公开(公告)号：US07447394B2

公开(公告)日：2008-11-04

申请号：US11753074

申请日：2007-05-24

申请人： Calvin Ho ,  Brian McGinnis ,  Wilson Long ,  Ed Fontecha ,  David J. Quirke ,  Thomas S. Tarter ,  Sam Seto ,  Liang Zhao

发明人： Calvin Ho ,  Brian McGinnis ,  Wilson Long ,  Ed Fontecha ,  David J. Quirke ,  Thomas S. Tarter ,  Sam Seto ,  Liang Zhao

IPC分类号： G02B6/12 ,  G02B6/28 ,  G02B6/34

CPC分类号： G02B6/1203 ,  G02B6/12014 ,  G02B6/12019

摘要： An optical device with a non-rectilinearly shaped optical integrated circuit over a substantially flat portion of a riser, the riser also equipped with a relief structure that is in thermal contact with a stabilizing brace that is in turn connected to two portions of the non-rectilinearly shaped optical integrated circuit. The non-rectilinearly shaped optical integrated circuit exhibits reduced center wavelength drift.

摘要翻译： 一种在提升板的基本上平坦的部分上具有非直线形的光学集成电路的光学装置，所述提升管还配备有与稳定支架热接触的浮雕结构，所述稳定支架又连接到所述非直线形的两个部分， 直线形光集成电路。 非直线形光学集成电路表现出减小的中心波长漂移。

公开(公告)号：US07720328B2

公开(公告)日：2010-05-18

申请号：US12241860

申请日：2008-09-30

申请人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao Xu ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

发明人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao Xu ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

IPC分类号： G02B6/12

CPC分类号： G02B6/12026 ,  G01J3/0286 ,  G02B6/12011

摘要： A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple optical elements can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than optical elements, by stabilizing one of the optical elements in the same manner as in the case of a single optical elements, and determining power dissipated in the heaters of the remaining optical elements based on the linearized model.

摘要翻译： 可以使用光学集成电路的线性化热和光学模型来使用主动温度调节来温度稳定电路的一个或多个光学元件。 为了稳定单个光学元件，可以在光栅附近提供温度传感器和加热器。 然后可以使用热系数和光学系数为温度控制器选择适当的温度设定点，该温度控制器从传感器接收读数并确定加热器中消耗的功率。 多个光学元件可以单独稳定，使用相同的工艺并将交叉加热因子与其他环境因素结合在一起。 或者，通过以与单个光学元件的情况相同的方式来稳定光学元件之一，可以使用比光学元件少的传感器来稳定多个AWG，并且基于所述光学元件的剩余光学元件的加热器确定功率消耗 线性化模型。

公开(公告)号：US07447393B2

公开(公告)日：2008-11-04

申请号：US10760145

申请日：2004-01-16

申请人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao Xu ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

发明人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao Xu ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

IPC分类号： G02B6/12

CPC分类号： G02B6/12026 ,  G01J3/0286 ,  G02B6/12011

摘要： A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, such as an arrayed waveguide grating (AWG), a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple AWG's can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than AWG's, by stabilizing one of the AWG's in the same manner as in the case of a single AWG, and determining power dissipated in the heaters of the remaining AWG's based on the linearized model.

摘要翻译： 可以使用光学集成电路的线性化热和光学模型来使用主动温度调节来温度稳定电路的一个或多个光学元件。 为了稳定单个光学元件，例如阵列波导光栅（AWG），可以在光栅附近提供温度传感器和加热器。 然后可以使用热系数和光学系数为温度控制器选择适当的温度设定点，该温度控制器从传感器接收读数并确定加热器中消耗的功率。 多个AWG可以单独稳定，使用相同的过程并将交叉加热因子与其他环境因素结合在一起。 或者，通过使用比AWG更少的传感器，可以使用比AWG更少的传感器来稳定多个AWG，通过以与单个AWG相同的方式稳定AWG之一，并根据线性化模型确定剩余AWG的加热器中消耗的功率。

公开(公告)号：US20090087138A1

公开(公告)日：2009-04-02

申请号：US12241860

申请日：2008-09-30

申请人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao XU ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

发明人： Ming Yan ,  Anthony J. Ticknor ,  Calvin Ho ,  Hao XU ,  Jason Weaver ,  Thomas S. Tarter ,  Jane Lam

IPC分类号： G02B6/12

CPC分类号： G02B6/12026 ,  G01J3/0286 ,  G02B6/12011

摘要： A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple optical elements can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than optical elements, by stabilizing one of the optical elements in the same manner as in the case of a single optical elements, and determining power dissipated in the heaters of the remaining optical elements based on the linearized model.

摘要翻译： 可以使用光学集成电路的线性化热和光学模型来使用主动温度调节来温度稳定电路的一个或多个光学元件。 为了稳定单个光学元件，可以在光栅附近提供温度传感器和加热器。 然后可以使用热系数和光学系数为温度控制器选择适当的温度设定点，该温度控制器从传感器接收读数并确定加热器中消耗的功率。 多个光学元件可以单独稳定，使用相同的工艺并将交叉加热因子与其他环境因素结合在一起。 或者，通过以与单个光学元件的情况相同的方式来稳定光学元件之一，可以使用比光学元件少的传感器来稳定多个AWG，并且基于所述光学元件的剩余光学元件的加热器确定功率消耗 线性化模型。

公开(公告)号：US06559667B1

公开(公告)日：2003-05-06

申请号：US09734551

申请日：2000-12-13

申请人： Thomas S. Tarter

发明人： Thomas S. Tarter

IPC分类号： G01R3126

CPC分类号： G01R31/2896 ,  G01R31/2877

摘要： A thermal test chip array and method of forming the same allows access to any test die in the array regardless of the size of the array. The thermal test chip arrangement has a plurality of thermal test chips arranged in an array, each thermal test chip having a heating circuit and a temperature-sensing circuit. A first set of conductive lines traverse unbroken across the entire array. The heating circuit of each thermal test chip is connected to some of the first set of conductive lines. These conductive lines provide power to the heating circuits of the thermal test chips. A second set of conductive lines traverse unbroken across the entire array with the temperature-sensing circuit of each thermal test chip being connected to some of the second set of conductive lines. Power is carried to the temperature sensing circuits of the thermal test chips by the second set of conductive lines.

