公开(公告)号：US20220322567A1

公开(公告)日：2022-10-06

申请号：US17848664

申请日：2022-06-24

申请人： Jeff Ku ,  Cora Nien ,  Arnab Sen ,  Samarth Alva ,  Boon Ping Koh ,  Min Suet Lim ,  Arvind S ,  Lance Lin ,  Prakash Kumar Raju ,  Shantanu Kulkarni

发明人： Jeff Ku ,  Cora Nien ,  Arnab Sen ,  Samarth Alva ,  Boon Ping Koh ,  Min Suet Lim ,  Arvind S ,  Lance Lin ,  Prakash Kumar Raju ,  Shantanu Kulkarni

IPC分类号： H05K7/20 ,  G06F1/20

摘要： Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.