Abstract:
An electronic device for executing a reliability test. Such an electronic device includes a circuit for implementing a functionality of the electronic device, and testing circuit for executing a test of the functional circuit including a plurality of test operations on the functional circuit. The testing circuit returns an indication of a result of each test operation. In an embodiment, the electronic device further includes control circuit for causing the testing circuit to reiterate the test, monitoring circuit for monitoring the result of each test operation to detect a failure of the test operation, and storage circuit for storing failure information indicative of temporal characteristics of each failure.
Abstract:
A self diagnosis (BISD) device for a random memory array, preferably integrated with the random access memory, executes a certain number of predefined test algorithms and identifies addresses of faulty locations. The BISD device recognizes certain fail patterns of interest and generates bit-strings corresponding to them. In practice, the BISD device may diagnose memory arrays and allow the identification of defects in the production process that affect a new technology during its learning phase, thus accelerating its maturation.
Abstract:
A self diagnosis (BISD) device for a random memory array, preferably integrated with the random access memory, executes a certain number of predefined test algorithms and identifies addresses of faulty locations. The BISD device recognizes certain fail patterns of interest and generates bit-strings corresponding to them. In practice, the BISD device may diagnose memory arrays and allow the identification of defects in the production process that affect a new technology during its learning phase, thus accelerating its maturation.
Abstract:
An embodiment for executing a reliability test is proposed. A corresponding electronic device includes functional means for implementing a functionality of the electronic device, and testing means for executing a test of the functional means including a plurality of test operations on the functional means; the testing means returns an indication of a result of each test operation. In an embodiment, the electronic device further includes control means for causing the testing means to reiterate the test, monitoring means for monitoring the result of each test operation to detect a failure of the test operation, and storage means for storing failure information indicative of temporal characteristics of each failure.
Abstract:
A built-in self-test and self-repair structure (BISR) of memory arrays embedded in an integrated device includes at least a test block (BIST) programmable to execute on a respective memory array of the device any of a certain number of test algorithms, and a self-repair block that includes a column address generator processing the faulty address information for allocating redundant resources of the tested memory array. The BISR may further include a redundancy register on which final redundancy information is loaded at each power-on of the device and control logic for managing data transfer from external circuitry to the built-in self-test and self-repair structure (BISR) and vice versa. The BIST structure serves any number of embedded memory arrays even of different types and sizes.
Abstract:
A lateral DMOS transistor having a drain region which comprises a high-concentration portion with which the drain electrode is in contact and a low-concentration portion which is delimited by the channel region. In addition to the conventional source, drain, body and gate electrodes, the transistor has an additional electrode in contact with a point of the low-concentration portion of the drain region which is close to the channel. The additional electrode permits a direct measurement of the electric field in the gate dielectric and thus provides information which can be used both for characterizing the transistor and selecting its dimensions and for activating devices for protecting the transistor and/or other components of an integrated circuit containing the transistor.
Abstract:
An integrated circuit includes an array of memory cells arranged in a plurality of sectors. Each sector includes a plurality of distinct random access memory resources able to be accessed differently in different modes. Peripheral circuitry is commonly shared by at least some of the sectors for addressing and reading/writing data. A respective dedicated controllable power supply line is coupled to each sector.
Abstract:
A built-in self-test and self-repair structure (BISR) of memory arrays embedded in an integrated device includes at least a test block (BIST) programmable to execute on a respective memory array of the device any of a certain number of test algorithms, and a self-repair block that includes a column address generator processing the faulty address information for allocating redundant resources of the tested memory array. The BISR may further include a redundancy register on which final redundancy information is loaded at each power-on of the device and control logic for managing data transfer from external circuitry to the built-in self-test and self-repair structure (BISR) and vice versa. The BIST structure serves any number of embedded memory arrays even of different types and sizes.
Abstract:
A method is for making an integrated circuit with built-in self-test. The method includes forming at least one nonvolatile read only memory (ROM) to store ROM code and forming a logic self-test circuit to verify a correct functioning of the at least one nonvolatile ROM. Moreover, the method includes defining, in the logic self-test circuit, a logic self-test core to process the ROM code and to generate a flag based upon a control signature and defining, in the logic self-test circuit, a nonvolatile storage block, coupled to the logic self-test core, to store the control signature. Furthermore, the method includes writing the ROM code to the at least one nonvolatile ROM and writing the control signature to the nonvolatile storage block, during a same fabrication step.
Abstract:
A method is for making an integrated circuit with built-in self-test. The method includes forming at least one nonvolatile read only memory (ROM) to store ROM code and forming a logic self-test circuit to verify a correct functioning of the at least one nonvolatile ROM. Moreover, the method includes defining, in the logic self-test circuit, a logic self-test core to process the ROM code and to generate a flag based upon a control signature and defining, in the logic self-test circuit, a nonvolatile storage block, coupled to the logic self-test core, to store the control signature. Furthermore, the method includes writing the ROM code to the at least one nonvolatile ROM and writing the control signature to the nonvolatile storage block, during a same fabrication step.