公开(公告)号：US20140001583A1

公开(公告)日：2014-01-02

申请号：US13539444

申请日：2012-06-30

申请人： Weng Hong Teh ,  Zuoming Ming Zhao ,  Danny R. Singh

发明人： Weng Hong Teh ,  Zuoming Ming Zhao ,  Danny R. Singh

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81B3/0005 ,  H01L24/19 ,  H01L29/84 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00

摘要： An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed.

摘要翻译： 一种包括模具的装置，包括第一侧和相对的第二侧，包括具有限定模具的厚度的接触点和侧壁的装置侧; 耦合到管芯的第二侧的积聚载体，所述堆积载体包括导电材料和绝缘材料的多个交替层，其中所述导电材料层中的至少一个耦合到所述接触点之一 的死亡 并且所述积聚载体内的至少一个装置设置在无图案化的导电材料层的区域中。 还公开了包括包括包括微处理器的封装的计算装置的方法和装置。