公开(公告)号：US07730611B2

公开(公告)日：2010-06-08

申请号：US12052948

申请日：2008-03-21

申请人： Ulf Becker ,  David Halk

发明人： Ulf Becker ,  David Halk

IPC分类号： H05K3/30 ,  H01L21/70

CPC分类号： H01L21/67144 ,  Y10T29/49117 ,  Y10T29/4913

摘要： A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

摘要翻译： 准确地放置拾取和放置机器的物体的方法提供原料。 在原材料中形成所需的表面形貌。 使用斜切将原料切成部分，使得每个部件具有斜面。 提供了具有多个间隔空腔的固定装置，每个空腔具有构造和布置成与相关联部件的斜面相配合的斜面。 拾取和放置机器将每个部件拾取并放置在相关联的腔中，使得部件的斜面与空腔的斜面相配合。

公开(公告)号：US20060022273A1

公开(公告)日：2006-02-02

申请号：US11185062

申请日：2005-07-20

申请人： David Halk

发明人： David Halk

IPC分类号： H01L23/62

CPC分类号： H01L21/6835 ,  H01L23/4985 ,  H01L24/79 ,  H01L24/86 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01068

摘要： A system and method for assembly of semiconductor dies to flexible circuits, wherein the present invention utilizes UV release tape as a temporary, removable carrier for precisely aligning, and maintaining the alignment of, a semiconductor die, and more specifically, the interconnecting pads thereof, with the conducting leads of a flexible circuit; thereby, expediting subsequent permanent affixation of same via thermo-sonic TAB bonding processes, or the like.

摘要翻译： 一种用于将半导体管芯组装到柔性电路的系统和方法，其中本发明利用UV释放带作为临时的可移除载体，用于精确地对准并保持半导体管芯的对准，并且更具体地说，其互连焊盘， 具有柔性电路的导线; 从而通过热声TAB粘合工艺等加速其后续的固定。

公开(公告)号：US20080240893A1

公开(公告)日：2008-10-02

申请号：US12052948

申请日：2008-03-21

申请人： Ulf Becker ,  David Halk

发明人： Ulf Becker ,  David Halk

IPC分类号： B65H1/00

CPC分类号： H01L21/67144 ,  Y10T29/49117 ,  Y10T29/4913

摘要： A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

摘要翻译： 准确地放置拾取和放置机器的物体的方法提供原料。 在原材料中形成所需的表面形貌。 使用斜切将原料切成部分，使得每个部件具有斜面。 提供了具有多个间隔空腔的固定装置，每个空腔具有构造和布置成与相关联部件的斜面相配合的斜面。 拾取和放置机器将每个部件拾取并放置在相关联的腔中，使得部件的斜面与空腔的斜面相配合。