Modular liquid cooling of electronic assemblies
    1.
    发明申请
    Modular liquid cooling of electronic assemblies 失效
    电子组件的模块化液体冷却

    公开(公告)号:US20060067047A1

    公开(公告)日:2006-03-30

    申请号:US10954441

    申请日:2004-09-30

    申请人: Andreas Pfahnl

    发明人: Andreas Pfahnl

    IPC分类号: G06F1/20

    摘要: An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.

    摘要翻译: 电子系统包括在系统内的第一位置处的电子组件的阵列。 一系列液体冷却组件放置在系统内的第二位置。 软管或其他液体输送路径将冷却组件连接到电子组件,用于冷却电子组件。 随着更多的电子组件被添加到系统中,可以提供额外的冷却组件来管理增加的热需求。

    Two-phase cooling apparatus and method for automatic test equipment
    2.
    发明申请
    Two-phase cooling apparatus and method for automatic test equipment 审中-公开
    两相冷却装置及自动化试验设备的方法

    公开(公告)号:US20050039888A1

    公开(公告)日:2005-02-24

    申请号:US10646949

    申请日:2003-08-21

    摘要: A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant. A local condenser is disposed proximate the evaporator and has a two-phase inlet coupled to the evaporator outlet. The local condenser includes a single-phase liquid coolant outlet. The apparatus further includes a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.

    摘要翻译: 公开了用于冷却电子组件的两相冷却装置。 该装置包括具有用于接收单相液体冷却剂的单相入口和用于排出两相冷却剂的两相出口的蒸发器。 局部冷凝器设置在蒸发器附近并且具有联接到蒸发器出口的两相入口。 局部冷凝器包括单相液体冷却剂出口。 该装置还包括具有耦合到蒸发器入口的输出的泵和连接到局部冷凝器出口的输入。

    Thermally enhanced pressure regulation of electronics cooling systems
    3.
    发明申请
    Thermally enhanced pressure regulation of electronics cooling systems 有权
    电子冷却系统的热增压调节

    公开(公告)号:US20060007657A1

    公开(公告)日:2006-01-12

    申请号:US10886449

    申请日:2004-07-07

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20327

    摘要: A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.

    摘要翻译: 在大气压下运行的两相冷却系统。 包含冷却流体的储存器具有排放到大气中的叠层。 堆叠被成形为允许冷凝基本上所有进入烟囱的蒸汽形式的冷却流体。 可以通过冷却堆叠来增强冷凝,例如沿着堆叠的外壁流动的空气或者使热电装置与堆叠接触。 该系统提供高热容量,但易于使用和使用。

    Modular rackmount chiller
    4.
    发明申请
    Modular rackmount chiller 失效
    模块化机架式冷水机组

    公开(公告)号:US20050133214A1

    公开(公告)日:2005-06-23

    申请号:US10741542

    申请日:2003-12-19

    申请人: Andreas Pfahnl

    发明人: Andreas Pfahnl

    摘要: A chiller assembly shaped for use in a standard electronics rack. The chiller has a low profile, and is capable of being made to occupy less than 5 rack units. The chiller is modular, with subassemblies positioned to allow easy removal for maintenance. The fan and power supply are made as replaceable subassemblies that can be inserted or removed from the front of the unit without any special tools. The pump is made with a magnetically coupled motor, allowing the motor to be easily removed for service or replacement. The motor is also accessible from the front panel of the assembly.

    摘要翻译: 一种用于标准电子机架的冷却器组件。 冷水机具有低调,并且能够占据少于5个机架单元。 冷却器是模块化的,子组件定位为便于维护。 风扇和电源是作为可更换的组件,可以在没有任何专用工具的情况下从设备的前部插入或拆下。 该泵由磁耦合电机制成,允许电机容易拆卸以进行维修或更换。 电机也可从组件的前面板进入。

    Direct facility water test head cooling architecture
    5.
    发明申请
    Direct facility water test head cooling architecture 有权
    直接设备水测试头冷却架构

    公开(公告)号:US20080041568A1

    公开(公告)日:2008-02-21

    申请号:US11715650

    申请日:2007-03-08

    IPC分类号: H01L23/467

    CPC分类号: G01R31/2891

    摘要: An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

    摘要翻译: 提供了一种使用直接设备水冷却半导体测试头内的高性能仪器的设备。 直接设备水冷却装置包括一个空气室,一个第一基座,用于将该仪器接纳并可拆卸地安装在空气室内;一个测试头入口,与第一个基座流体连通;一个设备供水; 与第一基座和设施排水管的连通,以及与空气室入口流体连通以引导空气从空气室入口流到空气室出口的风扇。

    Air cooling architecture for orthogonal board architectures
    6.
    发明申请
    Air cooling architecture for orthogonal board architectures 有权
    正交板结构的空气冷却架构

    公开(公告)号:US20060126292A1

    公开(公告)日:2006-06-15

    申请号:US11011838

    申请日:2004-12-14

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20563

    摘要: An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

    摘要翻译: 公开了一种使用空气冷却并联电路板的第一和第二正交取向阵列的电子系统。 空气被吸入系统的前部,沿着第一阵列中的电路板通过,转动90度,继续在第二阵列中的电路板上,另外90度转动通过后面的 系统。 第一阵列中的电路板通过独立的气流路径被冷却,该气流路径优选地也前后运行。

    Electronic system with non-parallel arrays of circuit card assemblies
    7.
    发明申请
    Electronic system with non-parallel arrays of circuit card assemblies 失效
    具有电路卡组件非平行阵列的电子系统

    公开(公告)号:US20060067069A1

    公开(公告)日:2006-03-30

    申请号:US10954865

    申请日:2004-09-30

    IPC分类号: H05K7/14 H05K7/20

    CPC分类号: H05K7/1408 H05K7/1409

    摘要: An electronic assembly for housing circuit cards of different types, which communicate with one another at high speed. Circuit cards of a first type plug into a backplane side-by-side. Circuit cards of a second type are arranged perpendicularly to the circuit cards of the first type. The arrangement allows cards of the first type to communicate with cards of the second type over short distances, thus improving system throughput. It also allows cards of different types to be cooled differently, thus promoting efficient cooling.

    摘要翻译: 一种用于容纳不同类型的电路卡的电子组件,其以高速彼此通信。 第一类电路卡并排插入背板。 第二类型的电路卡垂直于第一类电路卡布置。 该布置允许第一类型的卡在短距离上与第二类型的卡通信,从而提高系统吞吐量。 它还允许不同类型的卡被不同地冷却,从而促进有效的冷却。