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19 条记录 (耗时 0.019 秒)

    Methods for forming and protecting electrical interconnects and resultant assemblies
    1.
    发明授权
    Methods for forming and protecting electrical interconnects and resultant assemblies 有权
    用于形成和保护电互连和所得组件的方法

    公开(公告)号：US07338149B2

    公开(公告)日：2008-03-04

    申请号：US11166301

    申请日：2005-06-24

    申请人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    发明人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

    摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

    摘要翻译： 所描述的实施例涉及用于形成和保护电互连组件的方法和系统。 在一个实施例中，电互连组件形成方法形成第一支撑结构的一个或多个导体与第二支撑结构的一个或多个导体之间的电互连。 该方法还将通常可流动的材料分布在电互连上并且将大体上可流动的材料暴露于足以使总体上可流动的材料进入通常不可流动的状态以向电互连提供流体保护并支持电互连以减少应力 浓度在电互连。

    Methods for forming and protecting electrical interconnects and resultant assemblies
    2.
    发明授权
    Methods for forming and protecting electrical interconnects and resultant assemblies 有权
    用于形成和保护电互连和所得组件的方法

    公开(公告)号：US06913343B2

    公开(公告)日：2005-07-05

    申请号：US10426584

    申请日：2003-04-30

    申请人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    发明人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    IPC分类号： B41J2/16 ,  H05K3/28 ,  H05K3/34 ,  B41J2/14

    CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

    摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

    摘要翻译： 所描述的实施例涉及用于形成和保护电互连组件的方法和系统。 在一个实施例中，电互连组件形成方法形成第一支撑结构的一个或多个导体与第二支撑结构的一个或多个导体之间的电互连。 该方法还将通常可流动的材料分布在电互连上并且将大体上可流动的材料暴露于足以使总体上可流动的材料进入通常不可流动的状态以向电互连提供流体保护并支持电互连以减少应力 浓度在电互连。

    Fluid ejection head assembly
    3.
    发明授权
    Fluid ejection head assembly 失效
    流体喷射头组件

    公开(公告)号：US07188925B2

    公开(公告)日：2007-03-13

    申请号：US10769429

    申请日：2004-01-30

    申请人： Benjamin H. Wood, III ,  Joseph E. Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    发明人： Benjamin H. Wood, III ,  Joseph E. Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    IPC分类号： B41J2/015

    CPC分类号： B41J2/1623 ,  B41J2/1601 ,  B41J2202/20 ,  Y10T29/49114 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

    摘要翻译： 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。

    Method of making a fluid ejection head for a fluid ejection device
    5.
    发明授权
    Method of making a fluid ejection head for a fluid ejection device 失效
    制造流体喷射装置的流体喷射头的方法

    公开(公告)号：US07480994B2

    公开(公告)日：2009-01-27

    申请号：US11707731

    申请日：2007-02-16

    申请人： Benjamin H. Wood, III ,  Joseph E. Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    发明人： Benjamin H. Wood, III ,  Joseph E. Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    IPC分类号： B21D53/76 ,  B41J2/16

    CPC分类号： B41J2/1623 ,  B41J2/1601 ,  B41J2202/20 ,  Y10T29/49114 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

    摘要翻译： 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。

    Fluid ejection head assembly
    7.
    发明申请
    Fluid ejection head assembly 失效
    流体喷射头组件

    公开(公告)号：US20050168513A1

    公开(公告)日：2005-08-04

    申请号：US10769429

    申请日：2004-01-30

    申请人： Benjamin Wood ,  Joseph Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    发明人： Benjamin Wood ,  Joseph Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    IPC分类号： B41J2/16 ,  B41J2/015

    CPC分类号： B41J2/1623 ,  B41J2/1601 ,  B41J2202/20 ,  Y10T29/49114 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

    摘要翻译： 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。