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公开(公告)号：US20240290593A1
公开(公告)日：2024-08-29
申请号：US18214498
申请日：2023-06-26
Applicant: Applied Materials, Inc.
Inventor： Cory LAFOLLETT , Jie J. ZHANG
CPC classification number: H01J37/3452 , C23C14/35 , H01J37/3405 , H01J37/3455 , H01J2237/332
Abstract: A magnet assembly for a magnetron of a processing chamber includes a support member. A plurality of magnetic tracks is mounted to the support member. Each magnetic track includes a pair of magnetic poles. A partial magnetic track is mounted to the support member. The partial magnetic track includes a single unpaired magnetic pole. The partial magnetic track is mounted proximal to a center of rotation of the support member.
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2.发明公开公开(公告)号：US20230402271A1
公开(公告)日：2023-12-14
申请号：US18237934
申请日：2023-08-25
Applicant: APPLIED MATERIALS, INC.
Inventor： Xiaodong WANG , Joung Joo LEE , Fuhong ZHANG , Martin Lee RIKER , Keith A. MILLER , William FRUCHTERMAN , Rongjun WANG , Adolph Miller ALLEN , Shouyin ZHANG , Xianmin TANG
CPC classification number: H01J37/3458 , H01J37/345 , H01J37/3452 , H01J37/3411 , C23C14/345 , H01J37/3441 , H01J37/3402 , C23C14/351 , C23C14/54 , H01J37/3405 , H01J37/3447 , H01J37/3455
Abstract: Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.
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公开(公告)号：US20230352350A1
公开(公告)日：2023-11-02
申请号：US18341506
申请日：2023-06-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Wen-Hao CHENG , Hsuan-Chih CHU , Yen-Yu CHEN , Yi-Ming DAI
CPC classification number: H01L22/26 , C23C14/351 , C23C14/545 , H01J37/32715 , H01J37/3455 , H01J37/3458
Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.
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公开(公告)号：US20230154734A1
公开(公告)日：2023-05-18
申请号：US17985175
申请日：2022-11-11
Applicant: VON ARDENNE Asset GmbH & Co. KG
Inventor： Thorsten SANDER , Klaus SCHNEIDER , Frank Meissner , Goetz GROSSER , Steffen MOSSHAMMER
CPC classification number: H01J37/3455 , C23C14/35 , H01J37/3405
Abstract: Disclosed herein are systems, methods, devices for a magnet system that includes a housing with a housing interior. The magnet system also includes a magnet holder disposed in the housing interior and supported by the housing, preferably stationary with respect thereto. The magnet system also includes a housing cover forming a fluid-tight chamber when mated with the housing, wherein the housing cover includes a gear stage, a generator, and a rotary coupling that couples the gear stage to the generator.
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公开(公告)号：US10056238B2
公开(公告)日：2018-08-21
申请号：US15193484
申请日：2016-06-27
Applicant: Cardinal CG Company
Inventor： Klaus H. W. Hartig
CPC classification number: H01J37/3455 , C23C14/35 , H01J37/3405 , H01J37/3408 , H01J37/345 , H01J37/3497
Abstract: The invention provides a sputter deposition assembly that includes a sputtering chamber, a sputtering target, and a magnet assembly. The magnet assembly includes a magnetic backing plate with a blind recess into which a moveable magnetic control body can be adjustably disposed.
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Patent Agency Ranking
6.发明授权公开(公告)号：US10053771B2
公开(公告)日：2018-08-21
申请号：US14923353
申请日：2015-10-26
Applicant: Tango Systems, Inc.
Inventor： Ravi Mullapudi , Manohar Korlapati
CPC classification number: C23C14/352 , C23C14/08 , C23C14/505 , C23C14/541 , H01J37/32724 , H01J37/3405 , H01J37/3455 , H01J37/3464
Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.
