Method for consolidating and diffusion-bonding powder metallurgy sputtering target
    1.
    发明授权
    Method for consolidating and diffusion-bonding powder metallurgy sputtering target 有权
    粉末冶金溅射靶的固结和扩散粘结方法

    公开(公告)号:US08206646B2

    公开(公告)日:2012-06-26

    申请号:US11644816

    申请日:2006-12-22

    IPC分类号: B22F1/00

    摘要: Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot press, the powder preferably contacted by non-planar surfaces, and is compressed with at least about 95% density and substantially simultaneously diffusion-bonded to the backing plate.

    摘要翻译: 提供制造溅射靶组件及其组件的方法,特别是由粉末制成的靶。 粉末通过使用真空热压机粘附到背板上,粉末优选地与非平面表面接触,并且以至少约95%的密度压缩并基本上同时地扩散粘合到背板上。

    Method for fabricating randomly oriented aluminum alloy sputting targets
with fine grains and fine precipitates
    2.
    发明授权
    Method for fabricating randomly oriented aluminum alloy sputting targets with fine grains and fine precipitates 失效
    制备随机取向的铝合金喷射靶的方法,其具有细晶粒和细小析出物

    公开(公告)号:US5993575A

    公开(公告)日:1999-11-30

    申请号:US054146

    申请日:1998-04-02

    IPC分类号: C22F1/04 C23C14/34 C22C21/00

    CPC分类号: C22F1/04 C23C14/3414

    摘要: A method is provided for fabricating aluminum alloy sputtering targets having fine precipitates of a second phase material in small, randomly oriented and uniform grains. The method provided includes the steps of homogenizing the aluminum alloy billet at a temperature above the solidus temperature, deforming the billet, recrystallizing the billet at a temperature below the solidus temperature, and cryogenically deforming the billet. This minimizes second-phase precipitate size and prevents the formation of cubic structures, thereby generating fine uniform grain sizes having random orientation.

    摘要翻译: 提供一种用于制造具有细小的随机取向和均匀晶粒中的第二相材料的微细沉淀物的铝合金溅射靶的方法。 所提供的方法包括在高于固相线温度的温度下均匀化铝合金坯料的步骤,使坯料变形,在低于固相线温度的温度下使坯料再结晶,并使坯料低温变形。 这使得第二相沉淀物尺寸最小化并防止形成立方结构,由此产生具有随机取向的精细均匀晶粒尺寸。

    Method for fabricating randomly oriented aluminum alloy sputtering
targets with fine grains and fine precipitates
    3.
    发明授权
    Method for fabricating randomly oriented aluminum alloy sputtering targets with fine grains and fine precipitates 失效
    制造具有细晶粒和细小析出物的随机取向的铝合金溅射靶的方法

    公开(公告)号:US5766380A

    公开(公告)日:1998-06-16

    申请号:US743305

    申请日:1996-11-05

    IPC分类号: C22F1/04 C23C14/34 C22C21/00

    CPC分类号: C22F1/04 C23C14/3414

    摘要: A method of fabricating an alloy sputtering target having fine precipitates of the second phase material and small, randomly oriented and uniform grains. The new method includes solution treatment to minimize second-phase precipitate size, cryo-deformation to prevent the formation of cubic structures and recrystallization to generate fine uniform grain sizes having a random orientation.

    摘要翻译: 一种制造具有第二相材料的微细沉淀物和小的随机取向和均匀晶粒的合金溅射靶的方法。 新方法包括固溶处理以使第二相沉淀物尺寸最小化,低温变形以防止立方结构的形成和重结晶以产生具有随机取向的精细均匀晶粒尺寸。

    Bonded sputtering target and methods of manufacture
    4.
    发明申请
    Bonded sputtering target and methods of manufacture 审中-公开
    粘结溅射靶和制造方法

    公开(公告)号:US20080236738A1

    公开(公告)日:2008-10-02

    申请号:US11731106

    申请日:2007-03-30

    IPC分类号: C23C14/00 B32B38/00

    CPC分类号: C23C14/3407

    摘要: Methods for manufacturing sputtering target assemblies by bonding target materials to backing plates using metals and alloys in powder form to achieve substantially 100% bonding at temperatures achieved in a vacuum hot press.

    摘要翻译: 通过使用粉末形式的金属和合金将目标材料粘合到背板上来制造溅射靶组件的方法,以在真空热压机中实现的温度实现基本上100%的粘合。

    Method of making high-density, high-purity tungsten sputter targets
    5.
    发明授权
    Method of making high-density, high-purity tungsten sputter targets 失效
    制造高密度,高纯度钨溅射靶的方法

    公开(公告)号:US06328927B1

    公开(公告)日:2001-12-11

    申请号:US09220906

    申请日:1998-12-24

    IPC分类号: B22F314

    摘要: A method is provided for fabricating tungsten sputter targets having a density of at least about 97% of theoretical density and an oxygen content of at least about 100 ppm less than the starting powder. According to the principles of the present invention, a tungsten powder having a powder size less than about 50 &mgr;m and an oxygen content less than about 500 ppm is hot-isostatic pressed at a temperature of about 1200° C. to about 1600° C. and a pressure of at least about 15 ksi for at least about 3 hours. A high-purity sputter target is further achieved by using a tungsten starting powder having a purity higher than about 99.999%.

