摘要:
A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.
摘要:
Disclosed are a light emitting diode (LED) with high luminance and a method for manufacturing the same. The LED comprises a substrate, a first conductive clad layer formed on the substrate, an active layer formed on the first conductive clad layer, a second conductive clad layer formed on the active layer, an alumina (Al2O3) layer formed on the lower surface of the substrate, and an aluminum layer formed on the lower surface of the alumina (Al2O3) layer. Otherwise, the substrate is removed, the aluminum layer and the alumina layer are formed directly on the lower surface of the first conductive clad layer. Compared to a single reflective layer made of a metal, a reflective layer including the aluminum layer and the alumina layer improves reflective characteristics of the LED.
摘要翻译:公开了一种具有高亮度的发光二极管(LED)及其制造方法。 LED包括基板,形成在基板上的第一导电覆盖层,形成在第一导电覆层上的有源层,形成在有源层上的第二导电覆盖层,氧化铝(Al 2 O 3) O 3层)和形成在氧化铝的下表面上的铝层(Al 2 O 3 3 O 3) >)层。 否则,去除衬底,铝层和氧化铝层直接形成在第一导电覆层的下表面上。 与由金属制成的单个反射层相比,包括铝层和氧化铝层的反射层提高了LED的反射特性。
摘要:
According to a method of manufacturing a vertical nitride light emitting device, a first conductivity type nitride layer, an active layer and a second conductivity type nitride layer are sequentially grown on a preliminary growth substrate to form a light emission structure. The light emission structure is cut according to a final size of light emitting devices, leaving a predetermined thickness of the first conductivity type nitride layer intact. A permanent conductive substrate is provided on the light emission structure and the preliminary substrate is diced into a plurality of units. Laser beam is irradiated to detach the preliminary substrate, thereby separating the light emission structure according to the size of the light emitting devices. First and second contacts are formed on the first conductivity type nitride layer and the permanent conductive substrate, respectively. The permanent conductive substrate is diced to complete individual light emitting devices.