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

    摘要翻译: 公开了一种使用空气冷却并联电路板的第一和第二正交取向阵列的电子系统。 空气被吸入系统的前部,沿着第一阵列中的电路板通过,转动90度,继续在第二阵列中的电路板上,另外90度转动通过后面的 系统。 第一阵列中的电路板通过独立的气流路径被冷却,该气流路径优选地也前后运行。

    Backplane with routing to reduce layer count
    5.
    发明申请
    Backplane with routing to reduce layer count 失效
    背板具有路由以减少层数

    公开(公告)号:US20060067067A1

    公开(公告)日:2006-03-30

    申请号:US10952103

    申请日:2004-09-28

    申请人: Christopher Heard

    发明人: Christopher Heard

    IPC分类号: H05K7/06

    摘要: An electronic system having a backplane designed for efficient routing of signal traces. The system includes two or more daughter cards that are connected to multiple other daughter cards in the system. These daughter cards are mounted centrally to the backplane in the system. Connections between those two daughter cards and the backplane are made through electrical connectors that are distributed in columns along the length of the daughter cards. The connectors are positioned with space between the connectors. The space forms routing channels such that signals that must be connected to the central cards from a daughter cards on either side may be routed through the routing channels.

    摘要翻译: 具有设计用于有效地路由信号迹线的背板的电子系统。 该系统包括两个或多个子卡,其连接到系统中的多个其他子卡。 这些子卡集中安装在系统的背板上。 这两个子卡和背板之间的连接通过沿着子卡长度分列在列中的电连接器制成。 连接器在连接器之间具有空间。 空间形成路由信道,使得必须从任一侧的子卡连接到中央卡的信号可以通过路由信道路由。