Integrated circuit system with dummy region
    1.
    发明授权
    Integrated circuit system with dummy region 有权
    具有虚拟区域的集成电路系统

    公开(公告)号:US07741719B2

    公开(公告)日:2010-06-22

    申请号:US12235784

    申请日:2008-09-23

    IPC分类号: H01L23/48

    摘要: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

    摘要翻译: 一种集成电路系统,包括在衬底之内的电介质内形成第一区域,第二区域和第三区域。 第一个区域包括钨丝塞。 第二区域形成在第一区域的周边的至少一部分附近,第三区域形成在第一区域和第二区域之间。 在第三区域中形成开口,并且在开口内沉积材料以防止第一区域的侵蚀。

    Integrated circuit system with dummy region
    2.
    发明授权
    Integrated circuit system with dummy region 有权
    具有虚拟区域的集成电路系统

    公开(公告)号:US07446039B2

    公开(公告)日:2008-11-04

    申请号:US11307142

    申请日:2006-01-25

    IPC分类号: H01L21/44

    摘要: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

    摘要翻译: 一种集成电路系统,包括在衬底之内的电介质内形成第一区域,第二区域和第三区域。 第一个区域包括钨丝塞。 第二区域形成在第一区域的周边的至少一部分附近,第三区域形成在第一区域和第二区域之间。 在第三区域中形成开口,并且在开口内沉积材料以防止第一区域的侵蚀。

    INTEGRATED CIRCUIT SYSTEM WITH DUMMY REGION
    3.
    发明申请
    INTEGRATED CIRCUIT SYSTEM WITH DUMMY REGION 有权
    集成电路系统与DUMMY区域

    公开(公告)号:US20070173016A1

    公开(公告)日:2007-07-26

    申请号:US11307142

    申请日:2006-01-25

    IPC分类号: H01L21/8242

    摘要: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

    摘要翻译: 一种集成电路系统,包括在衬底之内的电介质内形成第一区域,第二区域和第三区域。 第一个区域包括钨丝塞。 第二区域形成在第一区域的周边的至少一部分附近,第三区域形成在第一区域和第二区域之间。 在第三区域中形成开口,并且在开口内沉积材料以防止第一区域的侵蚀。

    OPTICAL MODULE FOR IMAGE MEASURING APPARATUS
    4.
    发明申请
    OPTICAL MODULE FOR IMAGE MEASURING APPARATUS 审中-公开
    用于图像测量装置的光学模块

    公开(公告)号:US20130242178A1

    公开(公告)日:2013-09-19

    申请号:US13664607

    申请日:2012-10-31

    IPC分类号: G02B27/12 H04N5/225

    CPC分类号: G01B11/00

    摘要: An optical module includes a first sleeve, a second sleeve, a connecting member and a beam splitter. The first sleeve defines a first hollow cavity and includes a first light source and a pattern plate. The second sleeve defines a second hollow cavity and a second light source. The connecting member is connected to the first sleeve and the second sleeve, and communicates with the first hollow cavity and the second hollow cavity. The beam splitter is positioned in the connecting member. Light from the first light source passes through the pattern plate, and the beam splitter, light from the second light source passes through the beam splitter, the beam splitter refracts the light from the first light source and the second light source to a tested workpiece.

    摘要翻译: 光学模块包括第一套筒,第二套筒,连接件和分束器。 第一套管限定第一中空腔并且包括第一光源和图案板。 第二套管限定第二中空腔和第二光源。 连接构件连接到第一套筒和第二套筒,并与第一中空腔和第二中空腔连通。 分束器位于连接构件中。 来自第一光源的光通过图案板,并且分束器,来自第二光源的光穿过分束器,分束器将来自第一光源和第二光源的光折射到被测试的工件。

    INTEGRATED CIRCUIT SYSTEM WITH DUMMY REGION
    5.
    发明申请
    INTEGRATED CIRCUIT SYSTEM WITH DUMMY REGION 有权
    集成电路系统与DUMMY区域

    公开(公告)号:US20090014883A1

    公开(公告)日:2009-01-15

    申请号:US12235784

    申请日:2008-09-23

    IPC分类号: H01L23/48

    摘要: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

    摘要翻译: 一种集成电路系统,包括在衬底之内的电介质内形成第一区域,第二区域和第三区域。 第一个区域包括钨丝塞。 第二区域形成在第一区域的周边的至少一部分附近,第三区域形成在第一区域和第二区域之间。 在第三区域中形成开口,并且在开口内沉积材料以防止第一区域的侵蚀。