摘要翻译： 热测试芯片阵列及其形成方法允许访问阵列中的任何测试芯片，而不管阵列的大小。 热测试芯片布置具有排列成阵列的多个热测试芯片，每个热测试芯片具有加热电路和温度感测电路。 第一组导线穿过整个阵列的不间断。 每个热测试芯片的加热电路连接到第一组导线中的一些。 这些导线为热测试芯片的加热电路提供电力。 第二组导线穿过整个阵列的不间断，每个热测试芯片的温度感测电路连接到第二组导线。 通过第二组导线将功率传送到热测试芯片的温度感测电路。

公开(公告)号：US06512675B1

公开(公告)日：2003-01-28

申请号：US09764132

申请日：2001-01-19

申请人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

发明人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

IPC分类号： H05K720

CPC分类号： H01L23/3675 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

摘要： An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.

摘要翻译： 具有集成电路的集成电路封装被安装到系统板上。 系统板的接地线连接到封装，其表面具有接地引线。 将导电环氧树脂放置在接地引线上，并将封装盖粘合到封装板上并将封装盖接地。 散热器通过导电粘合剂或导电滑块安装到封装盖上，导电滑块从封装盖的凸缘延伸到散热器的凸缘以将散热器接地。

公开(公告)号：US07088887B2

公开(公告)日：2006-08-08

申请号：US10744790

申请日：2003-12-23

申请人： Peter D. Ascanio ,  Thomas S. Tarter

发明人： Peter D. Ascanio ,  Thomas S. Tarter

IPC分类号： G02B6/34 ,  G02B6/12 ,  H05B1/00 ,  H05B3/20

CPC分类号： G02B6/12026 ,  H05B3/286 ,  H05B2203/013 ,  H05B2203/017

摘要： Systems and methods for an isothermal thin film heater are provided. The isothermal thin film heater mitigates temperature variations in an optical circuit, such as an arrayed-waveguide grating. The thin film heater comprises a conductive plate and at least one heating element trace coupled to the conductive plate for heating the optical circuit. The heating element trace(s) is arranged around a periphery portion of the conductive plate such that concentric arcs are formed by the heating element trace(s). A sensor for sensing the temperature of the thin film heater and/or the optical circuit can also be provided.

摘要翻译： 提供了等温薄膜加热器的系统和方法。 等温薄膜加热器减轻诸如阵列波导光栅的光学电路中的温度变化。 薄膜加热器包括导电板和耦合到导电板的至少一个加热元件迹线，用于加热光学电路。 加热元件迹线围绕导电板的周边部分布置，使得同心圆弧由加热元件迹线形成。 还可以提供用于感测薄膜加热器和/或光电路的温度的传感器。

公开(公告)号：US06424140B1

公开(公告)日：2002-07-23

申请号：US09563489

申请日：2000-05-03

申请人： Nhon T. Do ,  Thomas S. Tarter

发明人： Nhon T. Do ,  Thomas S. Tarter

IPC分类号： G01R3102

CPC分类号： G01R1/0483

摘要： A test fixture and method of isolating an electrical contact of chip scale package for testing the electrical characteristics of the electrical contact has a base and an isolation plate. The isolation plate is configured to contact and ground all of the electrical contacts of the chip scale package under test, except for a selected subset of the electrical contacts. The isolation plate includes a hole that provides access to the selected subset of electrical contacts to allow a test probe access to the isolated electrical contact.

摘要翻译： 隔离用于测试电接触的电气特性的芯片级封装的电触点的测试夹具和方法具有底座和隔离板。 隔离板被配置为接触和接地所测试的芯片级封装的所有电触点，除了所选择的电触头子集之外。 隔离板包括孔，其提供对所选择的电触点子集的访问，以允许测试探针访问隔离的电触点。

公开(公告)号：US06396296B1

公开(公告)日：2002-05-28

申请号：US09571269

申请日：2000-05-15

申请人： Thomas S. Tarter ,  Nhon T. Do

发明人： Thomas S. Tarter ,  Nhon T. Do

IPC分类号： G01R3126

CPC分类号： G01R31/2851 ,  G01R31/2894 ,  G01R31/2896

摘要： An integrated circuit package test station supports an integrated circuit package under test in a vertical orientation thereby allowing simultaneous access to both sides of the package. Probe assemblies are utilized on both sides of the package to increase the accuracy, efficiency, and simplicity of performing electrical characterization of the IC package. The IC package holder as well as the probe assemblies are adjustably positioned to allow accurate and precise measurements of through-package electrical characteristics. To aid in positioning the test equipment, a dual-display image magnification system is used which provides images from both sides of the IC package simultaneously.

摘要翻译： 集成电路封装测试台以垂直方向支持被测试的集成电路封装，从而允许同时访问封装的两侧。 在封装的两侧使用探针组件，以提高执行IC封装的电气特性的精度，效率和简单性。 IC封装架和探头组件可调节地定位，以允许精确和精确地测量通过封装的电气特性。 为了帮助定位测试设备，使用双显示图像放大系统，其同时从IC封装的两侧提供图像。