公开(公告)号：US08461019B2

公开(公告)日：2013-06-11

申请号：US13185942

申请日：2011-07-19

Applicant: Devin Martin ,  Mark Brown

Inventor： Devin Martin ,  Mark Brown

IPC: H01L21/30 ,  H01L21/46

CPC classification number: H01L21/67132 ,  B24B7/228 ,  B24B19/022 ,  B24B37/042 ,  H01L21/67092 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54493 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.

Abstract translation: 一种处理器件晶片的方法包括载体晶片准备步骤，其准备载体晶片，该载体晶片在其表面上包括过量的载体区域，该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置， 所述载体晶片在所述凹部形成步骤之后，在所述粘合剂放置步骤之后，将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤， 晶片接合步骤，将载体晶片的表面和器件晶片的表面彼此接合，从而将器件晶片用粘合剂固定在载体晶片上，并且在晶片接合步骤之后，使设备变薄的变薄步骤 通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。

公开(公告)号：US08580655B2

公开(公告)日：2013-11-12

申请号：US13410794

申请日：2012-03-02

Applicant: Devin Martin ,  Mark Brown

Inventor： Devin Martin ,  Mark Brown

IPC: H01L21/46

CPC classification number: H01L21/67092

Abstract: A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.

Abstract translation: 一种凸起包括器件晶片的处理方法，包括：粘合剂提供步骤，在载体晶片的环形槽中提供粘合剂，使得粘合剂从载体晶片的环形突起的上表面突出; 晶片安装步骤，通过所述粘合剂将所述器件晶片的前侧附着并固定到所述载体晶片的前侧，以便在执行所述粘合剂提供步骤之后容纳所述载体晶片的凹部中的凸起; 以及在进行晶片安装步骤之后，研磨或抛光器件晶片的背面的厚度减小步骤，以将器件晶片的厚度减小到预定厚度。

公开(公告)号：US20070151257A1

公开(公告)日：2007-07-05

申请号：US11325861

申请日：2006-01-05

Applicant: Mark Maier ,  James West ,  David Johnson ,  Devin Martin

Inventor： Mark Maier ,  James West ,  David Johnson ,  Devin Martin

IPC: F02C6/08

CPC classification number: F01D5/189 ,  F01D9/06 ,  F01D25/12 ,  F02C3/13 ,  Y02E20/16

Abstract: Disclosed herein is a method for enabling turn down of a turbine engine, comprising: extracting compressor discharge air from a working fluid path before it enters a combustion zone of the turbine engine; and reintroducing the extracted air to the working fluid path downstream of a combustor exit. Further disclosed herein is an apparatus related to a gas turbine, comprising: a compressor section, one or more combustors downstream from the compressor section, a turbine section downstream from the compressor section; and at least one conduit for extracting compressor discharge air from a working fluid path prior to a combustion zone and reintroducing the extracted air to the working fluid path downstream of a combustor exit in response to the turbine being in a turned down condition.

Abstract translation: 本文公开了一种能够使涡轮发动机转向的方法，包括：在进入涡轮发动机的燃烧区域之前从工作流体路径提取压缩机排出空气; 并将提取的空气重新引入到燃烧器出口下游的工作流体路径。 本文还公开了一种与燃气轮机相关的装置，包括：压缩机部分，压缩机部分下游的一个或多个燃烧器，压缩机部分下游的涡轮部分; 以及至少一个管道，用于在燃烧区域之前从工作流体路径提取压缩机排放空气，并且响应于所述涡轮机处于关闭状态，将提取的空气重新引入到燃烧器出口下游的工作流体路径。

公开(公告)号：US20130230966A1

公开(公告)日：2013-09-05

申请号：US13410794

申请日：2012-03-02

Applicant: Devin Martin ,  Mark Brown

Inventor： Devin Martin ,  Mark Brown

IPC: H01L21/78

CPC classification number: H01L21/67092

Abstract: A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.

Abstract translation: 一种凸起包括器件晶片的处理方法，包括：粘合剂提供步骤，在载体晶片的环形槽中提供粘合剂，使得粘合剂从载体晶片的环形突起的上表面突出; 晶片安装步骤，通过所述粘合剂将所述器件晶片的前侧附着并固定到所述载体晶片的前侧，以便在执行所述粘合剂提供步骤之后容纳所述载体晶片的凹部中的凸起; 以及在进行晶片安装步骤之后，研磨或抛光器件晶片的背面的厚度减小步骤，以将器件晶片的厚度减小到预定厚度。

公开(公告)号：US20130023107A1

公开(公告)日：2013-01-24

申请号：US13185942

申请日：2011-07-19

Applicant: Devin Martin ,  Mark Brown

Inventor： Devin Martin ,  Mark Brown

IPC: H01L21/304

CPC classification number: H01L21/67132 ,  B24B7/228 ,  B24B19/022 ,  B24B37/042 ,  H01L21/67092 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54493 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.

Abstract translation: 一种处理器件晶片的方法包括载体晶片准备步骤，其准备载体晶片，该载体晶片在其表面上包括过量的载体区域，该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置， 所述载体晶片在所述凹部形成步骤之后，在所述粘合剂放置步骤之后，将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤， 晶片接合步骤，将载体晶片的表面和器件晶片的表面彼此接合，从而将器件晶片用粘合剂固定在载体晶片上，并且在晶片接合步骤之后，使设备变薄的变薄步骤 通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。

公开(公告)号：US06722852B1

公开(公告)日：2004-04-20

申请号：US10301703

申请日：2002-11-22

Applicant: Raymond Allan Wedlake ,  David Alan Meier ,  Devin Martin ,  Marvin Neeley

Inventor： Raymond Allan Wedlake ,  David Alan Meier ,  Devin Martin ,  Marvin Neeley

IPC: F01D514

CPC classification number: F01D5/141 ,  F05D2250/20 ,  F05D2250/70 ,  Y10S416/02

Abstract: Third stage turbine buckets have airfoil profiles substantially in accordance with Cartesian coordinate values of X, Y and Z set forth Table I wherein X and Y values are in inches and the Z values are non-dimensional values from 0 to 1 convertible to Z distances in inches by multiplying the Z values by the height of the airfoil in inches. The X, Y and Z distances may be scalable as a function of the same constant or number to provide a scaled up or scaled down airfoil section for the bucket. The nominal airfoil given by the X, Y and Z distances lies within an envelop of ±0.160 inches in directions normal to the surface of the airfoil.

Abstract translation: 第三级涡轮机叶片具有基本上符合X，Y和Z的笛卡尔坐标值的机翼型材，其中X和Y值为英寸，Z值为从0到1的可转换为Z距离的无量纲值 将Z值乘以翼型件的高度（英寸）。 X，Y和Z距离可以作为相同常数或数字的函数来缩放，以提供用于铲斗的放大或缩小的翼型部分。 由X，Y和Z距离给出的额定翼型在垂直于翼面表面的方向上在±0.160英寸的范围内。