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公开(公告)号：US20070125967A1
公开(公告)日：2007-06-07
申请号：US11607753
申请日：2006-11-30
IPC分类号： G21K5/10
CPC分类号： G03F1/16 , B82Y10/00 , B82Y40/00 , G03F1/78 , G06F17/50 , H01J37/3026 , H01J37/3174 , H01J2237/31762 , H01J2237/31788
摘要： A system and method for improved electron beam writing that is capable of taking design intent, equipment capability and design requirements into consideration. The system and method determines an optimal writing pattern based, at least in part, on the received information.
摘要翻译： 一种能够考虑设计意图，设备能力和设计要求的改进电子束写入的系统和方法。 该系统和方法至少部分地基于所接收的信息来确定最佳写入模式。
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公开(公告)号：US20100229148A1
公开(公告)日：2010-09-09
申请号：US12781887
申请日：2010-05-18
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/36 , G03F1/78 , H01J37/3174
摘要： Various embodiments of the present invention relate to particle beam writing to fabricate an integrated circuit on a wafer. In various embodiments, cell projection (CP) cell library information is stored in the form of a data structure. Subsequently, the CP cell library information is referenced by a writing system. The patterns are written on the wafer depending on the referenced CP cell library.
摘要翻译： 本发明的各种实施例涉及粒子束写入以在晶片上制造集成电路。 在各种实施例中，以数据结构的形式存储单元投影（CP）单元库信息。 随后，CP单元库信息由书写系统引用。 根据参考的CP单元库，将图案写在晶片上。
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公开(公告)号：US07747977B1
公开(公告)日：2010-06-29
申请号：US11226253
申请日：2005-09-15
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/36 , G03F1/78 , H01J37/3174
摘要： Various embodiments of the present invention relate to particle beam writing to fabricate an integrated circuit on a wafer. In various embodiments, cell projection (CP) cell library information is stored in the form of a data structure. Subsequently, the CP cell library information is referenced by a writing system. The patterns are written on the wafer depending on the referenced CP cell library.
摘要翻译： 本发明的各种实施例涉及粒子束写入以在晶片上制造集成电路。 在各种实施例中，以数据结构的形式存储单元投影（CP）单元库信息。 随后，CP单元库信息由书写系统引用。 根据参考的CP单元库，将图案写在晶片上。
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公开(公告)号：US08533640B2
公开(公告)日：2013-09-10
申请号：US13607708
申请日：2012-09-08
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/36 , G03F1/78 , H01J37/3174
摘要： Various embodiments of the present invention relate to particle beam writing to fabricate an integrated circuit on a wafer. In various embodiments, cell projection (CP) cell library information is stored in the form of a data structure. Subsequently, the CP cell library information is referenced by a writing system. The patterns are written on the wafer depending on the referenced CP cell library.
摘要翻译： 本发明的各种实施例涉及粒子束写入以在晶片上制造集成电路。 在各种实施例中，以数据结构的形式存储单元投影（CP）单元库信息。 随后，CP单元库信息由书写系统引用。 根据参考的CP单元库，将图案写在晶片上。
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5.发明申请Method, System, and Computer Program Product for Implementing a Direct Measurement Model for an Electronic Circuit Design 有权用于实现电子电路设计的直接测量模型的方法，系统和计算机程序产品公开(公告)号：US20090172616A1
公开(公告)日：2009-07-02
申请号：US11966979
申请日：2007-12-28
申请人： Dmitri Lapanik
发明人： Dmitri Lapanik
IPC分类号： G06F17/50
CPC分类号： H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Various embodiments of the present invention are generally directed to a method, system, and computer program product for implementing direct measurement model with simulation and calibration of manufacturing process model in the manufacturing of precision devices such as electronic integrated circuits. The method and the system determine the measured measurement result and the direct measurement information and compare the direct measurement information against the other to determine whether to adjust the process models and the empirical parameters thereof.
摘要翻译： 本发明的各种实施例通常涉及用于在制造诸如电子集成电路的精密装置的制造过程模型的仿真和校准中实现直接测量模型的方法，系统和计算机程序产品。 方法和系统确定测量的测量结果和直接测量信息，并将直接测量信息与另一个进行比较，以确定是否调整过程模型及其经验参数。
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公开(公告)号：US20110265049A1
公开(公告)日：2011-10-27
申请号：US13174830
申请日：2011-07-01
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/36 , G03F1/78 , H01J37/3174
摘要： Various embodiments of the present invention relate to particle beam writing to fabricate an integrated circuit on a wafer. In various embodiments, cell projection (CP) cell library information is stored in the form of a data structure. Subsequently, the CP cell library information is referenced by a writing system. The patterns are written on the wafer depending on the referenced CP cell library.
摘要翻译： 本发明的各种实施例涉及粒子束写入以在晶片上制造集成电路。 在各种实施例中，以数据结构的形式存储单元投影（CP）单元库信息。 随后，CP单元库信息由书写系统引用。 根据参考的CP单元库，将图案写在晶片上。
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公开(公告)号：US07777204B2
公开(公告)日：2010-08-17
申请号：US11607753
申请日：2006-11-30
CPC分类号： G03F1/16 , B82Y10/00 , B82Y40/00 , G03F1/78 , G06F17/50 , H01J37/3026 , H01J37/3174 , H01J2237/31762 , H01J2237/31788
摘要： A system and method for improved electron beam writing that is capable of taking design intent, equipment capability and design requirements into consideration. The system and method determines an optimal writing pattern based, at least in part, on the received information.
摘要翻译： 一种能够考虑设计意图，设备能力和设计要求的改进电子束写入的系统和方法。 该系统和方法至少部分地基于所接收的信息来确定最佳写入模式。
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公开(公告)号：US20130007675A1
公开(公告)日：2013-01-03
申请号：US13607708
申请日：2012-09-08
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/36 , G03F1/78 , H01J37/3174
摘要： Various embodiments of the present invention relate to particle beam writing to fabricate an integrated circuit on a wafer. In various embodiments, cell projection (CP) cell library information is stored in the form of a data structure. Subsequently, the CP cell library information is referenced by a writing system. The patterns are written on the wafer depending on the referenced CP cell library.
摘要翻译： 本发明的各种实施例涉及粒子束写入以在晶片上制造集成电路。 在各种实施例中，以数据结构的形式存储单元投影（CP）单元库信息。 随后，CP单元库信息由书写系统引用。 根据参考的CP单元库，将图案写在晶片上。
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9.发明授权Method, system, and computer program product for implementing a direct measurement model for an electronic circuit design 有权用于实现电子电路设计的直接测量模型的方法，系统和计算机程序产品公开(公告)号：US08078997B2
公开(公告)日：2011-12-13
申请号：US11966979
申请日：2007-12-28
申请人： Dmitri Lapanik
发明人： Dmitri Lapanik
IPC分类号： G06F17/50
CPC分类号： H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Various embodiments of the present invention are generally directed to a method, system, and computer program product for implementing direct measurement model with simulation and calibration of manufacturing process model in the manufacturing of precision devices such as electronic integrated circuits. The method and the system determine the measured measurement result and the direct measurement information and compare the direct measurement information against the other to determine whether to adjust the process models and the empirical parameters thereof.
摘要翻译： 本发明的各种实施例通常涉及用于在制造诸如电子集成电路的精密装置的制造过程模型的仿真和校准中实现直接测量模型的方法，系统和计算机程序产品。 方法和系统确定测量的测量结果和直接测量信息，并将直接测量信息与另一个进行比较，以确定是否调整过程模型及其经验参数。
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