公开(公告)号：US20050248617A1

公开(公告)日：2005-11-10

申请号：US11166301

申请日：2005-06-24

申请人： Mohammad Akhavain ,  Joseph Scheffelin ,  Noah Lassar ,  Conrad Lepe

发明人： Mohammad Akhavain ,  Joseph Scheffelin ,  Noah Lassar ,  Conrad Lepe

IPC分类号： B41J2/16 ,  H05K3/28 ,  H05K3/34 ,  B41J2/14

CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

公开(公告)号：US06913343B2

公开(公告)日：2005-07-05

申请号：US10426584

申请日：2003-04-30

申请人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

发明人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

IPC分类号： B41J2/16 ,  H05K3/28 ,  H05K3/34 ,  B41J2/14

CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

摘要翻译： 所描述的实施例涉及用于形成和保护电互连组件的方法和系统。 在一个实施例中，电互连组件形成方法形成第一支撑结构的一个或多个导体与第二支撑结构的一个或多个导体之间的电互连。 该方法还将通常可流动的材料分布在电互连上并且将大体上可流动的材料暴露于足以使总体上可流动的材料进入通常不可流动的状态以向电互连提供流体保护并支持电互连以减少应力 浓度在电互连。

公开(公告)号：US07338149B2

公开(公告)日：2008-03-04

申请号：US11166301

申请日：2005-06-24

申请人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

发明人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

摘要翻译： 所描述的实施例涉及用于形成和保护电互连组件的方法和系统。 在一个实施例中，电互连组件形成方法形成第一支撑结构的一个或多个导体与第二支撑结构的一个或多个导体之间的电互连。 该方法还将通常可流动的材料分布在电互连上并且将大体上可流动的材料暴露于足以使总体上可流动的材料进入通常不可流动的状态以向电互连提供流体保护并支持电互连以减少应力 浓度在电互连。