Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials
    2.
    发明授权
    Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials 有权
    聚合化学注入水射流以提高切割质量,同时切割非常脆的材料

    公开(公告)号:US06676486B1

    公开(公告)日:2004-01-13

    申请号:US09909603

    申请日:2001-07-20

    Inventor: David J. Quirke

    CPC classification number: H01L21/67092 B24C1/045

    Abstract: The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system. In the water jet cutting system a mixture of water and at least one water soluble polymer is wet injected into a water stream and then a high pressure polymer water jet is used to cut the brittle substrate. The non-rectangular shaped optical integrated circuits are isolated by water jet cutting in a curvilinear manner without fatally damaging adjacent optical integrated circuits.

    Abstract translation: 本发明涉及用于隔离形成在脆性衬底上的非矩形形状的光学集成电路的方法和系统。 例如,在水射流切割系统上设置包括多个非矩形的光学集成电路的脆性衬底。 在水射流切割系统中,将水和至少一种水溶性聚合物的混合物湿注入水流中,然后使用高压聚合物水射流切割脆性底物。 非矩形形状的光学集成电路通过水射流切割以曲线方式隔离,而不会对相邻的光学集成电路造成损害。

    Wet injecting fine abrasives for water jet curved cutting of very brittle materials
    3.
    发明授权
    Wet injecting fine abrasives for water jet curved cutting of very brittle materials 有权
    湿注射精细磨料,用于喷射弯曲切割非常脆的材料

    公开(公告)号:US06676485B1

    公开(公告)日:2004-01-13

    申请号:US09885355

    申请日:2001-06-20

    CPC classification number: H01L21/67092 B24C1/045

    Abstract: The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system. In the cutting head of the water jet cutting system, a mixture of water and abrasive particles is wet injected into a supply of a high pressure water stream. The non-rectangular shaped optical integrated circuits are isolated by water jet cutting in a curvilinear manner without fatally damaging adjacent optical integrated circuits.

    Abstract translation: 本发明涉及用于隔离形成在脆性衬底上的非矩形形状的光学集成电路的方法和系统。 例如,在水射流切割系统上设置包括多个非矩形的光学集成电路的脆性衬底。 在水射流切割系统的切割头中,水和磨料颗粒的混合物被湿注入到高压水流的供应中。 非矩形形状的光学集成电路通过水射流切割以曲线方式隔离,而不会对相邻的光学集成电路造成损害。

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