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公开(公告)号：US20230112086A1
公开(公告)日：2023-04-13
申请号：US17865683
申请日：2022-07-15
申请人： Envista
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62
摘要： In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
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公开(公告)号：US20210025574A1
公开(公告)日：2021-01-28
申请号：US17068696
申请日：2020-10-12
发明人： Brian L. Wilt , James Onderak , Owen J. Gill , Shane Siegel
IPC分类号： F21V21/084 , F21V21/002 , F21V21/088 , F21V23/04 , F21V33/00 , G02C7/08 , G02C11/04 , A61B90/11 , F21L4/02
摘要： A user-wearable illumination assembly comprising eyeglass frames supporting a pair of lenses, a mounting structure on a bridge of the eyeglass frames, a headlamp removably coupled to the mounting structure, a battery housing removably coupled to the headlamp, and a battery inside the battery housing.
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公开(公告)号：US11739223B2
公开(公告)日：2023-08-29
申请号：US17740350
申请日：2022-05-10
申请人： Envista
发明人： Byung Jun Ahn , Bruce H. Lipshutz , Sam L. Nguyen
IPC分类号： C09D7/63 , C09D5/00 , A61K6/65 , A61K6/20 , A61K6/62 , A61K6/78 , B05D3/00 , B05D3/10 , C07C69/01 , C07C205/42 , C07C205/43 , C07C235/06 , C07C235/20 , C07C271/16 , C07D217/16 , C07F7/08 , C07F9/12 , C07F9/62 , C08K5/107 , C08K5/13
CPC分类号： C09D5/002 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/002 , B05D3/10 , B05D3/107 , C07C69/01 , C07C205/42 , C07C205/43 , C07C235/06 , C07C235/20 , C07C271/16 , C07D217/16 , C07F7/0896 , C07F9/12 , C07F9/62 , C09D7/63 , C08K5/107 , C08K5/13
摘要： In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.-
公开(公告)号：US11453790B2
公开(公告)日：2022-09-27
申请号：US16877097
申请日：2020-05-18
申请人： Envista
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62 , C08K5/13 , C08K5/107
摘要： In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
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公开(公告)号：US20230103027A1
公开(公告)日：2023-03-30
申请号：US17740350
申请日：2022-05-10
申请人： Envista
发明人： Byung Jun Ahn , Bruce H. Lipshutz , Sam L. Nguyen
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62
摘要： In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
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公开(公告)号：US11352512B2
公开(公告)日：2022-06-07
申请号：US16877058
申请日：2020-05-18
申请人： Envista
发明人： Byung Jun Ahn , Bruce H. Lipshutz , Sam L. Nguyen
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62 , C08K5/13 , C08K5/107
摘要： In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
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公开(公告)号：US20200347248A1
公开(公告)日：2020-11-05
申请号：US16877097
申请日：2020-05-18
申请人： Envista
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62
摘要： In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
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公开(公告)号：US20200347247A1
公开(公告)日：2020-11-05
申请号：US16877058
申请日：2020-05-18
申请人： Envista
发明人： Byung Jun Ahn , Bruce H. Lipshutz , Sam L. Nguyen
IPC分类号： C09D7/63 , C09D5/00 , C07C205/43 , A61K6/20 , A61K6/62 , A61K6/65 , A61K6/78 , B05D3/10 , C07C69/01 , C07C205/42 , C07C235/06 , C07C271/16 , C07F7/08 , C07F9/12 , B05D3/00 , C07C235/20 , C07D217/16 , C07F9/62
摘要： In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
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