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公开(公告)号:US4746417A
公开(公告)日:1988-05-24
申请号:US896927
申请日:1986-08-15
CPC分类号: H01J37/347 , C23C14/35 , H01J37/3408 , H01J37/3455
摘要: A magnetron sputtering cathode for vacuum coating apparatus has a circular target plate and at least one magnet system disposed in back of it which forms at least one endless tunnel of magnetic lines of force over the target plate. In the marginal area of the target plate there is disposed a first magnet system for the production of a first magnetic tunnel substantially concentric with the axis of rotation, and between the axis of rotation and the first magnet system there is an off-center second magnet system which produces a second magnetic tunnel extending over only a sector of the target plate. When the two magnet systems are rotated together the elements of the surface of the target plate are exposed to the product of the time of stay times the intensity such that the target plate is ablated more uniformly in the middle area and more strongly at the margin, so that a substrate field placed opposite the target plate is uniformly coated.
摘要翻译: 用于真空涂覆装置的磁控溅射阴极具有圆形目标板和设置在其背面的至少一个磁体系统,其在目标板上形成至少一个磁力线的环形隧道。 在目标板的边缘区域中设置有用于产生与旋转轴线基本上同心的第一磁隧道的第一磁体系统,并且在旋转轴线与第一磁体系统之间存在偏心的第二磁体 该系统产生仅在目标板的扇区上延伸的第二磁通道。 当两个磁体系统一起旋转时,目标板的表面的元件暴露于停留时间乘以强度的乘积,使得靶板在中间区域更均匀地被烧蚀并且在边缘处更强烈地被烧蚀, 使得与目标板相对放置的基板场均匀地涂覆。