    摘要翻译: 提供了一种用于制造具有至少约97%理论密度的密度并且氧含量低于起始粉末至少约100ppm的钨溅射靶的方法。 根据本发明的原理,粉末尺寸小于约50μm,氧含量小于约500ppm的钨粉在约1200℃至约1600℃的温度下进行热等静压。 和至少约15ksi的压力至少约3小时。 通过使用纯度高于约99.999%的钨起始粉末进一步实现高纯度溅射靶。

    Cryogenic annealing of sputtering targets
    6.
    发明授权
    Cryogenic annealing of sputtering targets 失效
    溅射靶的低温退火

    公开(公告)号:US6056857A

    公开(公告)日:2000-05-02

    申请号:US910334

    申请日:1997-08-13

    IPC分类号: C23C14/34 C23C14/56

    CPC分类号: C23C14/564 C23C14/3414

    摘要: Sputtering targets are cryogenically annealed to provide a uniformly dense molecular structure by placing the target in a temperature-controlled cryogenic chamber and cooling the chamber to a cryogenic temperature at a controlled rate. The target is maintained at a cryogenic temperature to cryogenically anneal the target and the target is subsequently returned to ambient or elevated temperature. Improvements in sputtered particle performance and early life film uniformity are achieved with the cryo-annealed targets.

    摘要翻译: 溅射靶被低温退火以通过将靶放置在温度控制的低温室中并以受控的速率将腔室冷却至低温温度来提供均匀致密的分子结构。 目标物保持在低温温度以对靶进行低温退火,并且靶物随后返回到环境温度或升高的温度。 利用低温退火靶物可实现溅射粒子性能和早期寿命膜均匀性的提高。

    Method for consolidating and diffusion-bonding powder metallurgy sputtering target
    7.
    发明申请
    Method for consolidating and diffusion-bonding powder metallurgy sputtering target 有权
    粉末冶金溅射靶的固结和扩散粘结方法

    公开(公告)号:US20080149477A1

    公开(公告)日:2008-06-26

    申请号:US11644816

    申请日:2006-12-22

    IPC分类号: C23C14/00

    摘要: Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot press, the powder preferably contacted by non-planar surfaces, and is compressed with at least about 95% density and substantially simultaneously diffusion-bonded to the backing plate.

    摘要翻译: 提供制造溅射靶组件及其组件的方法,特别是由粉末制成的靶。 粉末通过使用真空热压机粘附到背板上,粉末优选地与非平面表面接触,并且以至少约95%的密度压缩并基本上同时地扩散粘合到背板上。

    METHOD FOR CONSOLIDATING AND DIFFUSION-BONDING POWDER METALLURGY SPUTTERING TARGET
    9.
    发明申请
    METHOD FOR CONSOLIDATING AND DIFFUSION-BONDING POWDER METALLURGY SPUTTERING TARGET 审中-公开
    聚合和扩散粘结粉末冶金溅射目标的方法

    公开(公告)号:US20120228131A1

    公开(公告)日:2012-09-13

    申请号:US13482482

    申请日:2012-05-29

    IPC分类号: C23C14/34 B30B13/00 C23C14/14

    摘要: Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot press, the powder preferably contacted by non-planar surfaces, and is compressed with at least about 95% density and substantially simultaneously diffusion-bonded to the backing plate.

    摘要翻译: 提供制造溅射靶组件及其组件的方法,特别是由粉末制成的靶。 粉末通过使用真空热压机粘附到背板上,粉末优选地与非平面表面接触,并且以至少约95%的密度压缩并基本上同时地扩散粘合到背板上。

    METHOD FOR PRODUCTION OF ALUMINUM CONTAINING TARGETS
    10.
    发明申请
    METHOD FOR PRODUCTION OF ALUMINUM CONTAINING TARGETS 审中-公开
    生产含铝的方法

    公开(公告)号:US20100140084A1

    公开(公告)日:2010-06-10

    申请号:US12330996

    申请日:2008-12-09

    IPC分类号: C23C14/34 B22F3/24

    摘要: A method of manufacturing a sputter target is provided which comprises mixing aluminum and at least one other metallic powder to form a powder blend, compressing said powder blend under significant force to achieve a pressed blank having a packing density of at least 50% of the theoretical density, heating the blank at a temperature less then the temperature which would form greater than an average of 25% inter-metallic phases in the blank under the conditions employed, rolling the blank to obtain at least 95% of the theoretical thickness of the blank, and bonding the blank to a suitable substrate. Also provided is a sputter target made from this method.

    摘要翻译: 提供一种制造溅射靶的方法,其包括将铝和至少一种其它金属粉末混合以形成粉末共混物,在显着的力下压缩所述粉末共混物以获得压片坯料,所述压制坯料的堆积密度为理论值的至少50% 密度,在低于在所用条件下在坯料中形成大于平均25%金属间相的温度的温度加热坯料,轧制坯料以获得坯料的理论厚度的至少95% ,并将坯料粘合到合适的基底上。 还提供了由该方法制成的溅射靶。