METHODS AND APPARATUS TO COOL ELECTRONIC DEVICES

    公开(公告)号:US20220322569A1

    公开(公告)日:2022-10-06

    申请号:US17848583

    申请日:2022-06-24

    Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

    REDUCTION OF FAN-INDUCED VIBRATION IN ELECTRONIC DEVICES

    公开(公告)号:US20250008684A1

    公开(公告)日:2025-01-02

    申请号:US18883785

    申请日:2024-09-12

    Abstract: Systems, apparatus, articles of manufacture, and methods to reduce fan-induced vibration in electronic devices are disclosed. An example electronic device includes a mainboard; a fan; a chassis including a first cover and a second cover; and at least two of: (a) a fastener to couple the fan to the chassis; and a first dampener positioned between both (1) the fan and the fastener and (2) the fan and the chassis; (b) a plurality of check valves orientated in a first direction; and a plurality of inversed check valves oriented in a second direction different than the first direction, the inverse check valves to change a flow rate of air exhausted from the fan; or (c) a first plurality of second dampeners coupled between the mainboard and the first cover; and a second plurality of second dampeners coupled between the mainboard and the second cover.

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