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公开(公告)号：US10032872B2
公开(公告)日：2018-07-24
申请号：US14277508
申请日：2014-05-14
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki
IPC: H01L29/00 , H01L29/24 , H01L21/02 , H01L21/67 , H01J37/34 , C23C14/35 , C23C14/08 , C23C14/34 , C23C14/56 , H01J37/32 , H01L21/677 , H01L29/66 , H01L29/786
CPC classification number: H01L29/24 , C23C14/08 , C23C14/3464 , C23C14/35 , C23C14/351 , C23C14/56 , C23C14/564 , C23C14/566 , H01J37/32724 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3435 , H01J37/3447 , H01J37/3455 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L21/67017 , H01L21/6719 , H01L21/67196 , H01L21/67207 , H01L21/67748 , H01L29/66969 , H01L29/7869
Abstract: To manufacture a semiconductor device using an oxide semiconductor with high reliability and less variation in electrical characteristics, objects are to provide a method for manufacturing a semiconductor device with which an oxide semiconductor film with a fairly uniform thickness is formed, a manufacturing apparatus, and a method for manufacturing a semiconductor device with the manufacturing apparatus. In order to form an oxide semiconductor film with a fairly uniform thickness with use of a sputtering apparatus, an oxide semiconductor film the thickness uniformity of which is less than ±3%, preferably less than or equal to ±2% is formed by using a manufacturing apparatus in which a deposition chamber is set to have a reduced pressure atmosphere, preferably, to have a high degree of vacuum and power is adjusted to be applied uniformly to the entire surface of a substrate during film deposition.
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公开(公告)号：US09991101B2
公开(公告)日：2018-06-05
申请号：US14725527
申请日：2015-05-29
Applicant: APPLIED MATERIALS, INC.
Inventor： William Johanson , Brij Datta , Fuhong Zhang , Adolph Miller Allen , Yu Y. Liu , Prashanth Kothnur
CPC classification number: H01J37/3405 , C23C14/35 , H01J37/3452 , H01J37/3455 , H01J37/3461
Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a shunt plate having a central axis and rotatable about the central axis, a closed loop magnetic pole coupled to a first surface of the shunt plate and disposed 360 degrees along a peripheral edge of the shunt plate, and an open loop magnetic pole coupled at a the first surface of the shunt plate wherein the open loop magnetic pole comprises two rows of magnets disposed about the central axis.
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公开(公告)号：US09984976B2
公开(公告)日：2018-05-29
申请号：US15041454
申请日：2016-02-11
Applicant: APPLIED MATERIALS, INC.
Inventor： Yana Cheng , Yong Cao , Srinivas Guggilla , Sree Rangasai Kesapragada , Xianmin Tang , Deenesh Padhi
IPC: H01L23/48 , H01L23/532 , H01L21/768
CPC classification number: H01L23/53238 , C23C14/0036 , C23C14/0676 , C23C14/352 , H01J37/32504 , H01J37/3408 , H01J37/3455 , H01L21/02145 , H01L21/02266 , H01L21/76802 , H01L21/76832 , H01L21/76834 , H01L23/53223 , H01L23/53266 , H01L23/5329 , H01L23/53295
Abstract: Interconnect structures and methods of formation of such interconnect structures are provided herein. In some embodiments, a method of forming an interconnect includes: depositing a silicon-aluminum oxynitride (SiAlON) layer atop a first layer of a substrate, wherein the first layer comprises a first feature filled with a first conductive material; depositing a dielectric layer over the silicon-aluminum oxynitride (SiAlON) layer; and forming a second feature in the dielectric layer and the silicon-aluminum oxynitride (SiAlON) layer to expose the first conductive material.
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公开(公告)号：US09932668B2
公开(公告)日：2018-04-03
申请号：US14923357
申请日：2015-10-26
Applicant: Tango Systems, Inc.
Inventor： Ravi Mullapudi , Harish Varma Penmethsa , Harshal T. Vasa , Srikanth Dasaradhi , Lee LeBlanc
CPC classification number: C23C14/352 , C23C14/50 , C23C14/505 , C23C14/541 , H01J37/32724 , H01J37/3405 , H01J37/3411 , H01J37/3455 , H01J37/3464 , H01J2237/006 , H01J2237/2001 , H01J2237/20214
Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.
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