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公开(公告)号：US07320928B2
公开(公告)日：2008-01-22
申请号：US10600203
申请日：2003-06-20
IPC分类号： H01L21/30
CPC分类号： H01L21/563 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73104 , H01L2224/73203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H01L2224/05647 , H01L2924/00014
摘要： Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
摘要翻译： 公开了堆叠装置填料和形成方法的许多实施方案。 在一个实施例中，形成堆叠装置填料的方法包括在层叠装置的两个或更多个基板之间形成材料层，并且在至少部分材料中引起反应，其中反应可以包括聚合，并且材料 层可以是例如材料的一种或组合，例如非导电聚合物材料。
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公开(公告)号：US06984873B2
公开(公告)日：2006-01-10
申请号：US10728616
申请日：2003-12-05
IPC分类号： H01L29/06
CPC分类号： H01L21/563 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73104 , H01L2224/73203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H01L2224/05647 , H01L2924/00014
摘要： Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
摘要翻译： 公开了堆叠装置填料和形成方法的许多实施方案。 在一个实施例中，形成堆叠装置填料的方法包括在层叠装置的两个或更多个基板之间形成材料层，并且在至少部分材料中引起反应，其中反应可以包括聚合，并且材料 层可以是例如材料的一种或组合，例如非导电聚合物材料。
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