公开(公告)号：US09110465B1

公开(公告)日：2015-08-18

申请号：US13100976

申请日：2011-05-04

申请人： Jian-Huei Feng ,  Ming Jiang ,  Clayton R. Newman ,  Yeak-Chong Wong

发明人： Jian-Huei Feng ,  Ming Jiang ,  Clayton R. Newman ,  Yeak-Chong Wong

IPC分类号： G06F19/00 ,  G05B19/418

CPC分类号： G05B19/41875 ,  G05B13/02 ,  G05B2219/45031 ,  H01L31/00

摘要： Methods for providing asymmetric control of process parameters are described. One such method includes receiving a data point for the process parameter relative to the wafer, selecting a first value for a process weighting factor when the data point is consistent with a first criteria, selecting a second value for the process weighting factor when the data point is consistent with a second criteria, where the second value is not equal to the first value, calculating an exponential weighted moving average of the process parameter based on the data point and the process weighting factor, updating the process parameter with the exponential weighted moving average, and using the updated process parameter to control the process and thereby treat the wafer. The methods can use one or more weighting factor switch limits to define different areas of risk associated with a target for the process parameter.

摘要翻译： 描述了提供工艺参数不对称控制的方法。 一种这样的方法包括接收相对于晶片的过程参数的数据点，当数据点与第一标准一致时，选择过程加权因子的第一值，当数据点 与第二标准一致，其中第二值不等于第一值，基于数据点和过程加权因子计算过程参数的指数加权移动平均值，以指数加权移动平均值更新过程参数 并且使用更新的处理参数来控制该处理，从而处理晶片。 这些方法可以使用一个或多个权重因子切换限制来定义与过程参数的目标相关联的风险的不同区域。

公开(公告)号：US07371152B1

公开(公告)日：2008-05-13

申请号：US11644856

申请日：2006-12-22

申请人： Clayton R. Newman

发明人： Clayton R. Newman

IPC分类号： B24B49/00

CPC分类号： B24B49/02 ,  B24B37/042

摘要： A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motion for a polishing pad is selected to be substantially equal to an integer multiple of a rotation frequency that is a rate of rotation for the sample. The method further includes rotating the polishing pad at the polishing frequency, rotating the sample at the rotation frequency, and polishing the sample using the polishing pad while rotating the polishing pad and the sample.

摘要翻译： 用于子孔抛光的方法包括：与样品的第二部分不相称地确定要被抛光的样品的第一部分。 基于第一部分的确定，选择作为抛光垫的横向运动的第一速率的扫描频率基本上等于作为样品的旋转速率的旋转频率的整数倍。 该方法还包括以抛光频率旋转抛光垫，以旋转频率旋转样品，并在旋转抛光垫和样品的同时使用抛光垫对样品进行抛光。

公开(公告)号：US09213322B1

公开(公告)日：2015-12-15

申请号：US13587754

申请日：2012-08-16

申请人： Jian-Huei Feng ,  Ming Jiang ,  Clayton R. Newman ,  Yeak-Chong Wong

发明人： Jian-Huei Feng ,  Ming Jiang ,  Clayton R. Newman ,  Yeak-Chong Wong

IPC分类号： G05B13/02 ,  G05B13/04

CPC分类号： G05B13/024 ,  G05B13/042 ,  G05B13/048

摘要： Methods for providing run to run process control using a dynamic tuner are provided. Once such method includes receiving a data point for a process output parameter, determining whether the data point is within a desired range for the process output parameter, setting, when the data point is within the desired range, a dynamic lambda value equal to a preselected base lambda value, setting, when the data point is not within the desired range, the dynamic lambda value equal to a value based on the preselected base lambda value, a degree of difference between the data point and a target for the process output parameter, and a scale factor, calculating an exponentially weighted moving average using the dynamic lambda value, and adjusting the process control parameter in accordance with the exponentially weighted moving average.

摘要翻译： 提供了使用动态调谐器提供运行过程控制运行的方法。 一旦这样的方法包括接收过程输出参数的数据点，确定数据点是否在处理输出参数的期望范围内，当数据点在期望范围内时，设置等于预选的动态λ值 基本λ值，当数据点不在期望范围内时，设置，动态λ值等于基于预选的基本λ值的值，数据点与过程输出参数的目标之间的差异程度， 和比例因子，使用动态λ值计算指数加权移动平均值，以及根据指数加权移动平均值来调整过程控制参数。