Chassis apparatus protruding electronic devices
    2.
    发明授权
    Chassis apparatus protruding electronic devices 有权
    底盘设备突出电子设备

    公开(公告)号:US08693195B2

    公开(公告)日:2014-04-08

    申请号:US13460991

    申请日:2012-05-01

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20736

    摘要: An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.

    摘要翻译: 一种装置包括还包括至少一个接收支撑件的底架。 所述底盘限定外壳,并且所述至少一个支撑件通过防止所述第一电子设备进一步插入到所述外壳中而突出所述外壳外部的第一电子设备的一部分。

    BACKPLANE MODULE
    3.
    发明申请
    BACKPLANE MODULE 有权
    背板模块

    公开(公告)号:US20130279501A1

    公开(公告)日:2013-10-24

    申请号:US13451686

    申请日:2012-04-20

    IPC分类号: H04L12/50

    CPC分类号: H04L49/40

    摘要: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.

    摘要翻译: 提供模块,模块化设备和模块化系统。 一些示例包括在第一平面中定向的背板,包括平行于第一平面定向的主表面的第一模块和垂直于第一平面定向的第一副表面,其中第一模块的主表面可释放地包括连接器 与位于背板的第一侧上的对应连接器配合。 一些示例包括第二模块,其包括垂直于第一平面定向的主表面和平行于第一平面定向的第一副表面,其中第二模块的第一次表面包括其上的连接器,该连接器可释放地与位于 背板的第二面。 第一模块内的电路可以为第二模块提供互连。 第一和第二模块可以分别是Fabric和接口模块。

    Backplane module
    4.
    发明授权
    Backplane module 有权
    背板模块

    公开(公告)号:US08767725B2

    公开(公告)日:2014-07-01

    申请号:US13451686

    申请日:2012-04-20

    IPC分类号: H04L12/50

    CPC分类号: H04L49/40

    摘要: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.

    摘要翻译: 提供模块,模块化设备和模块化系统。 一些示例包括在第一平面中定向的背板,包括平行于第一平面定向的主表面的第一模块和垂直于第一平面定向的第一副表面,其中第一模块的主表面可释放地包括连接器 与位于背板的第一侧上的对应连接器配合。 一些示例包括第二模块,其包括垂直于第一平面定向的主表面和平行于第一平面定向的第一副表面,其中第二模块的第一次表面包括其上的连接器,该连接器可释放地与位于 背板的第二面。 第一模块内的电路可以为第二模块提供互连。 第一和第二模块可以分别是Fabric和接口模块。

    HEAT SINK ASSEMBLY
    5.
    发明申请
    HEAT SINK ASSEMBLY 审中-公开
    散热装置

    公开(公告)号:US20140036451A1

    公开(公告)日:2014-02-06

    申请号:US13563393

    申请日:2012-07-31

    IPC分类号: H05K7/20 H05K13/00

    摘要: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.

    摘要翻译: 散热器组件包括印刷电路板,散热器和夹具,以及至少两个夹具保持器。 印刷电路板具有从印刷电路板的前表面延伸到后表面的至少两个孔。 散热器安装在印刷电路板上。 散热器具有从顶侧延伸的底侧和多个翅片。 夹具连接到印刷电路板。 夹具包括横跨散热器并在相邻散热片之间延伸的梁,延伸穿过印刷电路板的至少两个孔的至少两个腿,以及从至少两个腿中的每一个延伸的脚, 印刷电路板。 所述至少两个夹持保持件延伸穿过与所述至少两个腿相邻的所述至少两个孔。

    Chassis extension module
    6.
    发明授权
    Chassis extension module 有权
    机箱扩展模块

    公开(公告)号:US08614890B2

    公开(公告)日:2013-12-24

    申请号:US13088526

    申请日:2011-04-18

    IPC分类号: H05K7/20 A47B81/00

    CPC分类号: H05K7/1487 H05K5/0021

    摘要: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

    摘要翻译: 机架扩展模块包括延伸壳体结构和支撑结构。 延伸壳体结构将附接到另一模块的壳体结构。 将延伸壳体结构附接到另一模块的壳体结构将组件的内部容积扩大。

    CHASSIS APPARATUS PROTRUDING ELECTRONIC DEVICES
    7.
    发明申请
    CHASSIS APPARATUS PROTRUDING ELECTRONIC DEVICES 有权
    配套设备推出电子设备

    公开(公告)号:US20130293075A1

    公开(公告)日:2013-11-07

    申请号:US13460991

    申请日:2012-05-01

    IPC分类号: H05K7/20 H05K5/02

    CPC分类号: H05K7/20736

    摘要: An apparatus includes a chassis including at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion electronic devices outside the enclosure by preventing further insertion of the electronic devices into the enclosure.

    摘要翻译: 一种装置包括:底盘,包括至少一个接收支撑件。 所述底盘限定外壳,并且所述至少一个支撑件通过防止所述电子设备进一步插入到所述外壳中而突出所述外壳外的一部分电子设备。

    CHASSIS CARD CAGE
    8.
    发明申请
    CHASSIS CARD CAGE 审中-公开
    底盘卡

    公开(公告)号:US20130284682A1

    公开(公告)日:2013-10-31

    申请号:US13455944

    申请日:2012-04-25

    IPC分类号: H05K7/14 H05K7/00

    CPC分类号: H05K7/1425

    摘要: A chassis card cage includes a front panel, a backplane opposite the front panel, opposing sides extending between the front panel and the backplane, a series of module slots extending between opposing sides, each of the series of module slots configured to accommodate a card module, and a module slot divider including a first portion extending perpendicularly from the backplane and a second portion connectable to the first portion and extending from the second portion toward the front panel, wherein at least the second portion of the module slot divider has a divider height substantially equal to a height of a single module slot and is configured to divide one of the series of module slots into side-by-side module slots.

    摘要翻译: 机箱卡笼包括前面板,与前面板相对的背板,在前面板和背板之间延伸的相对侧,在相对侧之间延伸的一系列模块插槽,每个模块插槽中的每一个被配置为容纳卡模块 以及模块插槽分隔器,其包括从背板垂直延伸的第一部分和可连接到第一部分并从第二部分朝向前面板延伸的第二部分,其中模块插槽分隔器的至少第二部分具有分隔器高度 基本上等于单个模块插槽的高度,并且被配置为将所述一系列模块插槽中的一个分成并排模块插槽。

    ELECTROMAGNETIC INTERFERENCE SHIELDING
    9.
    发明申请
    ELECTROMAGNETIC INTERFERENCE SHIELDING 审中-公开
    电磁干扰屏蔽

    公开(公告)号:US20130269997A1

    公开(公告)日:2013-10-17

    申请号:US13444081

    申请日:2012-04-11

    IPC分类号: H05K9/00 H05K13/00

    摘要: A wire defining a repeating pattern is removably joined to a flange having apertures defined therein. The wire includes contact portions to make electrically-conductive contact with a device supported by a chassis. The device can be cooled by air flow through the apertures of the flange while being protected against electromagnetic interference (EMI). The wire and the flange can be respectively formed from various metals and are separable from each other for recycling or other purposes.

    摘要翻译: 限定重复图案的线可移除地连接到其中限定有孔的凸缘。 导线包括接触部分,以与由底盘支撑的装置导电接触。 该装置可以通过空气流过法兰的孔而被冷却,同时防止电磁干扰(EMI)。 电线和凸缘可以分别由各种金属形成,并且可以彼此分离以用于回收或其它目的。

    CHASSIS EXTENSION MODULE
    10.
    发明申请
    CHASSIS EXTENSION MODULE 有权
    基座扩展模块

    公开(公告)号:US20120262876A1

    公开(公告)日:2012-10-18

    申请号:US13088526

    申请日:2011-04-18

    CPC分类号: H05K7/1487 H05K5/0021

    摘要: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

    摘要翻译: 机架扩展模块包括延伸壳体结构和支撑结构。 延伸壳体结构将附接到另一模块的壳体结构。 将延伸壳体结构附接到另一模块的壳体结构将组件的内部容积扩大。